公开(公告)号：US20090004777A1

公开(公告)日：2009-01-01

申请号：US12124880

申请日：2008-05-21

申请人： Ravi Kanth Kolan ,  Anthony Sun Yi-Sheng ,  Liu Hao ,  Toh Chin Hock

发明人： Ravi Kanth Kolan ,  Anthony Sun Yi-Sheng ,  Liu Hao ,  Toh Chin Hock

IPC分类号： H01L21/00

CPC分类号： H01L25/0657 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541

摘要： A method of manufacturing a plurality of stacked die semiconductor packages, including: attaching a second silicon wafer to a first silicon wafer, wherein the second silicon wafer has a plurality of open vias; attaching a third silicon wafer to the second silicon wafer, wherein the third silicon wafer has a plurality of open vias, and the open vias of the second and third silicon wafers are aligned with one another; etching a bonding material that attaches the wafers from the aligned open vias; filling the aligned open vias with a conductor; forming conductive bumps at open ends of the aligned open vias; back grinding the first silicon wafer; separating the stacked semiconductor dies from each other; attaching the bump end of the stacked semiconductor dies onto a substrate; encapsulating the stacked semiconductor dies and substrate; and singulating the encapsulated assembly.

摘要翻译： 一种制造多个堆叠管芯半导体封装的方法，包括：将第二硅晶片连接到第一硅晶片，其中所述第二硅晶片具有多个开口; 将第三硅晶片附接到所述第二硅晶片，其中所述第三硅晶片具有多个开放通孔，并且所述第二和第三硅晶片的所述开放通孔彼此对准; 蚀刻从对准的开放通孔连接晶片的接合材料; 用导体填充对齐的开放通孔; 在对齐的开放通孔的开口端形成导电凸块; 背面研磨第一个硅晶片; 将堆叠的半导体管芯彼此分离; 将堆叠的半导体管芯的凸起端附接到基板上; 封装堆叠的半导体管芯和衬底; 并分离封装的组件。

公开(公告)号：US09865440B1

公开(公告)日：2018-01-09

申请号：US12955851

申请日：2010-11-29

申请人： Stan Kassela ,  Wei Xu ,  Lim Boon Leong ,  Liu Hao Jun ,  Chun Wai Tong ,  Weilu H. Xu ,  Thomas Larson Greenberg ,  Antonio Javier Zambano ,  Robin Andrew Davies

发明人： Stan Kassela ,  Wei Xu ,  Lim Boon Leong ,  Liu Hao Jun ,  Chun Wai Tong ,  Weilu H. Xu ,  Thomas Larson Greenberg ,  Antonio Javier Zambano ,  Robin Andrew Davies

IPC分类号： H01J37/34 ,  C23C14/34

CPC分类号： H01J37/3447 ,  C23C14/3407 ,  C23C14/35 ,  H01J37/3405

摘要： A sputtering apparatus includes a sputtering cathode and a target overlying the sputtering cathode. A shield overlies the target and forms an aperture configured to direct sputtering particles onto a substrate. The shield includes a lower shield portion overlying the target, a channel outlet overlying the lower shield portion, and an upper shield portion overlying the channel. In some embodiments the shield includes a first shield and a second shield. The first shield includes a front gas injection outlet. The second shield overlies the first shield and forms the aperture. In various embodiments, the second shield is operable to adjust plasma confinement between the first shield and the second shield.

公开(公告)号：US07471827B2

公开(公告)日：2008-12-30

申请号：US10688471

申请日：2003-10-16

申请人： Xing Xie ,  Wei-Ying Ma ,  Hong-Jiang Zhang ,  Liu Hao

发明人： Xing Xie ,  Wei-Ying Ma ,  Hong-Jiang Zhang ,  Liu Hao

IPC分类号： G06K9/34

CPC分类号： G06F17/30905

摘要： Systems and methods for automatic generation of a browsing path across image content to present areas with high attention value are described. In particular, an image is modeled via multiple visual attentions to create a respective set of attention objects for each modeled attention. The attention objects and their respective attributes are analyzed to generate a browsing path to select ones of the attention objects. The browsing path is generated to optimize the rate of information gain from the attention objects as a function of information unit cost in terms of time constraints associated with multiple image browsing modes.

摘要翻译： 描述了跨越图像内容自动生成浏览路径以呈现具有高注意力值的区域的系统和方法。 特别地，通过多个视觉注意来建模图像，以为每个建模的注意创建相应的一组关注对象。 分析注意对象及其各自的属性，生成浏览路径以选择注意对象。 生成浏览路径以根据与多个图像浏览模式相关联的时间约束来优化来自注意对象的信息增益的速率作为信息单元成本的函数。

公开(公告)号：US06921974B2

公开(公告)日：2005-07-26

申请号：US10400803

申请日：2003-03-28

申请人： Tan Hien Boon ,  Liu Hao ,  Park Soo Gil

发明人： Tan Hien Boon ,  Liu Hao ,  Park Soo Gil

IPC分类号： H01L23/433 ,  H01L23/495 ,  H01L23/34

CPC分类号： H01L23/4334 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/00014 ,  H01L2924/00

摘要： A plastic ball grid array package has a heat slug which is placed onto the substrate, which has the semiconductor device attached, prior to encapsulation. The heat transfer member is initially located by guide pins and fixed in place by the encapsulation.

摘要翻译： 塑料球栅阵列封装具有在封装之前放置在具有半导体器件的衬底上的散热块。 传热构件最初由引导销定位，并通过封装固定就位。

公开(公告)号：US20050084136A1

公开(公告)日：2005-04-21

申请号：US10688471

申请日：2003-10-16

申请人： Xing Xie ,  Wei-Ying Ma ,  Hong-Jiang Zhang ,  Liu Hao

发明人： Xing Xie ,  Wei-Ying Ma ,  Hong-Jiang Zhang ,  Liu Hao

IPC分类号： G06F17/30 ,  G06K9/00

CPC分类号： G06F17/30905

摘要： Systems and methods for automatic generation of a browsing path across image content to present areas with high attention value are described. In particular, an image is modeled via multiple visual attentions to create a respective set of attention objects for each modeled attention. The attention objects and their respective attributes are analyzed to generate a browsing path to select ones of the attention objects. The browsing path is generated to optimize the rate of information gain from the attention objects as a function of information unit cost in terms of time constraints associated with multiple image browsing modes.

摘要翻译： 描述了跨越图像内容自动生成浏览路径以呈现具有高注意力值的区域的系统和方法。 特别地，通过多个视觉注意来建模图像，以为每个建模的注意创建相应的一组关注对象。 分析注意对象及其各自的属性，生成浏览路径以选择注意对象。 生成浏览路径以根据与多个图像浏览模式相关联的时间约束来优化来自注意对象的信息增益的速率作为信息单元成本的函数。

公开(公告)号：US07824960B2

公开(公告)日：2010-11-02

申请号：US12124830

申请日：2008-05-21

申请人： Liu Hao ,  Ravi Kanth Kolan

发明人： Liu Hao ,  Ravi Kanth Kolan

IPC分类号： H01L21/00

CPC分类号： H01L24/14 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0554 ,  H01L2224/05573 ,  H01L2224/10135 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/14505 ,  H01L2224/17517 ,  H01L2224/81002 ,  H01L2224/8112 ,  H01L2224/81136 ,  H01L2224/81139 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06593 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method of manufacturing a plurality of stacked die semiconductor packages, including: placing a phase change material between a top surface of a substrate and a bottom surface of a first die; placing a phase change material between a top surface of the first die and a bottom surface of a second die; wherein the first and second dies have a plurality of conductive protrusions on the bottom surfaces of the dies; wherein the first die has a plurality of conductive vias extending from its conductive protrusions, through the first die, to the top surface of the first die; wherein the conductive vias of said first die are in alignment with the conductive protrusions of the second die; and heating the dies and the substrate to cause the second die to become electrically interconnected to the first die and the first die to become electrically connected to the substrate.

摘要翻译： 一种制造多个堆叠裸片半导体封装的方法，包括：将相变材料放置在基板的顶表面和第一管芯的底表面之间; 将相变材料放置在第一管芯的顶表面和第二管芯的底表面之间; 其中所述第一和第二模具在所述模具的底表面上具有多个导电突起; 其中所述第一管芯具有从其导电突起延伸通过所述第一管芯到所述第一管芯的顶表面的多个导电通孔; 其中所述第一管芯的导电通孔与第二管芯的导电突起对准; 并且对所述管芯和所述基板进行加热，以使所述第二管芯与所述第一管芯和所述第一管芯电连接以与所述基板电连接。

公开(公告)号：US07883938B2

公开(公告)日：2011-02-08

申请号：US12124880

申请日：2008-05-21

申请人： Ravi Kanth Kolan ,  Anthony Sun Yi Sheng ,  Liu Hao ,  Toh Chin Hock

发明人： Ravi Kanth Kolan ,  Anthony Sun Yi Sheng ,  Liu Hao ,  Toh Chin Hock

IPC分类号： H01L21/00

CPC分类号： H01L25/0657 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541

摘要： A method of manufacturing a plurality of stacked die semiconductor packages, including: attaching a second silicon wafer to a first silicon wafer, wherein the second silicon wafer has a plurality of open vias; attaching a third silicon wafer to the second silicon wafer, wherein the third silicon wafer has a plurality of open vias, and the open vias of the second and third silicon wafers are aligned with one another; etching a bonding material that attaches the wafers from the aligned open vias; filling the aligned open vias with a conductor; forming conductive bumps at open ends of the aligned open vias; back grinding the first silicon wafer; separating the stacked semiconductor dies from each other; attaching the bump end of the stacked semiconductor dies onto a substrate; encapsulating the stacked semiconductor dies and substrate; and singulating the encapsulated assembly.

摘要翻译： 一种制造多个堆叠管芯半导体封装的方法，包括：将第二硅晶片连接到第一硅晶片，其中所述第二硅晶片具有多个开口; 将第三硅晶片附接到所述第二硅晶片，其中所述第三硅晶片具有多个开放通孔，并且所述第二和第三硅晶片的所述开放通孔彼此对准; 蚀刻从对准的开放通孔连接晶片的接合材料; 用导体填充对齐的开放通孔; 在对齐的开放通孔的开口端形成导电凸块; 背面研磨第一个硅晶片; 将堆叠的半导体管芯彼此分离; 将堆叠的半导体管芯的凸起端附接到基板上; 封装堆叠的半导体管芯和衬底; 并分离封装的组件。

公开(公告)号：US20080293186A1

公开(公告)日：2008-11-27

申请号：US12124830

申请日：2008-05-21

申请人： Liu Hao ,  Ravi Kanth Kolan

发明人： Liu Hao ,  Ravi Kanth Kolan

IPC分类号： H01L21/58

CPC分类号： H01L24/14 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0554 ,  H01L2224/05573 ,  H01L2224/10135 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/14505 ,  H01L2224/17517 ,  H01L2224/81002 ,  H01L2224/8112 ,  H01L2224/81136 ,  H01L2224/81139 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06593 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method of manufacturing a plurality of stacked die semiconductor packages, including: placing a phase change material between a top surface of a substrate and a bottom surface of a first die; placing a phase change material between a top surface of the first die and a bottom surface of a second die; wherein the first and second dies have a plurality of conductive protrusions on the bottom surfaces of the dies; wherein the first die has a plurality of conductive vias extending from its conductive protrusions, through the first die, to the top surface of the first die; wherein the conductive vias of said first die are in alignment with the conductive protrusions of the second die; and heating the dies and the substrate to cause the second die to become electrically interconnected to the first die and the first die to become electrically connected to the substrate.

摘要翻译： 一种制造多个堆叠裸片半导体封装的方法，包括：将相变材料放置在基板的顶表面和第一管芯的底表面之间; 将相变材料放置在第一管芯的顶表面和第二管芯的底表面之间; 其中所述第一和第二模具在所述模具的底表面上具有多个导电突起; 其中所述第一管芯具有从其导电突起延伸通过所述第一管芯到所述第一管芯的顶表面的多个导电通孔; 其中所述第一管芯的导电通孔与第二管芯的导电突起对准; 并且对所述管芯和所述基板进行加热，以使所述第二管芯与所述第一管芯和所述第一管芯电连接以与所述基板电连接。