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公开(公告)号:US12289048B2
公开(公告)日:2025-04-29
申请号:US17717426
申请日:2022-04-11
Inventor: Ryota Kojima , Akihiro Yamaguchi
IPC: H01L23/00 , H01L23/498 , H01L23/64 , H02M1/44 , H02M3/00
Abstract: A semiconductor module includes a substrate, a semiconductor package disposed to the substrate, a housing to which the substrate is fixed, and a Y capacitor. A front-surface wiring in the substrate includes a front-surface ground wiring electrically connected to the housing, and a front-surface main wiring connected to a rear-surface wiring that is connected to the semiconductor package. The Y capacitor is disposed on a front surface of the substrate at a position facing the semiconductor package and between the front-surface ground wiring and the front-surface main wiring. The semiconductor package and the Y capacitor are disposed in such a manner that a direction of electric current flowing in the semiconductor package and a direction of electric current flowing in the Y capacitor are opposite to each other.
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公开(公告)号:US12278170B2
公开(公告)日:2025-04-15
申请号:US17846371
申请日:2022-06-22
Inventor: Hiroshi Ishino , Hirokazu Sampei , Katsuya Kumagai , Koji Doi
IPC: H01L23/495 , H01L23/31
Abstract: A semiconductor module includes a resin molded part encapsulating a semiconductor chip, a first terminal having a plate shape, and a second terminal having a plate shape. The first terminal and the second terminal are disposed on top of the other in a thickness direction. The first terminal is exposed from a first surface of the resin molded part, and the second terminal is projected from a second surface of the resin molded part to an outside of the resin molded part, the second surface being different from the first surface from which the first terminal is exposed.
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公开(公告)号:US20250102545A1
公开(公告)日:2025-03-27
申请号:US18825286
申请日:2024-09-05
Inventor: Shogo KAWAHARA , Yoshikazu FURUTA , Tomohiro NEZUKA
Abstract: A shunt-based current sensor executes redundancy detection of a load current flowing through a load by using a shunt resistor. The shunt-based current sensor includes a reference resistor, a current excitation circuit, at least two voltage measurement circuits and a signal processing circuit. The reference resistor is connected to the shunt resistor in series. The current excitation circuit generates an AC excitation current and supply the AC excitation current to the shunt resistor and the reference resistor. At least two voltage measurement circuits measure a voltage across the shunt resistor. A signal processing circuit executes signal processing based on respective measurement voltages of the at least two voltage measurement circuits, and is operated in the load current redundancy detection mode or a shunt resistance measurement mode.
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公开(公告)号:US12261048B2
公开(公告)日:2025-03-25
申请号:US17972626
申请日:2022-10-25
Inventor: Takashi Ishida
IPC: H01L21/268 , H01L21/78 , H01L21/326
Abstract: A method for manufacturing a semiconductor device includes: irradiating, with laser light, a semiconductor substrate having a p-type first semiconductor layer and an n-type second semiconductor layer so that the laser light converges on an interface between the first semiconductor layer and the second semiconductor layer, wherein each of the p-type first semiconductor layer and the n-type second semiconductor layer placed on the first semiconductor layer is formed of a compound semiconductor; and separating the semiconductor substrate into the first semiconductor layer and the second semiconductor layer along the interface.
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公开(公告)号:US12254214B2
公开(公告)日:2025-03-18
申请号:US18475359
申请日:2023-09-27
Inventor: Tetsuro Takizawa
Abstract: An input output control device between a verification circuit and a semiconductor memory device includes: a first port that receives a read transaction for requesting reading of data in the semiconductor memory device from the verification circuit, and outputs a read response to the verification circuit; a second port that outputs the read transaction to the semiconductor memory device, and receives the read response output from the semiconductor memory device in response to the read transaction; and a buffer device that delays at least one of an output of the read transaction to the semiconductor memory device and an output of the read response to the verification circuit.
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公开(公告)号:US20250085418A1
公开(公告)日:2025-03-13
申请号:US18764592
申请日:2024-07-05
Inventor: MASATAKA HIRAI
IPC: G01S13/931
Abstract: A vehicle position estimating device includes a coordinates obtaining unit, a map information obtaining unit, a surrounding information obtaining unit, a vehicle position estimating unit, a relative position estimating unit, and a correcting unit. The coordinates obtaining unit obtains coordinates of a first vehicle. The map information obtaining unit obtains map information including the coordinates obtained by the coordinates obtaining unit. The surrounding information obtaining unit obtains surrounding information indicating a reference around the first vehicle that is detected by a surrounding sensor. The vehicle position estimating unit estimates a first vehicle position using the map information and the surrounding information. The relative position estimating unit estimates a relative position of a second vehicle around the first vehicle with respect to the first vehicle. The correcting unit corrects the first vehicle position using the relative position and a second vehicle position obtained from the second vehicle.
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公开(公告)号:US20250052778A1
公开(公告)日:2025-02-13
申请号:US18669671
申请日:2024-05-21
Inventor: ATSUSHI NARISHIGE , SAKON YAMAMOTO
IPC: G01P13/00
Abstract: A movement amount estimation device includes an external movement amount acquisition unit configured to acquire an external movement amount as a movement amount of a moving body using external information, an internal movement amount acquisition unit configured to acquire an internal movement amount as the movement amount of the moving body using internal information, and a movement amount estimation unit configured to estimate the movement amount of the moving body using at least one of the external movement amount and the internal movement amount. The movement amount estimation unit is further configured to acquire a difference between the external movement amount and the internal movement amount, and determine whether to use the external movement amount or the internal movement amount to estimate the movement amount depending on whether the difference is equal to or less than a predetermined threshold value.
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公开(公告)号:US12192701B2
公开(公告)日:2025-01-07
申请号:US17887044
申请日:2022-08-12
Inventor: Hiromichi Kato , Nobuyuki Otake , Takashi Inoue , Takayuki Shibata
IPC: H04R17/00
Abstract: An ultrasonic generator has a speaker element having a first resonance frequency and a speaker element having a second resonance frequency. The first resonance frequency and the second resonance frequency are adjacent resonance frequencies in the speaker. The distance between the elements is set so that the sound from the first speaker element and the sound from the second speaker element have a predetermined relationship at a target position. The target position is two or more positions on the object located in the target space. A predetermined relationship is a relationship in which a sound from the first speaker element and a sound from the second speaker element strengthen each other at an intermediate frequency between the first resonance frequency and the second resonance frequency.
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公开(公告)号:US12154963B2
公开(公告)日:2024-11-26
申请号:US17830690
申请日:2022-06-02
Inventor: Hiroki Tsuma
IPC: H01L29/49 , H01L29/423
Abstract: An aluminum alloy film includes an Al—Si—Mg alloy film containing at least 0.9% by weight to 1.1% by weight of Si and 0.1% by weight to 2.3% by weight of Mg, and the Al—Si—Mg alloy film contains Mg silicide crystals in Al crystals. A semiconductor device includes multiple gate trench structures, an interlayer insulating film covering the trench gate structures, an electrode film covering the interlayer insulating film, an insulating layer and a conductive layer covering the electrode film. The electrode film includes the Al—Si—Mg alloy film.
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公开(公告)号:US20240385383A1
公开(公告)日:2024-11-21
申请号:US18415910
申请日:2024-01-18
Inventor: YUKI KAMATA , TOSHIHIRO ODA
Abstract: An optical antenna includes a waveguide for propagating light, when a direction in which the waveguide extends is defined as a first direction, a direction perpendicular to the first direction is defined as a second direction, and a direction perpendicular to both the first direction and the second direction is defined as a third direction, a first diffraction grating group having a plurality of first diffraction gratings arranged at a predetermined period in the first direction on both sides of the waveguide in the second direction, and a second diffraction grating group having a plurality of second diffraction gratings arranged at a same period as the first diffraction grating in the first direction on both sides of the waveguide in the second direction. The first diffraction grating and the second diffraction grating have different centroid positions in the first direction and the third direction.
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