公开(公告)号：US20070084629A1

公开(公告)日：2007-04-19

申请号：US11538823

申请日：2006-10-05

申请人： William Bernier ,  Marie Cole ,  Mukta Farooq ,  John Knickerbocker ,  Tasha Lopez ,  Roger Quon ,  David Welsh

发明人： William Bernier ,  Marie Cole ,  Mukta Farooq ,  John Knickerbocker ,  Tasha Lopez ,  Roger Quon ,  David Welsh

IPC分类号： H05K1/16

CPC分类号： H05K3/321 ,  H01L24/05 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/05557 ,  H01L2224/13076 ,  H01L2224/13078 ,  H01L2224/1308 ,  H01L2224/131 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/13339 ,  H01L2224/13464 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H05K2201/0212 ,  H05K2201/0248 ,  H05K2201/0373 ,  H05K2201/1025 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/00015 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： Disclosed is a laminated (or non-laminated) conductive interconnection for joining an integrated circuit device to a device carrier, where the conductive interconnection comprises alternating metal layers and polymer layers. In addition, the polymer can include dendrites, metal projections from the carrier or device, and/or micelle brushes on the outer portion of the polymer. The polymer layers include metal particles and the alternating metal layers and polymer layers form either a cube-shaped structure or a cylinder-shaped structure.

摘要翻译： 公开了用于将集成电路器件连接到器件载体的层压（或非层叠）导电互连，其中导电互连包括交替的金属层和聚合物层。 此外，聚合物可以包括枝晶，来自载体或器件的金属突起，和/或聚合物外部的胶束刷。 聚合物层包括金属颗粒，并且交替的金属层和聚合物层形成立方体结构或圆柱形结构。

公开(公告)号：US20070007665A1

公开(公告)日：2007-01-11

申请号：US11160669

申请日：2005-07-05

申请人： Lawrence Clevenger ,  Mukta Farooq ,  Louis Hsu ,  William Landers ,  Donna Zupanski-Nielsen ,  Carl Radens ,  Chih-Chao Yang

发明人： Lawrence Clevenger ,  Mukta Farooq ,  Louis Hsu ,  William Landers ,  Donna Zupanski-Nielsen ,  Carl Radens ,  Chih-Chao Yang

IPC分类号： H01L23/48

CPC分类号： H05K3/3436 ,  H01L23/13 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/11 ,  H01L24/12 ,  H01L24/17 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/06102 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/1403 ,  H01L2224/49109 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H05K2201/094 ,  H05K2201/09736 ,  H05K2201/09845 ,  Y02P70/613 ,  H01L2224/29099 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electrical structure and method comprising a first substrate electrically and mechanically connected to a second substrate. The first substrate comprises a first electrically conductive pad and a second electrically conductive pad. The second substrate comprises a third electrically conductive pad, a fourth electrically conductive pad, and a first electrically conductive member. The fourth electrically conductive pad comprises a height that is different than a height of the first electrically conductive member. The electrically conductive member is electrically and mechanically connected to the fourth electrically conductive pad. A first solder ball connects the first electrically conductive pad to the third electrically conductive pad. The first solder ball comprises a first diameter. A second solder ball connects the second electrically conductive pad to the first electrically conductive member. The second solder ball comprises a second diameter. The first diameter is greater than said second diameter.

公开(公告)号：US20060200965A1

公开(公告)日：2006-09-14

申请号：US10906816

申请日：2005-03-08

申请人： Mukta Farooq ,  Harvey Hamel

发明人： Mukta Farooq ,  Harvey Hamel

IPC分类号： B23K31/02

CPC分类号： H05K3/3494 ,  B23K1/018 ,  B23K2101/40 ,  H01L24/98 ,  H01L2224/81222 ,  H01L2224/81234 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H05K1/0212 ,  H05K3/3436 ,  H05K2203/176 ,  Y10T29/49144 ,  Y10T29/49721 ,  Y10T29/49815 ,  Y10T29/49819 ,  Y10T29/49821 ,  H01L2924/00

摘要： A method and electrical structure for separating electronic components from one another joined by solder interconnections. An electronic module is joined to a substrate via a solder interconnection, whereby the electronic module has an electrical heating component residing within a bottom layer thereof adjacent a solder interconnection. Preferably, a chip carrier is joined to a board whereby the chip carrier has an electrical mesh plane for heating adjacent the solder interconnection. Resistive heat is generated within this electrical heating component either by applying an electrical current to the electrical heating component, or by non-contact inductively heating the layer in which such electrical heating component resides to generate resistive heat within the electrical heating component. The resistive heat is transferred to the solder interconnection to allow for localized melting of the solder interconnection and removal of the electronic components from one another.

摘要翻译： 一种用于将电子部件彼此分离以通过焊料互连连接的方法和电气结构。 电子模块通过焊料互连连接到基板，由此电子模块具有驻留在其邻近焊料互连的底层内的电加热部件。 优选地，芯片载体连接到板，由此芯片载体具有用于在焊料互连附近加热的电网平面。 通过向电加热部件施加电流，或通过非接触感应加热这种电加热部件所在的层以在电加热部件内产生电阻热，在该电加热部件内产生电阻热。 电阻热转移到焊料互连以允许焊料互连的局部熔化和电子部件相互之间的移除。

公开(公告)号：US20070271775A1

公开(公告)日：2007-11-29

申请号：US11838946

申请日：2007-08-15

申请人： Mukta Farooq ,  Ray Jackson ,  David Linnell ,  Frank Pompeo

发明人： Mukta Farooq ,  Ray Jackson ,  David Linnell ,  Frank Pompeo

IPC分类号： B23P19/00

CPC分类号： H01L21/67092 ,  H01L24/81 ,  H01L2224/81801 ,  H01L2924/01322 ,  H01L2924/14 ,  H05K13/0486 ,  Y10T29/49144 ,  Y10T29/49755 ,  Y10T29/49757 ,  Y10T29/53091 ,  Y10T29/53261 ,  Y10T29/53274 ,  Y10T29/53404 ,  H01L2924/00

摘要： Disclosed is an apparatus for separating interconnects between, for example, a card and a substrate. The apparatus includes one or more rotationally biased (e.g., spring-loaded, etc.) partial-circle structures (e.g., blades, squeegee, plow, etc.) and one or more temperature-sensitive releases connected to the partial-circle structures. The partial-circle structures are positioned to rotate and separate the interconnects when released by the temperature-sensitive releases. The invention can also include solder reservoirs positioned to receive solder from the interconnects separated by the partial-circle structures.

摘要翻译： 公开了一种用于分离例如卡和基板之间的互连的装置。 该装置包括一个或多个旋转偏置（例如，弹簧加载等）部分圆形结构（例如，叶片，刮板，犁等）和连接到部分圆形结构的一个或多个温度敏感的释放。 当由温度敏感的释放释放时，部分圆形结构被定位成旋转和分离互连。 本发明还可以包括定位成从由部分圆形结构分开的互连件接收焊料的焊料储存器。

公开(公告)号：US20070252288A1

公开(公告)日：2007-11-01

申请号：US11772901

申请日：2007-07-03

申请人： MUKTA FAROOQ ,  John Knickerbocker ,  Frank Pompeo ,  Subhash Shinde

发明人： MUKTA FAROOQ ,  John Knickerbocker ,  Frank Pompeo ,  Subhash Shinde

IPC分类号： H01L23/48 ,  H01L21/00

CPC分类号： H01L23/562 ,  H01L21/563 ,  H01L23/36 ,  H01L23/49827 ,  H01L24/75 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/73253 ,  H01L2924/01004 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/16195

摘要： Under the present invention, a semiconductor chip is electrically connected to a substrate (e.g., organic, ceramic, etc.) by an interposer structure. The interposer structure comprises an elastomeric, compliant material that includes metallurgic through connections having a predetermined shape. In a typical embodiment, the metallurgical through connections electrically connect an under bump metallization of the semiconductor chip to a top surface metallization of the substrate. By utilizing the interposer structure in accordance with the present invention, the problems associated with previous semiconductor module designs are alleviated.

摘要翻译： 在本发明中，半导体芯片通过插入件结构与基板（例如有机，陶瓷等）电连接。 插入器结构包括弹性体柔性材料，其包括具有预定形状的通过连接的冶金。 在典型的实施例中，冶金通孔连接将半导体芯片的凸起下金属化电连接到衬底的顶表面金属化。 通过利用根据本发明的插入器结构，可以减轻与先前的半导体模块设计相关的问题。

公开(公告)号：US20070187828A1

公开(公告)日：2007-08-16

申请号：US11307600

申请日：2006-02-14

申请人： Mukta Farooq ,  Robert Hannon ,  Ian Melville ,  Donna Zupanski-Nielsen

发明人： Mukta Farooq ,  Robert Hannon ,  Ian Melville ,  Donna Zupanski-Nielsen

IPC分类号： H01L23/52

CPC分类号： H01L23/53295 ,  H01L21/76801 ,  H01L23/5329 ,  H01L2924/0002 ,  H01L2924/00

摘要： An integrated circuit (IC) chip and related package are disclosed including a first interlevel dielectric (ILD) layer(s) including an ultra low dielectric constant (ULK) material, a second ILD layer(s) including a silicon dioxide (SiO2) based dielectric material above the first ILD layer(s), and a transitional ILD layer including an intermediate dielectric constant material. The transitional ILD layer is positioned directly below a lowermost one of the second ILD layer(s), excepting any isolation layer, which represents the layer most susceptible to failure. The intermediate dielectric constant material can have a dielectric constant and an elastic modulus greater than that of the ULK material and less than that of the SiO2 based dielectric material. Hence, the intermediate dielectric constant provides adequate electrical properties, but also absorbs more of the stress than the typical ULK material, which reduces the likelihood of failure. A method of forming the IC chip is also disclosed.

摘要翻译： 公开了一种集成电路（IC）芯片和相关封装，其包括包括超低介电常数（ULK）材料的第一层间介电层（ILD）层，包括二氧化硅（SiO _{2 基介电材料，以及包含中间介电常数材料的过渡ILD层。 过渡ILD层直接位于第二ILD层的最下面之一之外，除了任何隔离层，其代表最易受故障的层。 中间介电常数材料可以具有比ULK材料的介电常数和弹性模量更大的弹性模量，并且小于基于SiO 2的介电材料的弹性模量。 因此，中间介电常数提供足够的电气性能，但也比典型的ULK材料吸收更多的应力，这降低了失效的可能性。 还公开了一种形成IC芯片的方法。}

公开(公告)号：US20060104031A1

公开(公告)日：2006-05-18

申请号：US10904555

申请日：2004-11-16

申请人： Evan Colgan ,  Frank Pompeo ,  Glenn Daves ,  Hilton Toy ,  Bruce Furman ,  David Edwards ,  Michael Gaynes ,  Mukta Farooq ,  Sung Kang ,  Steven Ostrander ,  Jaimal Williamson ,  Da-Yuan Shih ,  Donald Henderson

发明人： Evan Colgan ,  Frank Pompeo ,  Glenn Daves ,  Hilton Toy ,  Bruce Furman ,  David Edwards ,  Michael Gaynes ,  Mukta Farooq ,  Sung Kang ,  Steven Ostrander ,  Jaimal Williamson ,  Da-Yuan Shih ,  Donald Henderson

IPC分类号： H05K7/20

CPC分类号： H01L23/4735 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2224/0401

摘要： A cooling system for an electronic component on a component carrier is provided. The system includes a frame, a spray manifold, and a sealing member. The frame has an opening and is connectable to the component carrier so that an annular area is defined between the opening and the electronic component. The spray manifold is sealed over the opening to define a spray area over a back surface of the electronic component. The spray manifold sprays a cooling fluid on the back surface. The sealing member seals the annular region so that input/output connectors on the component carrier are isolated from the cooling fluid.

摘要翻译： 提供了一种用于组件载体上的电子部件的冷却系统。 该系统包括框架，喷雾歧管和密封构件。 框架具有开口并且可连接到部件载体，使得在开口和电子部件之间限定环形区域。 喷雾歧管被密封在开口上以限定电子部件的后表面上方的喷射区域。 喷雾歧管在后表面喷洒冷却液。 密封构件密封环形区域，使得部件载体上的输入/输出连接器与冷却流体隔离。

公开(公告)号：US20060043608A1

公开(公告)日：2006-03-02

申请号：US10711185

申请日：2004-08-31

申请人： William Bernier ,  Marie Cole ,  Mukta Farooq ,  John Knickerbocker ,  Tasha Lopez ,  Roger Quon ,  David Welsh

发明人： William Bernier ,  Marie Cole ,  Mukta Farooq ,  John Knickerbocker ,  Tasha Lopez ,  Roger Quon ,  David Welsh

IPC分类号： H01L23/48

CPC分类号： H05K3/321 ,  H01L24/05 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/05557 ,  H01L2224/13076 ,  H01L2224/13078 ,  H01L2224/1308 ,  H01L2224/131 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/13339 ,  H01L2224/13464 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H05K2201/0212 ,  H05K2201/0248 ,  H05K2201/0373 ,  H05K2201/1025 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/00015 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： Disclosed is a laminated (or non-laminated) conductive interconnection for joining an integrated circuit device to a device carrier, where the conductive interconnection comprises alternating metal layers and polymer layers. In addition, the polymer can include dendrites, metal projections from the carrier or device, and/or micelle brushes on the outer portion of the polymer. The polymer layers include metal particles and the alternating metal layers and polymer layers form either a cube-shaped structure or a cylinder-shaped structure.

摘要翻译： 公开了用于将集成电路器件连接到器件载体的层压（或非层叠）导电互连，其中导电互连包括交替的金属层和聚合物层。 此外，聚合物可以包括枝晶，来自载体或器件的金属突起，和/或聚合物外部的胶束刷。 聚合物层包括金属颗粒，并且交替的金属层和聚合物层形成立方体结构或圆柱形结构。

公开(公告)号：US06210545B1

公开(公告)日：2001-04-03

申请号：US09447626

申请日：1999-11-23

申请人： Mukta Farooq ,  Robert A. Rita ,  Stephen M. Rossnagel

发明人： Mukta Farooq ,  Robert A. Rita ,  Stephen M. Rossnagel

IPC分类号： C23C1434

CPC分类号： C23C14/3414 ,  C04B35/462 ,  C04B35/49 ,  C04B35/645 ,  C23C14/088

摘要： An inventive method for forming a thin film comprises the steps of preparing a sputter-target of a material which is fully oxidized and crystallized to a perovskite structure, sputter-depositing a thin film on top of a sample with the target in an inert gas atmosphere, and annealing the thin film in non-oxygen ambient. With the use of such a target, it is possible to reduce the negative ion effect during the sputter deposition and to eliminate the presence of oxygen during the annealing process.

摘要翻译： 用于形成薄膜的本发明的方法包括以下步骤：制备完全氧化并结晶成钙钛矿结构的材料的溅射靶，在惰性气体气氛中用靶溅射沉积样品顶部的薄膜 ，并在非氧环境中退火薄膜。 通过使用这样的靶，可以减少在溅射沉积期间的负离子效应，并且消除退火过程中氧的存在。

公开(公告)号：US20080000080A1

公开(公告)日：2008-01-03

申请号：US11856084

申请日：2007-09-17

申请人： William Bernier ,  David Eichstadt ,  Mukta Farooq ,  John Knickerbocker

发明人： William Bernier ,  David Eichstadt ,  Mukta Farooq ,  John Knickerbocker

IPC分类号： H05K3/00

CPC分类号： H01L24/13 ,  G01R1/06716 ,  G01R1/07314 ,  G01R3/00 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/81 ,  H01L2221/68377 ,  H01L2224/11003 ,  H01L2224/114 ,  H01L2224/11505 ,  H01L2224/116 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13169 ,  H01L2224/1318 ,  H01L2224/13184 ,  H01L2224/81205 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/8384 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/30105 ,  H01L2924/30107 ,  H05K3/06 ,  H05K3/3436 ,  H05K2201/10242 ,  Y02P70/613 ,  Y10T29/49124 ,  Y10T29/49204 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/0401

摘要： A method of forming compliant electrical contacts includes patterning a conductive layer into an array of compliant members. The array of compliant members is then positioned to be in contact with electrical connection pads on an integrated circuit wafer and the compliant members are joined to the pads. Then, the supporting layer that supported the compliant members is removed to leave the compliant members connected to the pads.

摘要翻译： 形成顺应性电触头的方法包括将导电层图案化为顺应构件阵列。 然后将顺应构件阵列定位成与集成电路晶片上的电连接焊盘接触，并且柔性构件连接到焊盘。 然后，移除支撑柔顺构件的支撑层，以使与柔性构件连接的衬垫离开。