Substrate processing apparatus
    1.
    发明授权
    Substrate processing apparatus 有权
    基板加工装置

    公开(公告)号:US08588950B2

    公开(公告)日:2013-11-19

    申请号:US13036485

    申请日:2011-02-28

    Applicant: Makoto Nomura

    Inventor: Makoto Nomura

    Abstract: Only a wafer for QC check may be transferred and a production wafer may prevent from being transferred into an assigned process chamber whose QC check is not completed after a maintenance task, and the production wafer may be processed the assigned process chamber after the completion of the QC check. The wafer for QC check is transferred while inhibiting a transfer of the production wafer into the assigned process chamber, and the production wafer is transferred into each of the process chambers of the plurality except the assigned process chamber.

    Abstract translation: 可以仅转移用于QC检查的晶片,并且生产晶片可以防止在维护任务之后被转移到QC检查未完成的指定处理室中,并且生产晶片可以在完成之后被处理分配的处理室 QC检查。 传送用于QC检查的晶片,同时禁止将生产晶片转移到指定的处理室中,并且将生产晶片转移到除了指定的处理室之外的多个处理室中。

    Negative-type photosensitive resin composition containing epoxy-containing material
    2.
    发明申请
    Negative-type photosensitive resin composition containing epoxy-containing material 审中-公开
    含有含环氧材料的负型感光性树脂组合物

    公开(公告)号:US20060199099A1

    公开(公告)日:2006-09-07

    申请号:US11365381

    申请日:2006-03-01

    CPC classification number: G03F7/0382

    Abstract: Provided are negative-type photosensitive resin compositions which may be used as interlayer insulating layers on a silicon wafer. The compositions include a urea crosslinking agent together with an epoxy-containing material and vinylphenol resin. Also provided are methods of forming patterned insulating layers using such compositions. The resin compositions can be used in the manufacture of wafer-level chip-scale packages and LSIs, for example, as interlayer insulating layers.

    Abstract translation: 提供可以用作硅晶片上的层间绝缘层的负型感光性树脂组合物。 组合物包括与含环氧基材料和乙烯基苯酚树脂一起的尿素交联剂。 还提供了使用这种组合物形成图案化绝缘层的方法。 树脂组合物可用于制造晶片级芯片级封装和LSI,例如作为层间绝缘层。

    Negative-type photosensitive resin composition containing epoxy-containing material
    3.
    发明申请
    Negative-type photosensitive resin composition containing epoxy-containing material 审中-公开
    含有含环氧材料的负型感光性树脂组合物

    公开(公告)号:US20060199098A1

    公开(公告)日:2006-09-07

    申请号:US11365100

    申请日:2006-03-01

    CPC classification number: G03F7/0382 G03F7/0381

    Abstract: Provided are negative-type photosensitive resin compositions which may be used in forming interlayer insulating layers on a silicon wafer or printed wiring board. The compositions include a vinylphenol resin, a biphenyl-phenol resin and epoxy-containing materials. Also provided are methods of forming patterned dielectric films using such compositions. The resin compositions can be used in the manufacture of wafer-level chip-scale packages and LSIs, for example, as interlayer insulating layers.

    Abstract translation: 提供可以用于在硅晶片或印刷线路板上形成层间绝缘层的负型感光性树脂组合物。 组合物包括乙烯基苯酚树脂,联苯酚树脂和含环氧树脂的材料。 还提供了使用这种组合物形成图案化电介质膜的方法。 树脂组合物可用于制造晶片级芯片级封装和LSI,例如作为层间绝缘层。

    Cutting tool and wear resistant material
    4.
    发明授权
    Cutting tool and wear resistant material 失效
    切削刀具和耐磨材料

    公开(公告)号:US06314798B2

    公开(公告)日:2001-11-13

    申请号:US09841591

    申请日:2001-04-25

    Abstract: Cutting tools and wear-resistant materials formed of a silicon-nitride-based sintered body having excellent characteristics, such as high wear resistance. Cutting tool 1 is in the form of a negative chip having a shape prescribed by ISO standard: SNGN 120408. Specifically, the cutting tool 1 is a chip of a rectangular parallelepiped shape which has a thickness of 4.76 mm and in which each of four sides (cutting edges) 5 on a rake face 3 side has a length of 12.7 mm. In the region having a width of 0.2 mm or less and extending from the cutting edges 5 of the cutting tool 1, the cutting tool 1 has a microhardness H. Plast of 21.2 GPa or greater and a microhardness HU of 11.2 GPa or greater. The Vickers hardness of the cutting tool 1 as measured at a substantial center of the rake face 3 is 14.5 GPa or greater. Further, the amount of oxygen within the cutting tool 1 is 1.0 to 2.0 wt. %. Also disclosed is a method of quality control of an article having a surface, at least a portion of which is curved, which includes measuring one or both of microhardness H. Plast and microhardness HU in the vicinity of the curved portion of the surface, and either accepting or rejecting the article based on the measurement values.

    Abstract translation: 由氮化硅类烧结体形成的切削工具和耐磨材料,具有优异的耐磨性等特性。 切削刀具1是具有由ISO标准规定的形状的负片的形式:SNGN 120408.具体而言,切削工具1是厚度为4.76mm的长方体形状的切屑,其中, (切削刃)5在前刀面3侧的长度为12.7mm。 在宽度为0.2mm以下且从切削工具1的切削刃5延伸的区域中,切削工具1具有显微硬度H.21.0GPa以上的显微硬度,11.2GPa以上的显微硬度HU。 在前刀面3的大致中心处测量的切削工具1的维氏硬度为14.5GPa以上。 此外,切削工具1内的氧量为1.0〜2.0重量%。 %。 还公开了一种具有表面的质量控制方法,该表面的至少一部分是弯曲的,其包括测量微硬度H之一或两者。表面弯曲部分附近的塑性和显微硬度HU,以及 基于测量值接受或拒绝文章。

    Substrate processing apparatus
    8.
    发明授权
    Substrate processing apparatus 有权
    基板加工装置

    公开(公告)号:US08904955B2

    公开(公告)日:2014-12-09

    申请号:US12389431

    申请日:2009-02-20

    CPC classification number: H01L21/67276

    Abstract: A substrate processing apparatus includes a control unit executing a first recipe for substrate processing. After the substrate processing is completed through the execution of the first recipe, if a predetermined time is elapsed in a state that a next substrate to be processed is not carried into the process chamber, a second recipe is executed for maintaining a process chamber where the substrate is processed.

    Abstract translation: 基板处理装置包括执行用于基板处理的第一配方的控制单元。 在通过执行第一配方完成基板处理之后,如果在未处理下一个待处理基板的状态下经过预定时间,则执行第二配方以维持处理室 底物被处理。

    Pyrimidine nucleoside compound or its salt
    9.
    发明授权
    Pyrimidine nucleoside compound or its salt 失效
    嘧啶核苷化合物或其盐

    公开(公告)号:US07825103B2

    公开(公告)日:2010-11-02

    申请号:US11815149

    申请日:2006-01-30

    CPC classification number: C07H19/06

    Abstract: Provided is a pyrimidine nucleoside compound represented by the following formula (1): or a pharmaceutically acceptable salt thereof, wherein one of X and Y represents a cyano group, and the other represents a hydrogen atom; one of R1 and R2 represents a hydrogen atom, a carbonyl group having a C1-C6 alkyl group which has been mono-substituted by an amino group, or a group represented by (R3)(R4)(R5)Si—, and the other represents a group represented by (R6)(R7)(R8)Si—, or R1 and R2 together form a 6-membered cyclic group represented by —Si(R9)(R10)—; R3, R4, R5, R6, R7, and R8 each represent a C1-C10 linear or branched alkyl group which may have a substituent, a C3-C6 cycloalkyl group which may have a substituent, a C6-C14 aryl group which may have a substituent, or a C1-C6 alkyl group which has been substituted by one or two C6-C14 aryl groups and which may have a substituent; and R9 and R10 each represent a C1-C6 linear or branched alkyl group which may have a substituent. The pyrimidine nucleoside compound of formula (1) or a pharmaceutically acceptable salt thereof exhibits a potent antitumor effect and is therefore useful as a therapeutic agent for preventing or treating a tumor.

    Abstract translation: 提供由下式(1)表示的嘧啶核苷化合物或其药学上可接受的盐,其中X和Y中的一个表示氰基,另一个表示氢原子; R1和R2中的一个表示氢原子,具有被氨基单取代的C1-C6烷基的羰基或由(R3)(R4)(R5)Si-表示的基团,和 (R 6)(R 8)(R 10) - 表示的基团,或者R 1和R 2一起形成-Si(R 9)(R 10) - 表示的6元环基。 R3,R4,R5,R6,R7和R8各自表示可以具有取代基的C1-C10直链或支链烷基,可具有取代基的C3-C6环烷基,可具有取代基的C 6 -C 14芳基 取代基,或被一个或两个C 6 -C 14芳基取代并且可以具有取代基的C 1 -C 6烷基; 并且R 9和R 10各自表示可以具有取代基的C 1 -C 6直链或支链烷基。 式(1)的嘧啶核苷化合物或其药学上可接受的盐显示出有效的抗肿瘤作用,因此可用作预防或治疗肿瘤的治疗剂。

Patent Agency Ranking