Abstract:
Only a wafer for QC check may be transferred and a production wafer may prevent from being transferred into an assigned process chamber whose QC check is not completed after a maintenance task, and the production wafer may be processed the assigned process chamber after the completion of the QC check. The wafer for QC check is transferred while inhibiting a transfer of the production wafer into the assigned process chamber, and the production wafer is transferred into each of the process chambers of the plurality except the assigned process chamber.
Abstract:
Provided are negative-type photosensitive resin compositions which may be used as interlayer insulating layers on a silicon wafer. The compositions include a urea crosslinking agent together with an epoxy-containing material and vinylphenol resin. Also provided are methods of forming patterned insulating layers using such compositions. The resin compositions can be used in the manufacture of wafer-level chip-scale packages and LSIs, for example, as interlayer insulating layers.
Abstract:
Provided are negative-type photosensitive resin compositions which may be used in forming interlayer insulating layers on a silicon wafer or printed wiring board. The compositions include a vinylphenol resin, a biphenyl-phenol resin and epoxy-containing materials. Also provided are methods of forming patterned dielectric films using such compositions. The resin compositions can be used in the manufacture of wafer-level chip-scale packages and LSIs, for example, as interlayer insulating layers.
Abstract:
Cutting tools and wear-resistant materials formed of a silicon-nitride-based sintered body having excellent characteristics, such as high wear resistance. Cutting tool 1 is in the form of a negative chip having a shape prescribed by ISO standard: SNGN 120408. Specifically, the cutting tool 1 is a chip of a rectangular parallelepiped shape which has a thickness of 4.76 mm and in which each of four sides (cutting edges) 5 on a rake face 3 side has a length of 12.7 mm. In the region having a width of 0.2 mm or less and extending from the cutting edges 5 of the cutting tool 1, the cutting tool 1 has a microhardness H. Plast of 21.2 GPa or greater and a microhardness HU of 11.2 GPa or greater. The Vickers hardness of the cutting tool 1 as measured at a substantial center of the rake face 3 is 14.5 GPa or greater. Further, the amount of oxygen within the cutting tool 1 is 1.0 to 2.0 wt. %. Also disclosed is a method of quality control of an article having a surface, at least a portion of which is curved, which includes measuring one or both of microhardness H. Plast and microhardness HU in the vicinity of the curved portion of the surface, and either accepting or rejecting the article based on the measurement values.
Abstract:
A 4-desoxy-4-epipodophyllotoxin derivative of the following formula ##STR1## wherein R and R.sub.1 are as defined in the specification or a pharmaceutically acceptable salt thereof as well as an antitumor composition comprising such derivative or salt as an active ingredient.
Abstract:
The invention relates to a process for preparing prilled bisphenol A by granulation which comprises adding compounds soluble in molten bisphenol A, not affecting adversely the melt color of bisphenol A to any significant extent, and have a melting point of 60.degree. C. or more to bisphenol A and granulating and also to a process which comprises adding the reaction mother liquor or cyrstallization mother liquor produced in the manufacturing step of bisphenol A to bisphenol A or the adduct of bispheol A and phenol or a mixture of bispheol A and phenol, removing the phenol, and granulating. The processes yield prilled bispheol A which have high strength and resist powdering.
Abstract:
A burden distribution monitoring apparatus, according to the present invention, includes a hollow cylindrical sonde having an inner end radially movable within the internal space of a furnace, such as a shaft furnace. The sonde carries a burden layer depth sensor and/or a burden grain distribution sensor for radially shifting working ends of the sensors. With the foregoing construction, burden depth and/or grading of the burden can be monitored in a plurality of radial points in the furnace.
Abstract:
A substrate processing apparatus includes a control unit executing a first recipe for substrate processing. After the substrate processing is completed through the execution of the first recipe, if a predetermined time is elapsed in a state that a next substrate to be processed is not carried into the process chamber, a second recipe is executed for maintaining a process chamber where the substrate is processed.
Abstract:
Provided is a pyrimidine nucleoside compound represented by the following formula (1): or a pharmaceutically acceptable salt thereof, wherein one of X and Y represents a cyano group, and the other represents a hydrogen atom; one of R1 and R2 represents a hydrogen atom, a carbonyl group having a C1-C6 alkyl group which has been mono-substituted by an amino group, or a group represented by (R3)(R4)(R5)Si—, and the other represents a group represented by (R6)(R7)(R8)Si—, or R1 and R2 together form a 6-membered cyclic group represented by —Si(R9)(R10)—; R3, R4, R5, R6, R7, and R8 each represent a C1-C10 linear or branched alkyl group which may have a substituent, a C3-C6 cycloalkyl group which may have a substituent, a C6-C14 aryl group which may have a substituent, or a C1-C6 alkyl group which has been substituted by one or two C6-C14 aryl groups and which may have a substituent; and R9 and R10 each represent a C1-C6 linear or branched alkyl group which may have a substituent. The pyrimidine nucleoside compound of formula (1) or a pharmaceutically acceptable salt thereof exhibits a potent antitumor effect and is therefore useful as a therapeutic agent for preventing or treating a tumor.
Abstract:
A process for the production of bisphenol A, including providing a melt of a crystalline adduct of bisphenol A and phenol, contacting the melt with a cation donating solid to neutralize the strong acid therewith, and then heating the melt to vaporize and remove phenol from the melt.