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公开(公告)号：USD343933S
公开(公告)日：1994-02-01
申请号：US844402
申请日：1992-02-28
申请人： Manfred Nitsch
设计人： Manfred Nitsch
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2.发明授权Process of producing galvanic layers of solder of precise contour on inorganic substrates 失效在无机基板上生产精密轮廓的焊料电镀工艺
公开(公告)号：US4640739A
公开(公告)日：1987-02-03
申请号：US765815
申请日：1985-08-15
IPC分类号： C25D5/54 , H05K1/03 , H05K1/09 , H05K3/06 , H05K3/10 , H05K3/24 , H05K3/34 , C23F1/02 , B44C1/22 , C25D5/02
CPC分类号： H05K3/246 , C25D5/54 , H05K3/108 , H05K3/3473 , H05K1/0306 , H05K1/092 , H05K2201/0347 , H05K2203/043 , H05K2203/0723 , H05K3/062
摘要： Very fine solder-coated conduction paths are made on ceramic, glass or enamel substrates by the combination of a first step in thick-film technology followed by the photo-masking and etching steps typical of thin-film technology, after which galvanic reinforcement of the initial calcined copper paste layer is performed in the locations where the initial layer is exposed by the developed mask. A lead-tin solder layer is then galvanically deposited, which is thicker than the mask, after which the mask is removed and the newly exposed portions of the initial copper layer are etched away. A reflow treatment of the solder layer pattern consolidates the solder layer by melting on top of the boundaries of the unetched initial copper layer. It is possible to obtain conduction path spacings down to 50 .mu.m with conduction paths coated with solder that have excellent adhesion to ceramic, glass or enamel substrates.
摘要翻译： 通过组合厚膜技术的第一步骤，然后通过薄膜技术的典型的光掩模和蚀刻步骤，在陶瓷，玻璃或搪瓷基底上制备非常细的焊料涂覆的传导路径，之后电镀加强 初始煅烧铜糊层在初始层被显影掩模暴露的位置进行。 然后将铅锡焊料层电镀沉积，其比掩模厚，然后去除掩模并且蚀刻初始铜层的新曝光部分。 焊料层图案的回流处理通过在未蚀刻的初始铜层的边界的顶部上熔化来固化焊料层。 可以通过涂覆有陶瓷，玻璃或搪瓷基材的优异粘合性的焊料传导路径获得低至50微米的传导路径间隔。
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公开(公告)号：USD679825S1
公开(公告)日：2013-04-09
申请号：US29417589
申请日：2012-04-05
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4.发明授权Flexible printed circuit connecting means for at least one hybrid circuit structure and a printed circuit board 失效用于至少一个混合电路结构的柔性印刷电路连接方式和印刷电路板
公开(公告)号：US5168430A
公开(公告)日：1992-12-01
申请号：US342371
申请日：1989-04-21
申请人： Manfred Nitsch , Peter Werner , Dieter Gunther , Herbert Arnold , Willy Bentz , Michael Horbelt , Willi Gansert , Dietrich Bergfried , Werner Auth , Ulrich Konzelmann
发明人： Manfred Nitsch , Peter Werner , Dieter Gunther , Herbert Arnold , Willy Bentz , Michael Horbelt , Willi Gansert , Dietrich Bergfried , Werner Auth , Ulrich Konzelmann
IPC分类号： H01L23/538 , H05K1/03 , H05K1/14 , H05K3/00 , H05K3/36
CPC分类号： H01L23/5385 , H05K3/361 , H01L2224/48091 , H01L2224/48472 , H05K1/0306 , H05K1/141 , H05K2201/10287 , H05K2203/049 , H05K3/4691
摘要： The flexible printed circuit device, includes at least one hybrid circuit structure having assigned contact areas, a rigid printed circuit board, a flexible printed circuit board portion also having assigned contact areas on one end region thereof and being connected electrically to the rigid printed circuit board, a plurality of bonding electrical conductors, each of the electrical conductors being bonded at one end thereof to one of the assigned contact areas on the at least one hybrid circuit structure and, at the other end thereof, to one of the assigned contact areas on the end region of the flexible printed circuit board portion; and a rigid support, the hybrid circuit structure being mounted on the rigid support. The end region of the flexible printed circuit board portion is fixedly mounted on the rigid support in side-by-side relationship with the hybrid circuit structure. A protective frame is provided enclosing the electrical conductors electrically connecting the assigned contact areas on the hybrid circuit structure and the end region of the flexible printed circuit board portion.
摘要翻译： 柔性印刷电路器件包括具有分配接触区域的至少一个混合电路结构，刚性印刷电路板，柔性印刷电路板部分，其在其一个端部区域上也具有分配的接触区域，并且与刚性印刷电路板电连接 多个接合电导体，每个电导体的一端被结合到所述至少一个混合电路结构上的所分配的接触区域中的一个上，并且在另一端处与所分配的接触区域之一 柔性印刷电路板部分的端部区域; 和刚性支撑件，混合电路结构安装在刚性支撑件上。 柔性印刷电路板部分的端部区域与混合电路结构并排地固定地安装在刚性支撑件上。 提供保护框架，其围绕电导体电连接混合电路结构上的分配的接触区域和柔性印刷电路板部分的端部区域。
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公开(公告)号：USD626247S1
公开(公告)日：2010-10-26
申请号：US29323895
申请日：2008-09-03
申请人： Manfred Nitsch
设计人： Manfred Nitsch
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公开(公告)号：USD388920S
公开(公告)日：1998-01-06
申请号：US63878
申请日：1996-12-17
申请人： Manfred Nitsch
设计人： Manfred Nitsch
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公开(公告)号：USD651747S1
公开(公告)日：2012-01-03
申请号：US29384833
申请日：2011-02-04
申请人： Manfred Nitsch , Ozgur Tasar
设计人： Manfred Nitsch , Ozgur Tasar
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公开(公告)号：USD645569S1
公开(公告)日：2011-09-20
申请号：US29323894
申请日：2008-09-03
申请人： Manfred Nitsch
设计人： Manfred Nitsch
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公开(公告)号：USD647626S1
公开(公告)日：2011-10-25
申请号：US29358588
申请日：2010-03-30
申请人： Manfred Nitsch
设计人： Manfred Nitsch
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公开(公告)号：USD635528S1
公开(公告)日：2011-04-05
申请号：US29360955
申请日：2010-05-04
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