摘要:
An integrated circuit containing a FeCap array. The FeCap array is at least partially surrounded on the sides by hydrogen barrier walls and on the top by a hydrogen barrier top plate. A method for at least partially enclosing a FeCap array with hydrogen barrier walls and a hydrogen barrier top plate.
摘要:
A system and method for enabling routing of data on a network based on a portion of data accessed from a non-network enabled device is disclosed. The technology includes a method for enabling routing of data on a network based on a portion of data accessed from a non-network enabled device. The method includes detecting a non-network enabled device locally coupled to a first computer system, the first computer system coupled to the network. The method further includes enabling routing of data through the non-network enabled device to a second computer system coupled to the network by using the first computer system as a communication interface between the non-network enabled device and the second computer system wherein the second computer system is automatically identified based on recognizing a portion of the data as a routing destination.
摘要:
Semiconductor devices and methods are disclosed for improving electrical connections to integrated circuits. A process flow and device with a dual/single damascene interconnect structure overlying an existing interconnect structure in a semiconductor wafer is provided. A capping layer is formed thereon that comprises nickel/palladium layers within a bond pad opening. The layers are polished using a chemical mechanical polishing (CMP) technique so that the capping layers are within the opening.
摘要:
Bond pads on an integrated circuit are provided with planarizing dielectric structures to permit the electroplating of metal posts having planar top surfaces. The metal posts contact at least three sides of the planarizing dielectric structures. The planarizing dielectric structures can be used on integrated circuits having bond pads of different sizes to electroplate metal posts having the same height.
摘要:
A fax account is described and creates an association between users and documents that are faxed. A fax account allows a user to secure their faxed documents and organize and streamline fax communication via different transports. In at least some embodiments, security is enhanced through the use of an authentication model that authenticates individual users before giving them access to the fax functionality or, more accurately, their fax account. In at least some embodiments, fax accounts also provide users with an infrastructure through which they can manage their documents. In addition, in at least some embodiments, fax accounts can be used to manage and direct received faxes to the intended recipient, thus reducing the possibility of an unintended recipient gaining access to the fax.
摘要:
An integrated circuit containing a FeCap array. The FeCap array is at least partially surrounded on the sides by hydrogen barrier walls and on the top by a hydrogen barrier top plate. A method for at least partially enclosing a FeCap array with hydrogen barrier walls and a hydrogen barrier top plate.
摘要:
A fax account is described and creates an association between users and documents that are faxed. A fax account allows a user to secure their faxed documents and organize and streamline fax communication via different transports. In at least some embodiments, security is enhanced through the use of an authentication model that authenticates individual users before giving them access to the fax functionality or, more accurately, their fax account. In at least some embodiments, fax accounts also provide users with an infrastructure through which they can manage their documents. In addition, in at least some embodiments, fax accounts can be used to manage and direct received faxes to the intended recipient, thus reducing the possibility of an unintended recipient gaining access to the fax.
摘要:
A system and method for enabling routing of data on a network based on segmented data accessed from a non-network enabled device is disclosed. The technology includes a method for enabling routing of data on a network based on segmented data accessed from a non-network enabled device. The method includes detecting a non-network enabled device locally coupled to a first computer system, the first computer system coupled to the network. The method for enabling sharing of non-network enabled devices on a network also includes enabling routing of data through the non-network enabled device to a second computer system coupled to the network by using the first computer system as a communication interface between the non-network enabled device and the second computer system wherein the second computer system is automatically identified based on recognizing a portion of the data as indicating a routing destination and wherein the data is segmented into a plurality of portions prior to routing.
摘要:
A system and method for enabling routing of data on a network based on a portion of data accessed from a non-network enabled device is disclosed. The technology includes a method for enabling routing of data on a network based on a portion of data accessed from a non-network enabled device. The method includes detecting a non-network enabled device locally coupled to a first computer system, the first computer system coupled to the network. The method further includes enabling routing of data through the non-network enabled device to a second computer system coupled to the network by using the first computer system as a communication interface between the non-network enabled device and the second computer system wherein the second computer system is automatically identified based on recognizing a portion of the data as a routing destination.
摘要:
A method of constructing a semiconductor device 10 is disclosed which includes a reflow step. The device 10 comprises a conductive via 20 electrically connected to a conductive interconnect 28. The formation of interconnect 28 can result in damage to conductive via 20 including the removal of material within conductive via 20 to form a void 30. The metal reflow step involves heating the structure to a temperature short of the melting point of the conductive material forming the conductive via 20 and the conductive interconnect 28. The reflow step results in the migration of conductive material into the void 30 and a widening of the conductive interface between the conductive via 20 and the conductive interconnect 28.