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公开(公告)号：US09484674B2
公开(公告)日：2016-11-01
申请号：US14209079
申请日：2014-03-13
IPC分类号： H01R13/648 , H01R13/658 , H01R13/6476 , H01R43/16 , H01R43/24 , H01R12/72 , H01R13/514
CPC分类号： H01R13/658 , H01R12/724 , H01R13/514 , H01R13/6476 , H01R43/16 , H01R43/24
摘要： An improved electrical connector is provided by compensating for skew in signal conductors of a differential pair while ensuring a uniform impedance along the differential pair. Skew is equalized by regions of lower dielectric constant preferentially positioned adjacent the longer conductor of each pair. Impedance along the length of the signal conductor is equalized by a compensation portion in the first conductor that offsets for a change in impedance associated with the change in dielectric constant adjacent the longer conductor. The compensation portion may be a widening in the first conductive element relative to a nominal width of the conductive element. The skew compensation portion may be along a longer edge of the longer conductor and the impedance compensation portion may be along the shorter edge of the longer conductor.
摘要翻译： 通过补偿差分对的信号导体中的偏斜而提供改进的电连接器，同时确保沿着差分对的均匀阻抗。 偏移量通过优先位于每对较长导体附近的较低介电常数的区域来均衡。 沿着信号导体的长度的阻抗由第一导体中的补偿部分相等，抵消与较长导体相邻的介电常数变化相关的阻抗变化。 补偿部分可以相对于导电元件的标称宽度在第一导电元件中变宽。 偏斜补偿部分可以沿着较长导体的较长边缘，并且阻抗补偿部分可以沿着较长导体的较短边缘。
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公开(公告)号：US09225085B2
公开(公告)日：2015-12-29
申请号：US13930351
申请日：2013-06-28
申请人： Marc B. Cartier, Jr. , David Manter , Prescott B. Atkinson , Philip T. Stokoe , Thomas S. Cohen , Mark W. Gailus
发明人： Marc B. Cartier, Jr. , David Manter , Prescott B. Atkinson , Philip T. Stokoe , Thomas S. Cohen , Mark W. Gailus
IPC分类号： H01R13/648 , H01R12/70 , H01R12/71 , H01R43/20 , H01R13/6587 , H05K1/02
CPC分类号： H01R12/7082 , H01R12/712 , H01R13/6587 , H01R43/20 , H05K1/0222 , H05K1/024 , H05K1/0251 , H05K2201/09063 , Y10T29/49121
摘要： An RF connector module and associated printed circuit board providing high isolation and controlled impedance at RF frequencies. The connector module may be manufactured using conventional manufacturing techniques, such as stamping, insert molding, multi-shot molding and interference fit between components, to provide low cost. A connector module constructed with these techniques may implement a co-planar waveguide structure, with conductive shields for isolation and lossy material to enforce co-planar propagation modes. The printed circuit board may similarly be manufactured using conventional manufacturing techniques, including drilling to form vias. As a result, an interconnection system may be manufactured with low cost. These techniques may be applied to provide performance, including in the form of isolation between RF signals, comparable to that provided by more expensive components.
摘要翻译： RF连接器模块和相关的印刷电路板，在RF频率下提供高隔离和受控阻抗。 连接器模块可以使用常规的制造技术制造，例如冲压，嵌入成型，多次成型和部件之间的过盈配合，以提供低成本。 用这些技术构成的连接器模块可以实现共面波导结构，其具有用于隔离的导电屏蔽和有损材料以实现共面传播模式。 印刷电路板可类似地使用常规制造技术制造，包括钻孔以形成通孔。 结果，可以以低成本制造互连系统。 可以应用这些技术来提供性能，包括在RF信号之间的隔离的形式，与由更昂贵的组件提供的RF信号相当。
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公开(公告)号：US07335063B2
公开(公告)日：2008-02-26
申请号：US11635090
申请日：2006-12-07
IPC分类号： H01R13/648
CPC分类号： H01R12/727 , H01R12/585 , H01R12/724 , H01R13/514 , H01R13/516 , H01R13/6461 , H01R13/6587 , H01R13/6599 , H01R43/16 , H01R43/24 , Y10T29/4922
摘要： An electrical connector includes a wafer formed with a ground shield made from a non-conductive material made conductive with conductive particles disposed therein, thereby eliminating the necessity of the metal ground shield plate found in prior art connectors while maintaining sufficient performance characteristics and minimizing electrical noise generated in the wafer. The wafer housing is formed with a first, insulative housing at least partially surrounding a pair of signal strips and a second, conductive housing at least partially surrounding the first, insulative housing and the signal strips. The housings provide the wafer with sufficient structural integrity, obviating the need for additional support structures or components for a wafer. Ground strips may be employed in the wafer and may be formed in the same plane as the signal strips. The second, conductive housing may be connected (e.g., molded) to the ground strips and spaced appropriately from the signal strips. The wafer may also include air gaps between the signal strips of one wafer and the conductive housing of an adjacent wafer further reducing electrical noise or other losses (e.g., cross-talk) without sacrificing significant signal strength.
摘要翻译： 电连接器包括形成有由不导电材料制成的接地屏蔽的晶片，其中导电颗粒被布置在其中，从而消除了现有技术连接器中发现的金属接地屏蔽板的必要性，同时保持足够的性能特性并最小化电噪声 在晶片中产生。 晶片壳体形成有至少部分地围绕一对信号带的第一绝缘壳体和至少部分地围绕第一绝缘壳体和信号条的第二导电壳体。 这些外壳为晶片提供了足够的结构完整性，从而避免了对晶片的附加支撑结构或部件的需要。 接地条可以用在晶片中，并且可以形成在与信号条相同的平面中。 第二导电壳体可以被连接（例如，模制）到接地条并且与信号条适当地隔开。 晶片还可以包括一个晶片的信号条和相邻晶片的导电外壳之间的气隙，从而进一步降低电噪声或其他损耗（例如串扰），而不会牺牲显着的信号强度。
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公开(公告)号：US08814595B2
公开(公告)日：2014-08-26
申请号：US13354783
申请日：2012-01-20
IPC分类号： H01R13/648
CPC分类号： H01R13/04 , H01R13/6461 , H01R13/6473 , H01R13/6587
摘要： A broadside coupled connector assembly has two sets of conductors, each separate planes. By providing the same path lengths, there is no skew between the conductors of the differential pair and the impedance of those conductors is identical. The conductor sets are formed by embedding the first set of conductors in an insulated housing having a top surface with channels. The second set of conductors is placed within the channels so that no air gaps form between the two sets of conductors. A second insulated housing is filled over the second set of conductors and into the channels to form a completed wafer. The ends of the first and second sets of conductors and the blades are jogged in both an x- and y-coordinate to reduce crosstalk and improve electrical performance.
摘要翻译： 宽侧耦合连接器组件具有两组导体，每个独立的平面。 通过提供相同的路径长度，差分对的导体之间不存在偏斜，并且那些导体的阻抗相同。 导体组是通过将第一组导体嵌入绝缘壳体而形成的，绝缘壳体具有带通道的顶表面。 第二组导体放置在通道内，使得两组导体之间不会形成气隙。 第二绝缘壳体填充在第二组导体上并进入通道以形成完整的晶片。 第一组和第二组导体和叶片的端部在x和y坐标上均匀点动以减少串扰并提高电气性能。
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公开(公告)号：US20140004724A1
公开(公告)日：2014-01-02
申请号：US13930531
申请日：2013-06-28
申请人： Marc B. Cartier, JR. , David Manter , Prescott B. Atkinson , Philip T. Stokoe , Thomas S. Cohen , Mark W. Gailus
发明人： Marc B. Cartier, JR. , David Manter , Prescott B. Atkinson , Philip T. Stokoe , Thomas S. Cohen , Mark W. Gailus
IPC分类号： H01R12/70
CPC分类号： H01R12/7082 , H01R12/712 , H01R13/6587 , H01R43/20 , H05K1/0222 , H05K1/024 , H05K1/0251 , H05K2201/09063 , Y10T29/49121
摘要： An RF connector module and associated printed circuit board providing high isolation and controlled impedance at RF frequencies. The connector module may be manufactured using conventional manufacturing techniques, such as stamping, insert molding, multi-shot molding and interference fit between components, to provide low cost. A connector module constructed with these techniques may implement a co-planar waveguide structure, with conductive shields for isolation and lossy material to enforce co-planar propagation modes. The printed circuit board may similarly be manufactured using conventional manufacturing techniques, including drilling to form vias. As a result, an interconnection system may be manufactured with low cost. These techniques may be applied to provide performance, including in the form of isolation between RF signals, comparable to that provided by more expensive components.
摘要翻译： RF连接器模块和相关的印刷电路板，在RF频率下提供高隔离和受控阻抗。 连接器模块可以使用常规的制造技术制造，例如冲压，嵌件成型，多次成型和部件之间的过盈配合，以提供低成本。 用这些技术构成的连接器模块可以实现共面波导结构，其具有用于隔离的导电屏蔽和有损材料以实现共面传播模式。 印刷电路板可类似地使用常规制造技术制造，包括钻孔以形成通孔。 结果，可以以低成本制造互连系统。 可以应用这些技术来提供性能，包括在RF信号之间的隔离的形式，与由更昂贵的组件提供的RF信号相当。
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公开(公告)号：US20090011641A1
公开(公告)日：2009-01-08
申请号：US11958457
申请日：2007-12-18
IPC分类号： H01R13/648 , H01R13/02 , H01R43/00
CPC分类号： H01R12/727 , H01R12/585 , H01R12/724 , H01R13/514 , H01R13/516 , H01R13/6461 , H01R13/6587 , H01R13/6599 , H01R43/16 , H01R43/24 , Y10T29/4922
摘要： An electrical connector includes a wafer formed with a ground shield made from a non-conductive material made conductive with conductive particles disposed therein, thereby eliminating the necessity of the metal ground shield plate found in prior art connectors while maintaining sufficient performance characteristics and minimizing electrical noise generated in the wafer. The wafer housing is formed with a first, insulative housing at least partially surrounding a pair of signal strips and a second, conductive housing at least partially surrounding the first, insulative housing and the signal strips. The housings provide the wafer with sufficient structural integrity, obviating the need for additional support structures or components for a wafer. Ground strips may be employed in the wafer and may be formed in the same plane as the signal strips. The second, conductive housing may be connected (e.g., molded) to the ground strips and spaced appropriately from the signal strips. The wafer may also include air gaps between the signal strips of one wafer and the conductive housing of an adjacent wafer further reducing electrical noise or other losses (e.g., cross-talk) without sacrificing significant signal strength.
摘要翻译： 电连接器包括形成有由不导电材料制成的接地屏蔽的晶片，其中导电颗粒被布置在其中，从而消除了现有技术连接器中发现的金属接地屏蔽板的必要性，同时保持足够的性能特性并最小化电噪声 在晶片中产生。 晶片壳体形成有至少部分地围绕一对信号带的第一绝缘壳体和至少部分地围绕第一绝缘壳体和信号条的第二导电壳体。 这些外壳为晶片提供了足够的结构完整性，从而避免了对晶片的附加支撑结构或部件的需要。 接地条可以用在晶片中，并且可以形成在与信号条相同的平面中。 第二导电壳体可以被连接（例如，模制）到接地条并且与信号条适当地间隔开。 晶片还可以包括一个晶片的信号条和相邻晶片的导电外壳之间的气隙，从而进一步降低电噪声或其他损耗（例如串扰），而不会牺牲显着的信号强度。
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公开(公告)号：US07163421B1
公开(公告)日：2007-01-16
申请号：US11183564
申请日：2005-07-18
IPC分类号： H01R13/648
CPC分类号： H01R12/727 , H01R12/585 , H01R12/724 , H01R13/514 , H01R13/516 , H01R13/6461 , H01R13/6587 , H01R13/6599 , H01R43/16 , H01R43/24 , Y10T29/4922
摘要： An electrical connector includes a wafer formed with a ground shield made from a non-conductive material made conductive with conductive particles disposed therein, thereby eliminating the necessity of the metal ground shield plate found in prior art connectors while maintaining sufficient performance characteristics and minimizing electrical noise generated in the wafer. The wafer housing is formed with a first, insulative housing at least partially surrounding a pair of signal strips and a second, conductive housing at least partially surrounding the first, insulative housing and the signal strips. The housings provide the wafer with sufficient structural integrity, obviating the need for additional support structures or components for a wafer. Ground strips may be employed in the wafer and may be formed in the same plane as the signal strips. The second, conductive housing may be connected (e.g., molded) to the ground strips and spaced appropriately from the signal strips. The wafer may also include air gaps between the signal strips of one wafer and the conductive housing of an adjacent wafer further reducing electrical noise or other losses (e.g., cross-talk) without sacrificing significant signal strength.
摘要翻译： 电连接器包括形成有由不导电材料制成的接地屏蔽的晶片，其中导电颗粒被布置在其中，从而消除了现有技术连接器中发现的金属接地屏蔽板的必要性，同时保持足够的性能特性并最小化电噪声 在晶片中产生。 晶片壳体形成有至少部分地围绕一对信号带的第一绝缘壳体和至少部分地围绕第一绝缘壳体和信号条的第二导电壳体。 这些外壳为晶片提供了足够的结构完整性，从而避免了对晶片的附加支撑结构或部件的需要。 接地条可以用在晶片中，并且可以形成在与信号条相同的平面中。 第二导电壳体可以被连接（例如，模制）到接地条并且与信号条适当地隔开。 晶片还可以包括一个晶片的信号条和相邻晶片的导电外壳之间的气隙，从而进一步降低电噪声或其他损耗（例如串扰），而不会牺牲显着的信号强度。
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8.发明授权公开(公告)号：US06963209B1
公开(公告)日：2005-11-08
申请号：US10897638
申请日：2004-07-23
CPC分类号： G01R35/007 , H05K1/0268 , H05K1/0298 , H05K3/403 , H05K3/429 , H05K2201/0919 , H05K2201/092 , H05K2201/09981
摘要： Calibration standards for accurate high frequency or wide bandwidth calibration measurements. A “short” or “reflect” standard is formed in a printed circuit board from a conductive coating on a generally planar surface. The conductive coating connects a signal trace to one or more ground planes. The generally planar surface is at least as wide as the signal trace and is preferably several times wider than the signal trace to provide a short standard with properties uniform over a wide frequency range. The short standard is incorporated into a printed circuit upon which a device under test is to be mounted. Connections to the short standard are made through components equivalent to components used to connect a device under test. When a through and line standard are added to the same board, the test board contains all the standards needed for a TRL calibration.
摘要翻译： 精确的高频或宽带宽校准测量的校准标准。 在大体上平坦的表面上由导电涂层形成印刷电路板中的“短”或“反射”标准。 导电涂层将信号迹线连接到一个或多个接地层。 通常平面的表面至少与信号迹线一样宽，并且优选地比信号迹线宽数倍，以提供具有在宽频率范围内均匀的特性的短标准。 短标准被并入印刷电路中，在该印刷电路中将安装被测器件。 与短标准的连接通过与用于连接被测设备的组件相当的组件进行。 当通过和线路标准被添加到同一个板上时，测试板包含TRL校准所需的所有标准。
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公开(公告)号：US06506076B2
公开(公告)日：2003-01-14
申请号：US09774763
申请日：2001-01-31
IPC分类号： H01R13648
CPC分类号： H01R13/6585 , H01R12/716
摘要： A high speed, high density electrical connector for use with printed circuit boards is described. The connector is in two pieces, each piece including columns of signal contacts and shield plates which interconnect when the two pieces are mated. The shield plates are disposed in each piece of the connector such that, when mated, the shield plates are substantially perpendicular to the shield plates in the other piece of the connector. The shields have a grounding arrangement that is adapted to control the electromagnetic fields for various system architectures, simultaneous switching configurations and signal speeds. Additionally, at least one piece of the connector is manufactured from wafers, with each ground plane and signal column injection molded into components which, when combined, form a wafer.
摘要翻译： 描述了用于印刷电路板的高速，高密度电连接器。 连接器分为两部分，每片包括信号触点和屏蔽板的列，当两块配合时互连。 屏蔽板设置在每个连接器中，使得当配合时，屏蔽板基本上垂直于连接器的另一个中的屏蔽板。 屏蔽具有适于控制各种系统架构的电磁场，同时切换配置和信号速度的接地装置。 另外，至少一片连接器由晶片制成，每个接地平面和信号柱都注射成型，当被组合时形成晶片。
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公开(公告)号：US20130112468A1
公开(公告)日：2013-05-09
申请号：US13553414
申请日：2012-07-19
IPC分类号： H05K1/11
CPC分类号： H01R13/646 , H01R13/514 , H01R13/6471 , H01R13/6587 , H01R23/688 , H05K1/0231 , H05K1/0237 , H05K1/115 , H05K1/116 , H05K1/14 , H05K3/429 , H05K7/1445 , H05K2201/044 , H05K2201/09236 , H05K2201/09718 , H05K2201/10189 , H05K2203/1572
摘要： A midplane has a first side to which contact ends of a first differential connector are connected and a second side opposite the first side to which contact ends of a second differential connector are connected. The midplane includes a plurality of vias extending from the first side to the second side, with the vias providing first signal launches on the first side and second signal launches on the second side. The first signal launches are provided in a plurality of rows, with each row having first signal launches along a first line and first signal launches along a second line substantially parallel to the first line. The second signal launches are provided in a plurality of columns, with each column having second signal launches along a third line and second signal launches along a fourth line substantially parallel to the third line.
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