公开(公告)号：US08807204B2

公开(公告)日：2014-08-19

申请号：US12872107

申请日：2010-08-31

申请人： Michael S. June ,  Chunjian Ni ,  Dana S. Royer ,  Mark E. Steinke

发明人： Michael S. June ,  Chunjian Ni ,  Dana S. Royer ,  Mark E. Steinke

IPC分类号： F25B29/00 ,  F28F7/00 ,  F28D15/00 ,  F28F1/36

CPC分类号： H05K7/2039 ,  F28F13/16 ,  H01L23/3672 ,  H01L23/467 ,  H01L2924/0002 ,  Y10T29/49002 ,  H01L2924/00

摘要： A system for cooling a heat generating device comprises a heat sink and a plurality of ion emitter elements that form an electrohydrodynamic (EHD) air flow device. The heat sink has a base disposed in thermal communication with a heat generating device, such as a processor. A plurality of heat sink fins is coupled to electrical ground to form ion collectors. Ion emitter elements are disposed in a non-planar pattern along first ends of the plurality of fins so that each ion emitter element is equidistant from the first end of a nearest fin. A power supply applies an electrical potential between the plurality of ion emitter elements and the plurality of fins to induce a flow of ions that cause airflow across the heat sink. It is preferable to have at least three ion emitter elements that are equidistant from each fin of the heat sink.

摘要翻译： 用于冷却发热装置的系统包括形成电动力（EHD）空气流动装置的散热器和多个离子发射器元件。 散热器具有与诸如处理器之类的发热装置热连通的基座。 多个散热鳍片耦合到电接地以形成离子收集器。 离子发射器元件沿着多个翅片的第一端设置在非平面图案中，使得每个离子发射器元件与最近翅片的第一端等距。 电源在多个离子发射器元件和多个翅片之间施加电势，以引起使散热器流过散热器的离子流。 优选具有与散热片的每个翅片等距的至少三个离子发射器元件。

公开(公告)号：US08657558B2

公开(公告)日：2014-02-25

申请号：US12756472

申请日：2010-04-08

申请人： Michael S. June ,  Jason A. Matteson ,  Mark E. Steinke

发明人： Michael S. June ,  Jason A. Matteson ,  Mark E. Steinke

IPC分类号： F04D29/46

CPC分类号： F04D29/4226 ,  F04D29/422 ,  F04D29/462

摘要： Methods, apparatus, and products are disclosed for improving the airflow exiting a blower that has one or more adjustable guide vanes that are affixed to the blower at one or more pivot points located in an outlet of the blower that include: determining a rotational speed of an impeller in the blower and adjusting a position of at least one of the adjustable guide vanes in dependence upon the rotational speed of the impeller.

摘要翻译： 公开了用于改进离开鼓风机的气流的方法，装置和产品，所述风扇具有一个或多个可调导向叶片，所述导向叶片在位于鼓风机出口处的一个或多个枢转点处固定到鼓风机，包括： 鼓风机中的叶轮，并且根据叶轮的旋转速度来调整至少一个可调导​​叶的位置。

公开(公告)号：US08649177B2

公开(公告)日：2014-02-11

申请号：US13451714

申请日：2012-04-20

申请人： Timothy J. Chainer ,  Michael A. Gaynes ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Roger R. Schmidt ,  Mark D. Schultz ,  Daniel P. Simco ,  Mark E. Steinke

发明人： Timothy J. Chainer ,  Michael A. Gaynes ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Roger R. Schmidt ,  Mark D. Schultz ,  Daniel P. Simco ,  Mark E. Steinke

IPC分类号： H05K7/20

CPC分类号： H05K7/20772 ,  H05K7/20781 ,  H05K7/2079

摘要： A method of fabricating a liquid-cooled electronic system is provided which includes an electronic assembly having an electronics card and a socket with a latch at one end. The latch facilitates securing of the card within the socket. The method includes providing a liquid-cooled cold rail at the one end of the socket, and a thermal spreader to couple the electronics card to the cold rail. The thermal spreader includes first and second thermal transfer plates coupled to first and second surfaces on opposite sides of the card, and thermally conductive extensions extending from end edges of the plates, which couple the respective transfer plates to the liquid-cooled cold rail. The extensions are disposed to the sides of the latch, and the card is securable within or removable from the socket using the latch without removing the cold rail or the thermal spreader.

摘要翻译： 提供一种制造液冷电子系统的方法，其包括具有电子卡的电子组件和在一端具有闩锁的插座。 闩锁有助于将卡固定在插座内。 该方法包括在插座的一端提供液冷冷轨，以及将电子卡耦合到冷轨的散热器。 热散布器包括耦合到卡的相对侧上的第一和第二表面的第一和第二热传递板，以及从板的端部边缘延伸的导热延伸件，其将相应的传递板联接到液体冷却的冷轨。 延伸件设置在闩锁的侧面，并且卡可以使用闩锁固定在插座内或从插座中移除，而不移除冷轨或散热器。

公开(公告)号：US20130168068A1

公开(公告)日：2013-07-04

申请号：US13339514

申请日：2011-12-29

申请人： Zhen Huang ,  Vinod Kamath ,  Howard V. Mahaney, JR. ,  Chunjian Ni ,  Mark E. Steinke ,  Jamil A. Wakil

发明人： Zhen Huang ,  Vinod Kamath ,  Howard V. Mahaney, JR. ,  Chunjian Ni ,  Mark E. Steinke ,  Jamil A. Wakil

IPC分类号： F28F3/12

CPC分类号： F28F7/02 ,  F28D15/0233 ,  F28F3/12 ,  F28F2013/001 ,  H01L23/36 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A cold plate comprises a cold plate body having a base for thermally engaging a heat-generating device, a plurality of internal channels extending through the cold plate body for the passage of a liquid coolant, a first region between the base and the plurality of internal channels, and a second region between the plurality of internal channels and a top that is generally opposite the base from the plurality of internal channels. The cold plate body is made from a first thermally conductive material. The cold plate also comprises at least one thermally conductive member extending around the plurality of channels from the first region below the plurality of channels to the second region above the plurality of channels. The at least one thermally conductive member has a greater thermal conductivity than the first thermally conductive material to move heat from the first region to the second region.

摘要翻译： 冷板包括具有用于热接合发热装置的基座的冷板主体，延伸穿过冷板主体以用于液体冷却剂通过的多个内部通道，在基部和多个内部之间的第一区域 通道，以及多个内部通道之间的第二区域和与多个内部通道大致相对的基座的顶部。 冷板体由第一导热材料制成。 冷板还包括至少一个导热构件，其围绕多个通道从多个通道下方的第一区域延伸到多个通道上方的第二区域。 至少一个导热构件具有比第一导热材料更大的热导率，以将热量从第一区域移动到第二区域。

公开(公告)号：US20130153199A1

公开(公告)日：2013-06-20

申请号：US13325198

申请日：2011-12-14

申请人： Diane S. Busch ,  Michael S. June ,  Mark E. Steinke

发明人： Diane S. Busch ,  Michael S. June ,  Mark E. Steinke

IPC分类号： F28F27/00

CPC分类号： F28F27/00 ,  F28D2021/0029 ,  F28F13/16 ,  F28F2250/00 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A system and method for cooling a heat-generating device. The system comprises a heat sink base for contacting the heat-generating device, and a plurality of heat sink fins extending from the heat sink base, wherein the fins provide airflow passages that are open along a top, a first side and a second side. An ionic air moving device is disposed along at least one side of the heat sink for moving air through the airflow passages, and a fan is mounted adjacent to the top of the fins for moving air through the airflow passages. A controller selectively controls the airflow through the heat sink using only the ionic device, only the fan, or both the ionic device and the fan. A user or a system component may instruct the controller to enter a performance mode, an energy efficiency mode, or an acoustic mode.

摘要翻译： 一种用于冷却发热装置的系统和方法。 该系统包括用于接触发热装置的散热器基座和从散热器基座延伸的多个散热鳍片，其中翅片提供沿顶部，第一侧面和第二侧开放的气流通道。 离子空气移动装置沿着散热器的至少一侧设置，用于使空气通过气流通道，并且风扇靠近翅片的顶部安装，以使空气通过气流通道。 控制器仅使用离子装置，仅风扇或离子装置和风扇来选择性地控制通过散热器的气流。 用户或系统组件可以指示控制器进入演奏模式，能量效率模式或声学模式。

公开(公告)号：US20130147503A1

公开(公告)日：2013-06-13

申请号：US13323330

申请日：2011-12-12

申请人： Vinod Kamath ,  Derek I. Schmidt ,  Mark E. Steinke ,  James S. Womble

发明人： Vinod Kamath ,  Derek I. Schmidt ,  Mark E. Steinke ,  James S. Womble

IPC分类号： G01R31/02 ,  G06F1/20

CPC分类号： G06F1/20 ,  G06F2200/201 ,  H05K7/20772

摘要： A liquid cooled planer including: one or more computing components mounted on the planer, wherein at least one or more of the computing components is liquid cooled; one or more conductive cooling components mounted on the planer; and one or more convective cooling components mounted on the planer, wherein the convective cooling components are removable from the planer without removing the conductive cooling components from the planer.

摘要翻译： 一种液体冷却刨床，包括：一个或多个安装在所述刨床上的计算部件，其中至少一个或多个所述计算部件是液体冷却的; 安装在刨床上的一个或多个导电冷却组件; 以及安装在刨床上的一个或多个对流冷却部件，其中所述对流冷却部件可从所述刨床移除，而不从所述刨床移除所述导电冷却部件。

公开(公告)号：US20130135812A1

公开(公告)日：2013-05-30

申请号：US13305092

申请日：2011-11-28

申请人： Richard M. Barina ,  Vinod Kamath ,  Chunjian Ni ,  Derek I. Schmidt ,  Mark E. Steinke ,  James S. Womble

发明人： Richard M. Barina ,  Vinod Kamath ,  Chunjian Ni ,  Derek I. Schmidt ,  Mark E. Steinke ,  James S. Womble

IPC分类号： H05K7/20 ,  F28F9/02

CPC分类号： H01L23/473 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/4093 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A liquid-cooled computer memory system includes first and second blocks in fluid communication with a chilled liquid source. A plurality of spaced-apart heat transfer pipes extend along a system board between memory module sockets from the first manifold block to the second manifold block. The heat transfer pipes may be liquid flow pipes circulating the chilled liquid between the memory module sockets. Alternatively, the heat transfer pipes may be closed heat pipes that conduct heat from the memory modules to the liquid-cooled blocks. A separate heat spreader is provided to thermally bridge each memory module to the adjacent heat transfer pipes.

摘要翻译： 液冷计算机存储器系统包括与冷却液体源流体连通的第一和第二块。 多个间隔开的传热管沿着系统板在从第一歧管块到第二歧管块的存储器模块插槽之间延伸。 传热管可以是将冷却液体循环在存储器模块插槽之间的液体流管。 或者，传热管可以是将热量从存储器模块传导到液冷块的封闭热管。 提供单独的散热器以将每个存储器模块热桥接到相邻的传热管。

公开(公告)号：US20130120926A1

公开(公告)日：2013-05-16

申请号：US13293174

申请日：2011-11-10

申请人： Richard M. Barina ,  Vinod Kamath ,  Chunjian Ni ,  Derek I. Schmidt ,  Mark E. Steinke ,  James S. Womble

发明人： Richard M. Barina ,  Vinod Kamath ,  Chunjian Ni ,  Derek I. Schmidt ,  Mark E. Steinke ,  James S. Womble

IPC分类号： G06F1/20 ,  F28F7/00

CPC分类号： F28D15/0275 ,  G06F1/185 ,  G06F1/20 ,  H01L23/4093 ,  H01L23/427 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20509 ,  H05K7/20772 ,  H05K7/20809 ,  H01L2924/00

摘要： A cooling system for a memory module comprises a heat conduction assembly for conducting heat from the memory module to liquid-cooled mounting blocks. In one embodiment, each heat conduction assembly includes a frame having opposing first and second supports, first and second heat spreader plates each extending from the first support to the second support, and a pair of flattened heat pipes each extending along a respective one of the heat spreader plates from the first support to the second support. The liquid-cooled mounting blocks releasably support the heat conduction assembly over a memory module socket with the memory module between the heat spreader plates.

摘要翻译： 用于存储器模块的冷却系统包括用于将热量从存储器模块传导到液冷的安装块的热传导组件。 在一个实施例中，每个热传导组件包括具有相对的第一和第二支撑件的框架，每个从第一支撑件延伸到第二支撑件的第一和第二散热板，以及一对扁平化的热管， 散热板从第一支撑到第二支撑。 液体冷却的安装块通过存储器模块插座可释放地支撑热传导组件，存储器模块位于散热板之间。

公开(公告)号：US20120279233A1

公开(公告)日：2012-11-08

申请号：US13102195

申请日：2011-05-06

申请人： Timothy J. CHAINER ,  David P. GRAYBILL ,  Madhusudan K. IYENGAR ,  Vinod KAMATH ,  Bejoy J. KOCHUPARAMBIL ,  Roger R. SCHMIDT ,  Mark E. STEINKE

发明人： Timothy J. CHAINER ,  David P. GRAYBILL ,  Madhusudan K. IYENGAR ,  Vinod KAMATH ,  Bejoy J. KOCHUPARAMBIL ,  Roger R. SCHMIDT ,  Mark E. STEINKE

IPC分类号： F25B21/02

CPC分类号： H05K7/20763 ,  F25B21/02 ,  F25B21/04 ,  F25D17/06 ,  H05K7/20254 ,  H05K7/20263 ,  H05K7/20781 ,  H05K7/2079 ,  H05K7/20836

摘要： Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled structure, a thermal conduction path coupling the electronic component and the liquid-cooled structure, a coolant loop in fluid communication with a coolant-carrying channel of the liquid-cooled structure, and an outdoor-air-cooled heat exchange unit coupled to facilitate heat transfer from the liquid-cooled structure via, at least in part, the coolant loop. The thermoelectric array facilitates transfer of heat from the electronic component to the liquid-cooled structure, and the heat exchange unit cools coolant passing through the coolant loop by dissipating heat from the coolant to outdoor ambient air. In one implementation, temperature of coolant entering the liquid-cooled structure is greater than temperature of the outdoor ambient air to which heat is dissipated.

摘要翻译： 提供了用于促进电子部件的冷却的装置和方法。 该装置包括液冷结构，耦合电子部件和液冷结构的热传导路径，与液冷结构的冷却剂传送通道流体连通的冷却剂回路，室外空气冷却 热交换单元被耦合以便于至少部分地通过冷却剂回路从液冷结构经由热传递。 热电阵列有助于将热量从电子部件传递到液冷结构，并且热交换单元通过将冷却剂的热量散发到室外环境空气来冷却通过冷却剂回路的冷却剂。 在一个实施方案中，进入液冷结构的冷却剂的温度大于散热的室外环境空气的温度。

公开(公告)号：US08139355B2

公开(公告)日：2012-03-20

申请号：US12786067

申请日：2010-05-24

申请人： David R. Motschman ,  Mark E. Steinke, Jr. ,  Aparna Vallury

发明人： David R. Motschman ,  Mark E. Steinke, Jr. ,  Aparna Vallury

IPC分类号： H05K7/20

CPC分类号： G06F1/20 ,  H01L23/3672 ,  H01L23/3675 ,  H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

摘要： One embodiment of the present invention provides a computer memory system that includes at least one DIMM connector having a DIMM socket for releasably receiving a terminal edge of a DIMM. A metallic or otherwise highly heat-conductive base is secured to the DIMM connector. A pair of heat spreaders is secured to the base on opposing sides of the DIMM socket. Each heat spreader includes a DIMM-engagement portion spaced from the base. The heat spreaders are nondestructively moveable between an open position spaced apart for receiving the DIMM between the heat spreaders and a closed position for thermally engaging opposing faces of the DIMM. The heat spreaders provide a continuous thermally-conductive pathway between the DIMM-engagement portion and the base. Heatsink fins extend laterally from the base to provide cooling.

摘要翻译： 本发明的一个实施例提供了一种计算机存储器系统，其包括具有用于可释放地接收DIMM的终端边缘的DIMM插槽的至少一个DIMM连接器。 金属或其他高度导热的基座固定到DIMM连接器。 一对散热器在DIMM插槽的相对侧固定到基座。 每个散热器包括与基座间隔开的DIMM接合部分。 散热器在间隔开的开放位置之间是非破坏性的，以在散热器之间接收DIMM，并且用于热接合DIMM的相对面的闭合位置。 散热器在DIMM接合部分和基座之间提供连续的导热通路。 散热片从基座横向延伸以提供冷却。