公开(公告)号：US08225803B2

公开(公告)日：2012-07-24

申请号：US13100484

申请日：2011-05-04

申请人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Toshio Yokoyama ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Kobayashi ,  Mitsuru Miyazaki ,  Yasuyuki Motojima

发明人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Toshio Yokoyama ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Kobayashi ,  Mitsuru Miyazaki ,  Yasuyuki Motojima

IPC分类号： B08B13/00

CPC分类号： H01L21/68721 ,  C23C18/163 ,  C23C18/1632 ,  C23C18/1886 ,  C25D7/123 ,  C25D17/001 ,  H01L21/67126 ,  H01L21/67766 ,  Y10S134/901

摘要： A substrate processing method and apparatus can securely carry out a pre-plating treatment that enables uniform plating in the necessary area of the surface of a substrate. The substrate processing method carries out a cleaning treatment and a catalyst-imparting treatment of a surface of a substrate as pre-plating treatments and then electroless plates a metal film on the catalyst-imparted surface of the substrate. The cleaning treatment is carried out in a wider area of the surface of the substrate than that area to which a catalyst is imparted by the catalyst-imparting treatment.

摘要翻译： 基板处理方法和装置可以可靠地执行能够在基板的表面的必要区域中均匀镀覆的预镀处理。 基板处理方法对作为预镀处理的基板的表面进行清洗处理和催化剂赋予处理，然后在基板的赋予催化剂的表面上化学镀金属膜。 在通过催化剂赋予处理赋予催化剂的区域的基板的表面的更宽的区域中进行清洗处理。

公开(公告)号：US20120141246A1

公开(公告)日：2012-06-07

申请号：US13398216

申请日：2012-02-16

申请人： Masahiko SEKIMOTO ,  Seiji Katsuoka ,  Naoki Dai ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Suzuki ,  Kenichi Kobayashi ,  Yasuyuki Motoshima ,  Ryo Kato

发明人： Masahiko SEKIMOTO ,  Seiji Katsuoka ,  Naoki Dai ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Suzuki ,  Kenichi Kobayashi ,  Yasuyuki Motoshima ,  Ryo Kato

IPC分类号： H01L21/683

CPC分类号： H01L21/67086 ,  H01L21/67051 ,  H01L21/687

摘要： A substrate holding apparatus can meet the request for a smaller-sized compact apparatus while ensuring a sufficient immersion depth of a substrate in a processing liquid. The substrate holding apparatus includes: a substrate holder for supporting a substrate (W) by bringing a peripheral portion of a surface of the substrate (W) into contact with a first sealing member; and a substrate pressing section for lowering relative to the substrate holder so as to press the substrate (W) held by the substrate holder downward, thereby bringing a first sealing member into pressure contact with the substrate (W). The substrate pressing section is provided with a second ring-shaped sealing member which makes pressure contact with an upper surface of a ring-shaped holding section of the substrate holder, thereby sealing the peripheral region of the substrate pressing section.

摘要翻译： 基板保持装置可以满足对较小尺寸的小型装置的要求，同时确保基板在处理液体中的足够的浸入深度。 基板保持装置包括：基板保持件，用于通过使基板（W）的表面的周边部分与第一密封构件接触来支撑基板（W）; 以及基板按压部，其相对于基板保持件下降，以将由基板保持件保持的基板（W）向下压，从而使第一密封部件与基板（W）压力接触。 基板按压部设置有与基板保持件的环状保持部的上表面压力接触的第二环状密封部件，从而密封基板按压部的周边区域。

公开(公告)号：US20090301395A1

公开(公告)日：2009-12-10

申请号：US12543832

申请日：2009-08-19

申请人： Masahiko SEKIMOTO ,  Yasuhiko Endo ,  Stephen Strausser ,  Takashi Takemura ,  Nobutoshi Saito ,  Fumio Kuriyama ,  Junichiro Yoshioka ,  Kuniaki Horie ,  Yoshio Minami ,  Kenji Kamoda

发明人： Masahiko SEKIMOTO ,  Yasuhiko Endo ,  Stephen Strausser ,  Takashi Takemura ,  Nobutoshi Saito ,  Fumio Kuriyama ,  Junichiro Yoshioka ,  Kuniaki Horie ,  Yoshio Minami ,  Kenji Kamoda

IPC分类号： B05C13/02

CPC分类号： C25D5/022 ,  C25D7/123 ,  C25D17/001 ,  H01L21/2885 ,  H01L21/67173 ,  H01L21/6723 ,  H01L24/11 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2224/05647 ,  H01L2924/00014

摘要： A plating apparatus has an ashing unit (300) configured to perform an ashing process on a resist (502) applied on a surface of a seed layer (500) formed on a substrate (W), and a pre-wetting section (26) configured to provide hydrophilicity to a surface of the substrate after the ashing process. The plating apparatus includes a pre-soaking section (28) configured to bring the surface of the substrate into contact with a treatment solution to clean or activate a surface of the seed layer formed on the substrate. The plating apparatus also includes a plating unit (34) configured to bring the surface of the substrate into a plating solution in a plating tank while the resist is used as a mask so as to form a plated film (504) on the surface of the seed layer formed on the substrate.

摘要翻译： 电镀装置具有灰化单元（300），其被配置为对施加在形成在基板（W）上的籽晶层（500）的表面上的抗蚀剂（502）和预润湿部分（26）进行灰化处理， 被配置为在灰化过程之后向基板的表面提供亲水性。 电镀装置包括预浸渍部分（28），其被配置为使基材的表面与处理溶液接触以清洁或活化形成在基材上的种子层的表面。 电镀装置还包括电镀单元（34），其被配置为在将抗蚀剂用作掩模的同时使基板的表面进入电镀槽中的镀液中，以在该表面上形成镀膜（504） 种子层形成在基底上。

公开(公告)号：US07575636B2

公开(公告)日：2009-08-18

申请号：US11455777

申请日：2006-06-20

申请人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Toshio Yokoyama ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Kobayashi ,  Mitsuru Miyazaki ,  Yasuyuki Motoshima ,  Akira Owatari ,  Naoki Dai

发明人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Toshio Yokoyama ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Kobayashi ,  Mitsuru Miyazaki ,  Yasuyuki Motoshima ,  Akira Owatari ,  Naoki Dai

IPC分类号： B05C3/02

CPC分类号： H01L21/67161 ,  C23C18/1628 ,  C23C18/1893 ,  C25D7/123 ,  C25D17/001 ,  C25D17/08 ,  H01L21/67051 ,  H01L21/67126 ,  H01L21/67173 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/6723 ,  H01L21/67742 ,  H01L21/67751 ,  H01L21/67766 ,  H01L21/67781 ,  H01L21/68707 ,  H01L21/68721 ,  Y10S134/902 ,  Y10T279/11

摘要： The present invention relates to a substrate processing apparatus useful for plating a substrate or processing a substrate by dipping a substrate in a processing liquid. A substrate processing apparatus of the present invention includes: a loading/unloading area for carrying in and out a substrate; a cleaning area for cleaning the substrate; and a plating area for plating the substrate. The loading/unloading area is provided with a substrate transfer robot having a plurality of hands of dry-use design, a loading port mounted with a cassette for housing substrates, and a reversing machine of dry-use design for reversing the substrate from face up to face down.

摘要翻译： 本发明涉及通过将基板浸渍在处理液中而用于电镀基板或加工基板的基板处理装置。 本发明的基板处理装置包括：用于搬入和取出基板的装载/卸载区域; 用于清洁衬底的清洁区域; 以及用于电镀基板的电镀区域。 装载/卸载区域设置有具有多个干用设计的手的基板传送机器人，安装有用于容纳基板的盒的装载端口和用于将基板从面朝上翻转的干式设计的反转机 面对下来

公开(公告)号：US20090045068A1

公开(公告)日：2009-02-19

申请号：US12071353

申请日：2008-02-20

申请人： Masahiko Sekimoto ,  Fumio Kuriyama ,  Yasuhiko Endo ,  Stephen Strausser

发明人： Masahiko Sekimoto ,  Fumio Kuriyama ,  Yasuhiko Endo ,  Stephen Strausser

IPC分类号： C25D5/08 ,  C25D17/00

CPC分类号： C25D5/08

摘要： A plating apparatus and method bubbles generated at the plating surfaces easily removed and the uniformity of the thickness of the plated film within the plated surface can be improved. The plating apparatus has a cassette table for loading a cassette in which a substrate having a plating surface is contained. An aligner for aligning the substrate, a rinser-dryer for rinsing and drying the substrate, and a plating unit for plating the substrate are also provided. The plating unit includes a plating vessel containing a plating solution, and a holder holds the substrate to immerse the substrate in the plating solution in the plating vessel. The plating surface is exposed to a nozzle which ejects the plating solution toward the plating surface.

摘要翻译： 可以容易地去除在电镀面上产生的电镀装置和方法，并且可以提高电镀表面内的镀膜厚度的均匀性。 电镀装置具有用于装载其中包含具有电镀表面的基板的盒的盒台。 还提供了用于对准衬底的校准器，用于冲洗和干燥衬底的洗衣机 - 干燥器，以及用于电镀衬底的电镀单元。 电镀单元包括含有电镀液的电镀槽，保持器保持基板将基板浸入电镀槽中的电镀液中。 电镀表面暴露于喷镀电镀溶液朝向电镀面的喷嘴。

公开(公告)号：US20070263028A1

公开(公告)日：2007-11-15

申请号：US11585568

申请日：2006-10-24

申请人： Takeshi Zengo ,  Masahiko Sekimoto ,  Satoshi Mohri ,  Toru Nishida

发明人： Takeshi Zengo ,  Masahiko Sekimoto ,  Satoshi Mohri ,  Toru Nishida

IPC分类号： B41J2/165

CPC分类号： B41J2/16552 ,  B41J2/16535 ,  B41J2/16585 ,  B41J11/007 ,  B41J29/17

摘要： A droplet discharge apparatus, comprising: a droplet discharge head for discharging droplets, an opposing member, facing the droplet discharge head, an applying member which applies, to the opposing member, application liquid having a characteristic of repelling liquid discharged from the droplet discharge head, and a blade which is in contact with the opposing member and cleans the opposing member, the blade having a characteristic of an affinity to the application liquid at least at a contact portion with the opposing member.

摘要翻译： 一种液滴喷射装置，包括：用于排出液滴的液滴喷射头，面对液滴喷射头的相对构件;施加构件，其向相对构件施加具有排出从液滴喷射头排出的液体的特性的涂布液 以及与相对构件接触并清洁相对构件的叶片，所述叶片具有至少与相对构件的接触部分对施用液体具有亲和性的特性。

公开(公告)号：US20060243205A1

公开(公告)日：2006-11-02

申请号：US11455777

申请日：2006-06-20

申请人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Toshio Yokoyama ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Kobayashi ,  Mitsuru Miyazaki ,  Yasuyuki Motoshima ,  Akira Owatari ,  Naoki Daj

发明人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Toshio Yokoyama ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Kobayashi ,  Mitsuru Miyazaki ,  Yasuyuki Motoshima ,  Akira Owatari ,  Naoki Daj

IPC分类号： B05C3/02 ,  B05C13/00

CPC分类号： H01L21/67161 ,  C23C18/1628 ,  C23C18/1893 ,  C25D7/123 ,  C25D17/001 ,  C25D17/08 ,  H01L21/67051 ,  H01L21/67126 ,  H01L21/67173 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/6723 ,  H01L21/67742 ,  H01L21/67751 ,  H01L21/67766 ,  H01L21/67781 ,  H01L21/68707 ,  H01L21/68721 ,  Y10S134/902 ,  Y10T279/11

摘要： The present invention relates to a substrate processing apparatus useful for plating a substrate or processing a substrate by dipping a substrate in a processing liquid. A substrate processing apparatus of the present invention includes: a loading/unloading area for carrying in and out a substrate; a cleaning area for cleaning the substrate; and a plating area for plating the substrate. The loading/unloading area is provided with a substrate transfer robot having a plurality of hands of dry-use design, a loading port mounted with a cassette for housing substrates, and a reversing machine of dry-use design for reversing the substrate from face up to face down.

公开(公告)号：US07087117B2

公开(公告)日：2006-08-08

申请号：US10712348

申请日：2003-11-14

申请人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Toshio Yokoyama ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Kobayashi ,  Mitsuru Miyazaki ,  Yasuyuki Motoshima ,  Akira Owatari ,  Naoki Dai

发明人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Toshio Yokoyama ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Kobayashi ,  Mitsuru Miyazaki ,  Yasuyuki Motoshima ,  Akira Owatari ,  Naoki Dai

IPC分类号： B05C5/02 ,  B23H7/00

CPC分类号： H01L21/67161 ,  C23C18/1628 ,  C23C18/1893 ,  C25D7/123 ,  C25D17/001 ,  C25D17/08 ,  H01L21/67051 ,  H01L21/67126 ,  H01L21/67173 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/6723 ,  H01L21/67742 ,  H01L21/67751 ,  H01L21/67766 ,  H01L21/67781 ,  H01L21/68707 ,  H01L21/68721 ,  Y10S134/902 ,  Y10T279/11

摘要： The present invention relates to a substrate processing apparatus useful for plating a substrate or processing a substrate by dipping a substrate in a processing liquid. A substrate processing apparatus of the present invention includes: a loading/unloading area for carrying in and out a substrate; a cleaning area for cleaning the substrate; and a plating area for plating the substrate. The loading/unloading area is provided with a substrate transfer robot having a plurality of hands of dry-use design, a loading port mounted with a cassette for housing substrates, and a reversing machine of dry-use design for reversing the substrate from face up to face down.

公开(公告)号：US20050092600A1

公开(公告)日：2005-05-05

申请号：US11002060

申请日：2004-12-03

申请人： Junichiro Yoshioka ,  Seiji Katsuoka ,  Masahiko Sekimoto ,  Yasuhiko Endo ,  Yugang Guo

发明人： Junichiro Yoshioka ,  Seiji Katsuoka ,  Masahiko Sekimoto ,  Yasuhiko Endo ,  Yugang Guo

IPC分类号： C25D7/12 ,  C25D17/06 ,  C25D19/00 ,  H01L21/00 ,  H01L21/60 ,  H01L21/683 ,  H01L21/687 ,  C25D17/00

CPC分类号： H01L21/67126 ,  C25D7/123 ,  C25D17/001 ,  C25D17/06 ,  H01L21/68721 ,  H01L21/68764 ,  H01L21/68785

摘要： A substrate holder holds a substrate while hermetically sealing an outer circumferential edge and a reverse side of the substrate and exposing a surface of the substrate. The substrate holder has a base and a cover having an opening defined therein and positioned to place the substrate between the base and the cover. An attracting mechanism couples the base and the cover to each other to hold the substrate between the base and the cover, with the surface of the substrate being exposed through the opening.

摘要翻译： 衬底保持器保持衬底，同时气密地密封衬底的外周边缘和反面，并暴露衬底的表面。 衬底保持器具有基部和盖，其具有限定在其中的开口并且定位成将基板放置在基部和盖之间。 吸引机构将基部和盖彼此连接以将基板保持在基部和盖之间，其中基板的表面通过开口露出。

公开(公告)号：US06682408B2

公开(公告)日：2004-01-27

申请号：US10026763

申请日：2001-12-27

申请人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Nobuyuki Takada ,  Satoshi Wakabayashi ,  Kenichiro Saito ,  Masahiko Sekimoto ,  Takuji Hayama ,  Daisuke Koga

发明人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Nobuyuki Takada ,  Satoshi Wakabayashi ,  Kenichiro Saito ,  Masahiko Sekimoto ,  Takuji Hayama ,  Daisuke Koga

IPC分类号： B24B100

CPC分类号： B24B37/345 ,  B24B37/042 ,  H01L21/30625

摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece, at least three cleaning apparatuses for cleaning polished workpieces, and a transfer structure for transferring the polished workpieces between at least three cleaning apparatuses. The polishing apparatus further includes a rotary transporter disposed in a position which can be accessed by said top rings and having a plurality of portions positioned on a predetermined circumference from a center of rotation of the rotary transporter for holding the workpieces.