摘要:
An electrostatic chuck is provided with a ceramic substrate 12 in which an electrode 14 is embedded, an electrode terminal 14a exposed at the bottom of a concave portion 16 disposed on the back surface of the ceramic substrate 12, a power feed member 20 to supply an electric power to the electrode 14, and a joining layer 22 to connect this power feed member 20 to the ceramic substrate 12. The joining layer 22 is formed by using a AuGe based alloy, a AuSn based alloy, or a AuSi based alloy. The ceramic substrate 12 and the power feed member 20 are selected in such a way that the thermal expansion coefficient difference D calculated by subtracting the thermal expansion coefficient of the ceramic substrate 12 from the thermal expansion coefficient of the power feed member 20 satisfies −2.2≦D≦6 (unit: ppm/K).
摘要:
A different materials bonded member includes a ceramic base material and a metallic member which are bonded together through an Au solder material. The solder material is disposed on a bonding surface of the ceramic base through a given active metal layer or a given metalized layer and the solder material is heated and melted to form a pre-coat layer adhering to the bonding surface, the metallic member is disposed on a surface of the pre-coat layer through a barrier layer having a given function. A bonded part is formed by solidifying the pre-coat layer after it has been heated and melted under given temperature conditions to bond the ceramic base and the metallic member to one another.
摘要:
A method for producing a circuit board having a metal circuit pattern on an insulating substrate is provided, including the steps of joining a metal plate onto a surface of the insulating substrate using a hard brazing member containing an active element and removing unnecessary conductive layer portions adjacent a metal circuit pattern of the metal plate to at least partially expose a portion of the surface of the insulating substrate.
摘要:
A laminated radiation member includes a radiation plate, an insulation substrate bonded to the upper surface of the radiation plate and an electrode provided on the upper surface of the insulation substrate. The laminated radiation member is made by a method including the steps of surface treating a bonding surface of the radiation plate and/or the insulation substrate, interposing ceramic particles surface treated to assure wettability with a hard solder or a metal between the radiation plate and the insulation substrate, disposing a hard solder above and/or below the ceramic particles, heating the hard solder to a temperature higher than the melting point of the solder, penetrating the molten hard solder into spaces between the ceramic particles to react the ceramic particles with the solder to produce a metal base composite material, and bonding the radiation plate and the insulation substrate with the metal base composite material.
摘要:
A bonded member including a ceramic base material 1 and a metallic member 7 which are bonded together, wherein a solder material 5 comprising Au is disposed on the surface of the ceramic base material 1 via an active metal layer, the active metal layer and the solder material 5 are molten by heating so as to form a precoat layer 6, the metallic member 7 is disposed on the surface of the precoat layer 6 via an insertion metal layer comprising pure metal which may form an alloy having a lower melting point than Au with Au or an alloy of the pure metal and Au, and the insertion metal layer and at least a portion in the vicinity of the interface between the insertion metal layer and the precoat layer 6 are molten by heating to bond the metallic member 7 and the precoat layer 6.
摘要:
A member for use in an electronic circuit has a thermally conductive layer mounted on a heat sink. The thermally conductive layer comprises an insulating substrate, a first joint member joining the insulating substrate to the heat sink and containing an active element, a second joint member disposed on the insulating substrate, and an electrode disposed on the second joint member. The insulating substrate comprises an AlN layer or an Si3N4 layer. Each of the first and second joint members is made of a hard brazing material containing an active element. The heat sink is made of an SiC/Cu composite material or a C/Cu composite material.
摘要翻译:用于电子电路的部件具有安装在散热器上的导热层。 导热层包括绝缘基板,将绝缘基板连接到散热器并且包含有源元件的第一接合构件,设置在绝缘基板上的第二接头构件和设置在第二接头构件上的电极。 绝缘衬底包括AlN层或Si 3 N 4 N 4层。 第一和第二接头构件中的每一个由包含有源元件的硬钎焊材料制成。 散热片由SiC / Cu复合材料或C / Cu复合材料制成。
摘要:
A bonded member includes a ceramic base material and a metal member solid-phase bonded via a soldering material. An active metal is placed on a surface of the ceramic base material and the soldering material, which includes Au, is placed on the active metal, and the active metal and the soldering material are heated so as to form a precoat layer. The metal member is placed on the surface of the precoat layer via a barrier layer, which is capable of inhibiting diffusion of a metal constituting the metal member, and the precoat layer and the metal member are pressurized heated so as to be solid-phase bonded. The production method of the bonded member is also disclosed.
摘要:
A method for manufacturing an alumina sintered body of the present invention comprises: (a) forming a mixed powder containing at least Al2O3 and MgF2 or a mixed powder containing Al2O3, MgF2, and MgO into a compact having a predetermined shape; and (b) performing hot-press sintering of the compact in a vacuum atmosphere or a non-oxidizing atmosphere to form an alumina sintered body, in which when a amount of MgF2 to 100 parts by weight of Al2O3 is represented by X (parts by weight), and a hot-press sintering temperature is represented by Y (° C.), the hot-press sintering temperature is set to satisfy the following equations (1) to (4) 1,120≦Y≦1,300 (1) 0.15≦X≦1.89 (2) Y≦−78.7X+1,349 (3) Y≧−200X+1,212 (4).
摘要翻译:本发明的氧化铝烧结体的制造方法包括:(a)将至少包含Al 2 O 3和MgF 2的混合粉末或含有Al 2 O 3,MgF 2和MgO的混合粉末形成为具有预定形状的压块; 和(b)在真空气氛或非氧化性气氛中对压实体进行热压烧结,以形成氧化铝烧结体,其中当MgF2与100重量份的Al 2 O 3的量以X表示时 重量),热压烧结温度由Y(℃)表示,热压烧结温度设定为满足下述式(1)〜(4)1,120≦̸ Y≦̸ 1,300(1)0.15 ≦̸ X≦̸ 1.89(2)Y≦̸ -78.7X + 1,349(3)Y≥-200X + 1,212(4)。
摘要:
A different materials bonded member includes a ceramic base material and a metallic member which are bonded together through an Au solder material. The solder material is disposed on a bonding surface of the ceramic base through a given active metal layer or a given metalized layer and the solder material is heated and melted to form a pre-coat layer adhering to the bonding surface, the metallic member is disposed on a surface of the pre-coat layer through a barrier layer having a given function. A bonded part is formed by solidifying the pre-coat layer after it has been heated and melted under given temperature conditions to bond the ceramic base and the metallic member to one another.
摘要:
An adhesive composition is provided for bonding two or more different members which can give a bonded material having excellent heat resistance characteristics while inhibiting breakage of the materials to be bonded by reducing the expansion coefficient, the Young's modulus and the proof stress value. A method for bonding two or more different members using the adhesive composition, and a composite member comprising two or more different members bonded by the above method can be provided by the adhesive composition which comprises a hard solder and a mixture of at least two fine particle materials differing in wettability with the hard solder and which is controlled in expansion coefficient, Young's modulus and proof stress value.