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公开(公告)号：US20080101746A1
公开(公告)日：2008-05-01
申请号：US11553743
申请日：2006-10-27
申请人： Toru Okada , Masanao Fujii , Yutaka Noda
发明人： Toru Okada , Masanao Fujii , Yutaka Noda
IPC分类号： G02B6/12
CPC分类号： G03B17/00 , H05K3/303 , H05K2201/0305 , H05K2201/09781 , H05K2201/10121 , H05K2201/10727 , H05K2203/0182 , Y02P70/613
摘要： An optical module has a substrate having a substrate surface provided with terminal pads and landing pads, and an optical element package having terminals and mounted on the substrate surface with a gap formed therebetween. The gap between the optical element package and the substrate surface is determined by the landing pads when the optical element package is mounted on the substrate surface. The terminal pads and the landing pads are exposed in a state where the optical element package is mounted on the substrate surface, and the terminal pads are electrically connected to corresponding terminals by solder.
摘要翻译： 光学模块具有具有设置有端子焊盘和着陆焊盘的基板表面的基板，以及具有端子的光学元件封装，并且安装在基板表面上，其间形成有间隙。 当光学元件封装安装在基板表面上时，光学元件封装和基板表面之间的间隙由着陆焊盘确定。 端子焊盘和着陆焊盘在光学元件封装安装在基板表面上的状态下露出，并且端子焊盘通过焊料电连接到相应的端子。
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2.发明申请公开(公告)号：US20080020561A1
公开(公告)日：2008-01-24
申请号：US11864600
申请日：2007-09-28
申请人： Masanao FUJII , Toru OKADA , Yutaka NODA , Ryoji MATSUYAMA , Hidehiko KOBAYASHI , Hisao TANAKA
发明人： Masanao FUJII , Toru OKADA , Yutaka NODA , Ryoji MATSUYAMA , Hidehiko KOBAYASHI , Hisao TANAKA
IPC分类号： H01L21/44
CPC分类号： H01L21/4853 , B23K3/0623 , H01L2224/11334 , H05K3/3478 , H05K2203/0195 , H05K2203/041 , H05K2203/081 , H05K2203/082
摘要： The present invention relates to a ball capturing apparatus and method of capturing one ball from plural balls having the same size, and to a solder ball disposing apparatus and method of disposing a solder ball containing solder in a predetermined position on a circuit board, thereby reliably capturing one ball from the plural balls having the same size. The apparatus includes: a holding member 111 including a holding wall 111a air-tightly closing a space S that holds a plurality of balls B having the same size and in which a hole 1111 larger than a size of one ball and smaller than a size of two balls is formed in an upper part of the holding wall; blowup means 112 for blowing the balls B held in the holding member 111 upward; and capturing means 12 for capturing a ball B blown up by the blowup means 112 and reached the hole.
摘要翻译： 本发明涉及一种从具有相同尺寸的多个球捕获一个球的球捕获装置和方法，以及一种焊球设置装置和将含有焊料的焊球放置在电路板上的预定位置的方法，从而可靠地 从具有相同尺寸的多个球捕获一个球。 该装置包括：保持构件111，其包括保持壁111，气密地封闭保持具有相同尺寸的多个球B的空间S，并且其中具有大于一个球的尺寸的孔1111并且小于一个球的尺寸 两个球形成在保持壁的上部; 用于将保持在保持构件111中的球B向上吹的吹出装置112; 以及捕获装置12，用于捕获由喷射装置112吹起的球B并到达该孔。
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公开(公告)号：US20070102441A1
公开(公告)日：2007-05-10
申请号：US11360627
申请日：2006-02-24
CPC分类号： B65G51/02 , B65G47/1407
摘要： A disclosed component supplying apparatus includes a component installment part for installing one or more components therein, a blowout port including an opening from which air is blown into the component installment part, and a component supply part into which the components are guided from the component installment part by the air from the blowout port. The component supply part is provided in communication with an upper end part of a sidewall of the component installment part.
摘要翻译： 所公开的部件供给装置包括用于在其中安装一个或多个部件的部件安装部，包括空气吹入部件安装部的开口的吹出口，以及从部件安装部向该部件引导部件的部件供给部 部分来自井喷口的空气。 元件供给部被设置成与部件安装部的侧壁的上端部连通。
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4.发明授权Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding method 失效压电元件与电极的接合方法以及使用该接合方法的压电微型致动器公开(公告)号：US06744183B2
公开(公告)日：2004-06-01
申请号：US10347708
申请日：2003-01-21
申请人： Masayuki Kitajima , Yutaka Noda , Seiichi Shimoura , Toru Okada , Masanao Fujii , Kenji Iketaki , Hidehiko Kobayashi , Masakazu Takesue , Keiichi Yamamoto , Hisao Tanaka
发明人： Masayuki Kitajima , Yutaka Noda , Seiichi Shimoura , Toru Okada , Masanao Fujii , Kenji Iketaki , Hidehiko Kobayashi , Masakazu Takesue , Keiichi Yamamoto , Hisao Tanaka
IPC分类号： H01L41047
CPC分类号： H01L41/29 , G11B5/5552 , G11B5/5556 , H01L41/0993 , H01L2224/48091 , H01L2224/73265 , H01L2924/01327 , Y10T29/42 , H01L2924/00014 , H01L2924/00
摘要： A method of bonding a piezoelectric element and an electrode, including the steps of forming a first coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the piezoelectric element, and forming a second coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the electrode. The combination of the materials of the first and second coatings is preferably Au/Au, Au/Al, Zn/Cu, or Sn/Cu. The method further includes the step of bringing the first and second coatings into close contact with each other and heating them under pressure to form a metallic bond or intermetallic compound between the first and second coatings, thereby bonding the piezoelectric element and the electrode.
摘要翻译： 一种键合压电元件和电极的方法，包括以下步骤：在压电元件的接合表面上形成选自Au，Al，Zn，Cu和Sn的材料的第一涂层，并形成 在电极的接合表面上第二次涂覆选自Au，Al，Zn，Cu和Sn的材料。 第一和第二涂层的材料的组合优选为Au / Au，Au / Al，Zn / Cu或Sn / Cu。 该方法还包括使第一和第二涂层彼此紧密接触并在压力下加热它们以在第一和第二涂层之间形成金属键或金属间化合物，从而结合压电元件和电极的步骤。
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公开(公告)号：US08153941B2
公开(公告)日：2012-04-10
申请号：US10199850
申请日：2002-07-19
CPC分类号： H01L41/313
摘要： A first plate material is set on a work stage. The first plate material includes first components commonly connected to a first connection member. A second plate material is subsequently set on the work stage. The second plate material includes second components commonly connected to a second connection member. The second components are superposed on the corresponding first components. The first components as well as the second components can be handled as a one-piece component. It leads to an improved productivity. Heat surfaces of a heat block contact the second components. The connection members are prevented from thermal expansion. The constant intervals are reliably maintained between the adjacent first components and the adjacent second components.
摘要翻译： 将第一板材放置在工作台上。 第一板材包括通常连接到第一连接构件的第一部件。 随后将第二板材置于工作台上。 第二板材包括通常连接到第二连接构件的第二部件。 第二组件叠加在相应的第一组件上。 第一组件以及第二组件可以作为单件组件来处理。 它可以提高生产率。 加热块的热表面与第二部件接触。 连接件防止热膨胀。 在相邻的第一部件和相邻的第二部件之间可靠地保持恒定间隔。
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公开(公告)号：US20100213248A1
公开(公告)日：2010-08-26
申请号：US12774881
申请日：2010-05-06
申请人： Keiichi YAMAMOTO , Masakazu TAKESUE , Masanao FUJII , Toru OKADA
发明人： Keiichi YAMAMOTO , Masakazu TAKESUE , Masanao FUJII , Toru OKADA
IPC分类号： B23K1/018
CPC分类号： H05K3/303 , H05K3/3494 , H05K13/0486 , H05K2203/0195 , H05K2203/176 , Y02P70/613
摘要： A method and an apparatus for removing a micro component surely and leveling solder remaining on a substrate without imposing thermal damage to solder lands, the substrate and components on the periphery. A thermosetting adhesive (15) is provided on the surface (12a) of a micro component (12) opposite to the side of a substrate (11), and the distal end of a component holding pin (13) having cross-section area falling within the surface (12a) of the micro component (12) opposite to the side of the surface (11) is passed through the thermosetting adhesive (15) to abut against the surface (12a) of the micro component (12). Subsequently, solder (16) between the micro component (12) and the substrate (11) is heated to melt and the component holding pin (13) is moved in the direction receding from the substrate (11). Consequently, the micro component (12) is removed from the substrate (11).
摘要翻译： 一种用于清除微量部件并且保持在基板上的焊料平整化的方法和装置，而不会对焊接区，基板和外围部件造成热损伤。 在与基板（11）侧相对的微型部件（12）的表面（12a）上设置有热固性粘合剂（15），并且部件保持销（13）的前端具有截面积下降 在微组件（12）的与表面（11）侧相反的表面（12a）内通过热固性粘合剂（15）以抵靠微组件（12）的表面（12a）。 随后，加热微型部件（12）和基板（11）之间的焊料（16）熔化，使部件保持销（13）从基板（11）退出的方向移动。 因此，从基板（11）移除微型部件（12）。
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公开(公告)号：US07356894B2
公开(公告)日：2008-04-15
申请号：US11006340
申请日：2004-12-07
CPC分类号： G11B5/5552 , H01L41/0993 , H01L41/313 , Y10T29/42 , Y10T29/49005 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913
摘要： In a method of producing a micro-actuator, a first adhesive is applied to a movable plate, and a movable, and a movable electrode is placed on the first adhesive. A second adhesive is applied to the movable electrode, and a piezoelectric element is placed on the second adhesive. Next, a third adhesive is applied to an actuator base, a base electrode is placed on the third adhesive, and the third adhesive is semi-cured in the same manner as above. A fourth adhesive is applied to the base electrode, the piezoelectric element is placed on the fourth adhesive, and the fourth adhesive is semi-cured in the same manner as above. Finally, the adhered laminate thus obtained is placed into a heating furnace and heated at a predetermined temperature for a predetermined period of time to thereby fully cure the adhesives.
摘要翻译： 在制造微致动器的方法中，将第一粘合剂施加到可动板上，并且可移动的电极和可动电极被放置在第一粘合剂上。 将第二粘合剂施加到可动电极上，并将压电元件放置在第二粘合剂上。 接下来，将第三粘合剂施加到致动器基座，将基极放置在第三粘合剂上，并且以与上述相同的方式将第三粘合剂半固化。 将第四粘合剂施加到基底电极上，将压电元件放置在第四粘合剂上，并且以与上述相同的方式将第四粘合剂半固化。 最后，将如此得到的粘合层叠体放入加热炉中并在预定温度下加热预定的时间，从而使粘合剂完全固化。
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公开(公告)号：US06903876B2
公开(公告)日：2005-06-07
申请号：US10309575
申请日：2002-12-04
CPC分类号： G02B27/0172 , G02B2027/0178
摘要： A body has a configuration in which a first ellipse has a first and second focal points and a second ellipse having a third and fourth points are arranged such that the second and third focal points coincide. This body is equivalent to an optical system having an optical path in which light gathered to the first focal point passes through the first focal point, and is reflected by a first concave reflecting surface, being a part of the first ellipse, to go through the second focal point, and then reflected by a second concave reflecting surface, being a part of the second ellipse, to be gathered to the fourth focal point.
摘要翻译： 主体具有其中第一椭圆具有第一和第二焦点的构造，并且具有第三和第四点的第二椭圆被布置成使得第二和第三焦点重合。 本体等效于具有聚光到第一焦点的光通过第一焦点的光路的光学系统，并且被作为第一椭圆的一部分的第一凹面反射面反射，穿过第一椭圆 第二焦点，然后被作为第二椭圆的一部分的第二凹面反射面反射，聚集到第四焦点。
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公开(公告)号：US06653761B2
公开(公告)日：2003-11-25
申请号：US09822621
申请日：2001-03-30
IPC分类号： H01L4108
CPC分类号： G11B5/5552 , H01L41/0993 , H01L41/313 , Y10T29/42 , Y10T29/49005 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913
摘要： In a method of producing a micro-actuator, a first adhesive is applied to a movable plate, and a movable electrode is placed on the first adhesive. The movable plate and the movable electrode are clamped between a first stage and a first head, followed by heating for a first predetermined period of time while exerting a first predetermined press load onto the first head to semi-cure the first adhesive. A second adhesive is applied to the movable electrode, and a piezoelectric element is placed on the second adhesive. The movable plate, the movable electrode and the piezoelectric element are clamped between the first stage and a second head, followed by heating for a second predetermined period of time while exerting a second predetermined press load onto the second head to semi-cure the second adhesive. Next, a third adhesive is applied to an actuator base, a base electrode is placed on the third adhesive, and the third adhesive is semi-cured in the same manner as above. A fourth adhesive is applied to the base electrode, the piezoelectric element is placed on the fourth adhesive, and the fourth adhesive is semi-cured in the same manner as above. Finally, the adhered laminate thus obtained is placed into a heating furnace and heated at a predetermined temperature for a predetermined period of time to thereby fully cure the adhesives.
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公开(公告)号：US07753251B2
公开(公告)日：2010-07-13
申请号：US11966410
申请日：2007-12-28
申请人： Keiichi Yamamoto , Masakazu Takesue , Masanao Fujii , Toru Okada
发明人： Keiichi Yamamoto , Masakazu Takesue , Masanao Fujii , Toru Okada
IPC分类号： B23K37/00
CPC分类号： H05K3/303 , H05K3/3494 , H05K13/0486 , H05K2203/0195 , H05K2203/176 , Y02P70/613
摘要： A method and a apparatus for removing a micro component surely and leveling solder remaining on a substrate without imposing thermal damage to solder lands, the substrate and components on the periphery. A thermosetting adhesive (15) is provided on the surface (12a) of a micro component (12) opposite to the side of a substrate (11), and the distal end of a component holding pin (13) having cross-section area falling within the surface (12a) of the micro component (12) opposite to the side of the surface (11) is passed through the thermosetting adhesive (15) to abut against the surface (12a) of the micro component (12). Subsequently, solder (16) between the micro component (12) and the substrate (11) is heated to melt and the component holding pin (13) is moved in the direction receding from the substrate (11). Consequently, the micro component (12) is removed from the substrate (11).
摘要翻译： 一种用于清除微量部件并且保持在衬底上的焊料平整化的方法和装置，而不会对焊盘，衬底和周边部件造成热损伤。 在与基板（11）侧相对的微型部件（12）的表面（12a）上设置有热固性粘合剂（15），并且部件保持销（13）的前端具有截面积下降 在微组件（12）的与表面（11）侧相反的表面（12a）内通过热固性粘合剂（15）以抵靠微组件（12）的表面（12a）。 随后，加热微型部件（12）和基板（11）之间的焊料（16）熔化，使部件保持销（13）从基板（11）退出的方向移动。 因此，从基板（11）移除微型部件（12）。
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