公开(公告)号：US20110262623A1

公开(公告)日：2011-10-27

申请号：US13178299

申请日：2011-07-07

申请人： Akira MIYATA ,  Masanori TATEYAMA

发明人： Akira MIYATA ,  Masanori TATEYAMA

IPC分类号： B05D5/12

CPC分类号： H01L21/67276

摘要： A transfer flow is produced in accordance with a process recipe of a process to be carried out. In the transfer flow, a type of modules listed in accordance with a substrate transfer order is associated with a necessary staying time from when the substrate is transferred into a module by a substrate transfer unit to when the substrate is ready to be transferred back to the substrate transfer unit after the corresponding process is finished. A cycle limiting time is determined to be the longest necessary transfer cycle time among those obtained by dividing the necessary staying time by the number of the modules mounted in the coater/developer. The number of the modules to be used is determined to be a value obtained by dividing the necessary staying time by the cycle limiting time or a nearest integer to which the value is raised.

摘要翻译： 根据要进行的方法的处理配方产生转移流。 在转移流程中，根据衬底转移顺序列出的一种类型的模块与从衬底转移到模块中的衬底转移单元到基板准备好被转移回到基板转移顺序的必要停留时间相关联 相应工艺完成后的基片转印单元。 将循环限制时间确定为通过将所需的停留时间除以安装在涂布机/显影剂中的模块的数量而获得的那些中最长的必需转印周期时间。 要使用的模块的数量被确定为通过将必要的停留时间除以周期限制时间或值被提升的最接近的整数而获得的值。

公开(公告)号：US08015940B2

公开(公告)日：2011-09-13

申请号：US12248534

申请日：2008-10-09

申请人： Akira Miyata ,  Masanori Tateyama

发明人： Akira Miyata ,  Masanori Tateyama

IPC分类号： B05C5/02

CPC分类号： H01L21/67276

摘要： A transfer flow is produced in accordance with a process recipe of a process to be carried out. In the transfer flow, a type of modules listed in accordance with a substrate transfer order is associated with a necessary staying time from when the substrate is transferred into a module by a substrate transfer unit to when the substrate is ready to be transferred back to the substrate transfer unit after the corresponding process is finished. A cycle limiting time is determined to be the longest necessary transfer cycle time among those obtained by dividing the necessary staying time by the number of the modules mounted in the coater/developer. The number of the modules to be used is determined to be a value obtained by dividing the necessary staying time by the cycle limiting time or a nearest integer to which the value is raised.

摘要翻译： 根据要进行的方法的处理配方产生转移流。 在转移流程中，根据衬底转移顺序列出的一种类型的模块与从衬底转移到模块中的衬底转移单元到基板准备好被转移回到基板转移顺序的必要停留时间相关联 相应工艺完成后的基片转印单元。 将循环限制时间确定为通过将所需的停留时间除以安装在涂布机/显影剂中的模块的数量而获得的那些中最长的必需转印周期时间。 要使用的模块的数量被确定为通过将必要的停留时间除以周期限制时间或值被提升的最接近的整数而获得的值。

公开(公告)号：US06507770B2

公开(公告)日：2003-01-14

申请号：US09874272

申请日：2001-06-06

申请人： Masanori Tateyama ,  Kenichi Okubo ,  Jun Ookura

发明人： Masanori Tateyama ,  Kenichi Okubo ,  Jun Ookura

IPC分类号： G06F700

CPC分类号： H01L21/67276 ,  G05B19/41865 ,  G05B2219/31407 ,  G05B2219/32305 ,  G05B2219/45031 ,  Y02P90/20

摘要： A system for successively extracting unprocessed substrates from a cassette, successively conveying the extracted substrates to a plurality of processing units, causing the processing units to process the substrates, and successively returning processed substrates to a cassette is disclosed. In the system, corresponding to a recipe that contains process conditions for each of at least one lot, a process start prediction time at which processes of each lot start and a process completion prediction time at which processes for each lot are completed are calculated for at least two processes. Corresponding to the process start prediction time and the process completion prediction time, at least one of optimum processing units that optimize processes for each lot is selected for each lot.

摘要翻译： 公开了一种用于从盒中连续提取未处理的基板的系统，将提取的基板连续地传送到多个处理单元，使处理单元处理基板，并将处理后的基板连续地返回到盒。 在该系统中，对应于包含至少一批中的每一批的处理条件的配方，每批次的处理开始的处理开始预测时间和完成每个批次的处理的处理完成预测时间被计算为 最少两个进程。 对应于过程开始预测时间和处理完成预测时间，为每个批次选择优化每个批次的处理的最优处理单元中的至少一个。

公开(公告)号：US06457882B2

公开(公告)日：2002-10-01

申请号：US09803966

申请日：2001-03-13

申请人： Kunie Ogata ,  Ryouichi Uemura ,  Masanori Tateyama ,  Yoshiyuki Nakajima

发明人： Kunie Ogata ,  Ryouichi Uemura ,  Masanori Tateyama ,  Yoshiyuki Nakajima

IPC分类号： G03D500

CPC分类号： G03F7/168 ,  G03F7/162

摘要： A substrate processing method for forming a resist film on a wafer with a base film being formed, and performing an exposure processing and a developing processing for the resist film to thereby form a desired resist pattern, has a base reflected light analyzing step of radiating a light of the same wavelength as an exposure light radiated during the exposure processing to the base film and analyzing a reflected light, before forming the resist film, and a processing condition control step of controlling at least one of a resist film forming condition and an exposure processing condition, based on the analysis of the reflected light. The method makes it possible to control a line width of a resist pattern with high precision.

摘要翻译： 一种用于在形成基膜的晶片上形成抗蚀剂膜的基板处理方法，并且对抗蚀剂膜进行曝光处理和显影处理从而形成所需的抗蚀剂图案，具有基底反射光分析步骤， 在形成抗蚀剂膜之前，将与曝光处理期间所辐照的曝光光相同的波长的光和形成抗蚀剂膜的反射光进行分析，以及处理条件控制步骤，其控制抗蚀剂膜形成条件和曝光中的至少一种 处理条件，基于反射光的分析。 该方法可以高精度地控制抗蚀剂图案的线宽。

公开(公告)号：USRE37470E1

公开(公告)日：2001-12-18

申请号：US09388589

申请日：1999-09-02

申请人： Jun Ohkura ,  Naruaki Iida ,  Hiroyuki Kudou ,  Masanori Tateyama ,  Yasuhiro Sakamoto

发明人： Jun Ohkura ,  Naruaki Iida ,  Hiroyuki Kudou ,  Masanori Tateyama ,  Yasuhiro Sakamoto

IPC分类号： G03D500

CPC分类号： H01L21/6715 ,  H01L21/67781 ,  H01L21/68707

摘要： A wafer processing apparatus includes a common path, extending in a Y-axis direction, in which one wafer or a plurality of wafers are conveyed, a plurality of process units stacked on both sides of the common path to constitute multi-stage structures, a main handler moved in the common path in the Y-axis direction and rotated about a Z axis at an angle &thgr; to load/unload the wafer into/from the process units, an arm section arranged to move in the main handler in the Z-axis direction, a plurality of holding arms arranged in the arm section to constitute a multi-stage structure so as to respectively hold the wafers, each holding arm being advanced and retreated on an X-Y plane from the arm section, an optical sensor, arranged in the arm section, for detecting a holding state of the wafer in each of the plurality of holding arms, and a controller for controlling an operation of the main handler, an operation of the arm section, and operations of the plurality of holding arms on the basis of a detection result from the optical sensor, wherein the controller advances or retreats each holding arm while operating at least one of the main handler and the arm section, and causes the optical sensor to detect the holding state of the wafer by each holding arm before the holding arm reaches a corresponding one of the process units.

摘要翻译： 晶片处理装置包括在Y轴方向上延伸的公共路径，其中一个晶片或多个晶片被输送，多个处理单元堆叠在公共路径的两侧以构成多级结构， 主处理器沿着Y轴方向在公共路径中移动并且以角度θ围绕Z轴旋转以将晶片装载/卸载到处理单元中/从加工单元中卸载晶片，臂部分布置成在Z轴方向上移动到主处理器中， 多个保持臂，布置在所述臂部中，以构成多个阶段结构，以分别保持晶片，每个保持臂从臂部在XY平面上前进和后退;光学传感器，布置在 臂部，用于检测多个保持臂中的每一个中的晶片的保持状态;以及控制器，用于控制主处理器的操作，臂部的操作以及多个保持臂的操作 bas 具有来自光学传感器的检测结果，其中控制器在操作主处理器和臂部分中的至少一个的同时前进或后退每个保持臂，并且使得光学传感器通过每个保持臂检测晶片的保持状态 在握持臂到达相应的一个处理单元之前。

公开(公告)号：US5725664A

公开(公告)日：1998-03-10

申请号：US692436

申请日：1996-08-05

申请人： Mitsuhiro Nanbu ,  Naruaki Iida ,  Hideaki Gotou ,  Masanori Tateyama ,  Yuji Yoshimoto ,  Tomoko Ishimoto ,  Hidetami Yaegashi ,  Yasunori Kawakami ,  Takahide Fukuda ,  Akihiro Fujimoto ,  Takashi Takekuma ,  Hiroyuki Matsukawa

发明人： Mitsuhiro Nanbu ,  Naruaki Iida ,  Hideaki Gotou ,  Masanori Tateyama ,  Yuji Yoshimoto ,  Tomoko Ishimoto ,  Hidetami Yaegashi ,  Yasunori Kawakami ,  Takahide Fukuda ,  Akihiro Fujimoto ,  Takashi Takekuma ,  Hiroyuki Matsukawa

IPC分类号： H01L21/00 ,  H01L21/677 ,  B05C5/00

CPC分类号： H01L21/67265 ,  H01L21/67173 ,  H01L21/67766 ,  H01L21/67778 ,  Y10S134/902 ,  Y10S414/135 ,  Y10S414/136 ,  Y10S414/137 ,  Y10S414/141

摘要： An apparatus for subjecting a plurality of wafers to coating and heating treatments, including a coating section for subjecting the wafers to a coating treatment one by one, a heating section for subjecting wafers which have undergone the coating treatment to a heating treatment all together, and an interface section arranged between the coating section and the heating section. The wafers are heat-treated in the heat treatment section while the wafers are stacked at intervals in a vertical direction in a boat. The wafers which have undergone the coating treatment are loaded into the boat by a conveying member in the interface section. The conveying member and the boat are surrounded by a surrounding space formed by a casing at the interface section. A circulation line is combined with an air supply and exhaust system, for circulating air in the surrounding space. A dehumidifier is arranged on the circulation line for dehumidifying air in the circulation line to provide localized dehumidification of the surrounding space formed by the casing.

摘要翻译： 一种用于对多个晶片进行涂覆和加热处理的设备，包括用于对晶片进行一次涂覆处理的涂布部分，将经过涂覆处理的晶片全部进行加热处理的加热部分一起进行加热处理;以及 布置在涂覆部分和加热部分之间的界面部分。 在热处理部分中对晶片进行热处理，同时晶片在船上沿垂直方向间隔堆叠。 已经经过涂覆处理的晶片通过接口部分中的传送部件装载到船中。 输送构件和舟皿由在界面部分处由壳体形成的周围空间包围。 循环管线与供气和排气系统结合，用于在周围空间循环空气。 在循环管线上设置除湿器，用于对循环管线中的空气进行除湿，以提供由壳体形成的周围空间的局部除湿。

公开(公告)号：US08372480B2

公开(公告)日：2013-02-12

申请号：US13178299

申请日：2011-07-07

申请人： Akira Miyata ,  Masanori Tateyama

发明人： Akira Miyata ,  Masanori Tateyama

IPC分类号： B05D3/02 ,  B05D3/06

CPC分类号： H01L21/67276

摘要： A transfer flow is produced in accordance with a process recipe of a process to be carried out. In the transfer flow, a type of modules listed in accordance with a substrate transfer order is associated with a necessary staying time from when the substrate is transferred into a module by a substrate transfer unit to when the substrate is ready to be transferred back to the substrate transfer unit after the corresponding process is finished. A cycle limiting time is determined to be the longest necessary transfer cycle time among those obtained by dividing the necessary staying time by the number of the modules mounted in the coater/developer. The number of the modules to be used is determined to be a value obtained by dividing the necessary staying time by the cycle limiting time or a nearest integer to which the value is raised.

摘要翻译： 根据要进行的方法的处理配方产生转移流。 在转移流程中，根据衬底转移顺序列出的一种类型的模块与从衬底转移到模块中的衬底转移单元到基板准备好被转移回到基板转移顺序的必要停留时间相关联 相应工艺完成后的基片转印单元。 将循环限制时间确定为通过将所需的停留时间除以安装在涂布机/显影剂中的模块的数量而获得的那些中最长的必需转印周期时间。 要使用的模块的数量被确定为通过将必要的停留时间除以周期限制时间或值被提升的最接近的整数而获得的值。

公开(公告)号：US20090098298A1

公开(公告)日：2009-04-16

申请号：US12248534

申请日：2008-10-09

申请人： Akira MIYATA ,  Masanori Tateyama

发明人： Akira MIYATA ,  Masanori Tateyama

IPC分类号： B05D3/02 ,  B05C11/02

CPC分类号： H01L21/67276

摘要： A transfer flow is produced in accordance with a process recipe of a process to be carried out. In the transfer flow, a type of modules listed in accordance with a substrate transfer order is associated with a necessary staying time from when the substrate is transferred into a module by a substrate transfer unit to when the substrate is ready to be transferred back to the substrate transfer unit after the corresponding process is finished. A cycle limiting time is determined to be the longest necessary transfer cycle time among those obtained by dividing the necessary staying time by the number of the modules mounted in the coater/developer. The number of the modules to be used is determined to be a value obtained by dividing the necessary staying time by the cycle limiting time or a nearest integer to which the value is raised.

摘要翻译： 根据要进行的方法的处理配方产生转移流。 在转移流程中，根据衬底转移顺序列出的一种类型的模块与从衬底转移到模块中的衬底转移单元到基板准备好被转移回到基板转移顺序的必要停留时间相关联 相应工艺完成后的基片转印单元。 将循环限制时间确定为通过将所需的停留时间除以安装在涂布机/显影剂中的模块的数量而获得的那些中最长的必需转印周期时间。 要使用的模块的数量被确定为通过将必要的停留时间除以周期限制时间或值被提升的最接近的整数而获得的值。

公开(公告)号：US06834210B2

公开(公告)日：2004-12-21

申请号：US10014855

申请日：2001-12-14

申请人： Masanori Tateyama ,  Akira Miyata

发明人： Masanori Tateyama ,  Akira Miyata

IPC分类号： G06F1900

CPC分类号： H01L21/67178 ,  H01L21/67276

摘要： A substrate-processing system has several processing units, a loading/unloading section for transferring wafers to be processed to each unit and taking out processed wafers from each unit and a sub-arm mechanism for receiving/transferring the substrates from/to the loading/unloading section and transferring the substrates one by one to each unit. The processing units and the sub-arm mechanism are controlled by a controller so that each unit processes the substrates one by one in accordance with a one-cycle time that is the maximum period among periods t1/m to tn/m obtained by dividing periods t1 to tn by the number “m” of identical units of each processing unit. The controller sets a pre-waiting time (before processing) for each processing unit.

摘要翻译： 基板处理系统具有多个处理单元，用于将要处理的晶片转移到每个单元并从每个单元取出处理的晶片的装载/卸载部分和用于从所述装载/卸载部分接收/传送基板的子臂机构， 卸载部分并逐个传送到每个单元。 处理单元和副臂机构由控制器控制，使得每个单元根据通过分割周期获得的周期t1 / m至tn / m中的最大周期的一个周期时间逐个处理基板 t1到tn，每个处理单元的相同单元的数量“m”。 控制器为每个处理单元设置预先等待的时间（处理之前）。

公开(公告)号：US6054181A

公开(公告)日：2000-04-25

申请号：US692286

申请日：1996-08-05

申请人： Mitsuhiro Nanbu ,  Naruaki Iida ,  Hideaki Gotou ,  Masanori Tateyama ,  Yuji Yoshimoto ,  Tomoko Ishimoto ,  Hidetami Yaegashi ,  Yasunori Kawakami ,  Takahide Fukuda ,  Akihiro Fujimoto ,  Takashi Takekuma ,  Hiroyuki Matsukawa

发明人： Mitsuhiro Nanbu ,  Naruaki Iida ,  Hideaki Gotou ,  Masanori Tateyama ,  Yuji Yoshimoto ,  Tomoko Ishimoto ,  Hidetami Yaegashi ,  Yasunori Kawakami ,  Takahide Fukuda ,  Akihiro Fujimoto ,  Takashi Takekuma ,  Hiroyuki Matsukawa

IPC分类号： H01L21/00 ,  H01L21/677 ,  B05D3/12

CPC分类号： H01L21/67265 ,  H01L21/67173 ,  H01L21/67766 ,  H01L21/67778 ,  Y10S134/902 ,  Y10S414/135 ,  Y10S414/136 ,  Y10S414/137 ,  Y10S414/141

摘要： A method of subjecting a plurality of wafers to coating and beating treatments where a first boat is placed on a stage arranged in an interface section. The first boat is capable of containing the wafers stacked at intervals in a vertical direction. The stage is capable of moving in a horizontal direction, and has a plurality of positions for respectively placing a plurality of boats. The wafers are conveyed from a supply section to a coating section, and are subjected to a coating treatment one by one. The wafers, which have undergone the coating treatment, are conveyed to the interface section. The wafers, which have undergone the coating treatment, are loaded into the first boat placed on the stage, in the interface section. The first boat containing the wafers, which have undergone the coating treatment, is located at a transfer position by moving the stage. The first boat, located at a transfer position by moving the stage. The first boat, located at the transfer position, is conveyed from the stage into a heating section, and the wafers, which have undergone the coating treatment, are subjected to a heating treatment simultaneously and all together.

摘要翻译： 一种将多个晶片进行涂覆和打浆处理的方法，其中第一个船被放置在布置在界面部分中的台上。 第一艘船能够容纳沿垂直方向间隔堆叠的晶片。 舞台能够沿水平方向移动，并且具有用于分别放置多个船的多个位置。 将晶片从供给部输送到涂布部，并逐个进行涂布处理。 已经经过涂覆处理的晶片被输送到界面部分。 已经进行了涂覆处理的晶片被装载到接口部分中放置在载物台上的第一个舟皿中。 包含经过涂覆处理的晶片的第一艘船通过移动台架位于转移位置。 第一艘船，通过移动舞台位于转移位置。 位于转移位置的第一个船从载物台输送到加热部分，并且经过涂覆处理的晶片同时进行加热处理。