公开(公告)号：US09664452B2

公开(公告)日：2017-05-30

申请号：US14386614

申请日：2012-06-13

申请人： Masaru Takada ,  Hajime Sotokawa ,  Yuichi Ishimaru ,  Takanori Imai ,  Mitsuhiko Ohira ,  Hidemoto Arai ,  Makoto Fukaya ,  Fumiaki Baba ,  Koji Kise ,  Shinya Tokizaki ,  Yuichi Matsuo

发明人： Masaru Takada ,  Hajime Sotokawa ,  Yuichi Ishimaru ,  Takanori Imai ,  Mitsuhiko Ohira ,  Hidemoto Arai ,  Makoto Fukaya ,  Fumiaki Baba ,  Koji Kise ,  Shinya Tokizaki ,  Yuichi Matsuo

IPC分类号： F28F21/06 ,  F28D9/00 ,  F28F3/04 ,  F28D21/00 ,  F24F12/00

CPC分类号： F28D9/0062 ,  F24F12/006 ,  F28D9/0037 ,  F28D21/0015 ,  F28F3/048 ,  F28F21/065 ,  Y02B30/563

摘要： The present invention relates to a heat exchange element in which unit constituent members, each of which includes a partition member that has a heat-transfer property and a moisture permeability and a spacing member that holds the partition member with a predetermined spacing, are stacked and in which a primary air flow that passes along an upper surface side of the partition member and a secondary air flow that passes along an undersurface side of the partition member and crosses the primary air flow exchange heat and moisture through the partition member, wherein a detachment suppressing rib is provided on the opposite side of the spacing member when viewed from the partition member at a bonded portion between the partition member and the spacing member, and the partition member is sandwiched by the spacing member and the detachment suppressing rib.

公开(公告)号：US09049808B2

公开(公告)日：2015-06-02

申请号：US13213199

申请日：2011-08-19

申请人： Masaru Takada ,  Fusaji Nagaya

发明人： Masaru Takada ,  Fusaji Nagaya

IPC分类号： H05K1/16 ,  H05K3/46 ,  H01L23/498

CPC分类号： H05K3/4602 ,  H01L23/49822 ,  H01L23/49894 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K2201/0209 ,  H05K2201/09136 ,  H05K2201/09827 ,  H05K2201/09854 ,  Y10T29/49165 ,  H01L2224/05599

摘要： [Subject Matter] To provide a printed wiring board in which no warping occurs even if interlayer insulation layers without core material are laminated on a core substrate.[Solution(s)] To lower the thermal expansion coefficient (CTE) to 20˜40 ppm, inorganic particles are added to core substrate 30 formed by impregnating glass-cloth core material with glass-epoxy resin. Furthermore, thickness (a) of core substrate 30 is set at 0.2 mm, thickness (b) of upper-surface-side first interlayer insulation layer (50A) at 0.1 mm, and thickness (c) of lower-surface-side second interlayer insulation layer (50B) at 0.1 mm. In setting so, using thin core substrate 30 and interlayer insulation layers (50A, 50B) without core material, it is thought that warping does not occur in the printed wiring board.

摘要翻译： [主题]提供即使没有芯材的层间绝缘层层叠在芯基板上也不发生翘曲的印刷电路板。 [溶液]为了将热膨胀系数（CTE）降低到20〜40ppm，将无机颗粒加入到通过用玻璃 - 环氧树脂浸渍玻璃布芯材料而形成的芯基板30中。 此外，芯基板30的厚度（a）设定为0.2mm，上表面侧的第一层间绝缘层（50A）的厚度（b）为0.1mm，下表面侧的第二中间层的厚度（c） 绝缘层（50B）为0.1mm。 在这样设置时，使用没有芯材料的薄芯基板30和层间绝缘层（50A，50B），认为在印刷线路板上不发生翘曲。

公开(公告)号：US08607851B2

公开(公告)日：2013-12-17

申请号：US13006009

申请日：2011-01-13

申请人： Masaru Takada ,  Hidemoto Arai ,  Takanori Imai ,  Yoichi Sugiyama

发明人： Masaru Takada ,  Hidemoto Arai ,  Takanori Imai ,  Yoichi Sugiyama

IPC分类号： F28F3/00

CPC分类号： F28D9/0062 ,  F24F3/147 ,  F24F12/006 ,  F24F2003/1435 ,  F28D21/0015 ,  F28F3/025 ,  F28F2275/025 ,  Y02B30/563

摘要： A total heat exchanging element includes a partitioning component to which a water-soluble moisture-absorbing agent has been added that is a component partitioning between a first laminar air-flow path and a second laminar air-flow path that are layered; a spacing component that forms the first laminar air-flow path and the second laminar air-flow path and maintains a space between adjacent partitioning components; and an adhesive agent that adheres the partitioning component and the spacing component. The adhesive agent is a water-solvent-type adhesive agent impregnated with a water-soluble moisture-absorbing agent. The partitioning component and the spacing component are made from a liquid-absorbing material that absorbs water and substances dissolved in the water.

摘要翻译： 总热交换元件包括分层部件，添加了作为分层的第一层流空气流路和第二层流气路之间的部件的水溶性吸湿剂， 间隔部件，其形成第一层流气流路径和第二层流气流路径，并且在相邻的分隔部件之间保持空间; 以及粘合剂，其粘附分隔部件和间隔部件。 粘合剂是浸渍有水溶性吸湿剂的水溶剂型粘合剂。 分隔部件和间隔部件由吸收水分的液体吸收材料和溶解在水中的物质制成。

公开(公告)号：US20110108256A1

公开(公告)日：2011-05-12

申请号：US13006009

申请日：2011-01-13

申请人： Masaru TAKADA ,  Hidemoto Arai ,  Takanori Imai ,  Yoichi Sugiyama

发明人： Masaru TAKADA ,  Hidemoto Arai ,  Takanori Imai ,  Yoichi Sugiyama

IPC分类号： F28F3/08

CPC分类号： F28D9/0062 ,  F24F3/147 ,  F24F12/006 ,  F24F2003/1435 ,  F28D21/0015 ,  F28F3/025 ,  F28F2275/025 ,  Y02B30/563

摘要： A total heat exchanging element includes a partitioning component to which a water-soluble moisture-absorbing agent has been added that is a component partitioning between a first laminar air-flow path and a second laminar air-flow path that are layered; a spacing component that forms the first laminar air-flow path and the second laminar air-flow path and maintains a space between adjacent partitioning components; and an adhesive agent that adheres the partitioning component and the spacing component. The adhesive agent is a water-solvent-type adhesive agent impregnated with a water-soluble moisture-absorbing agent. The partitioning component and the spacing component are made from a liquid-absorbing material that absorbs water and substances dissolved in the water.

摘要翻译： 总热交换元件包括分层部件，添加了作为分层的第一层流空气流路和第二层流气路之间的部件的水溶性吸湿剂， 间隔部件，其形成第一层流气流路径和第二层流气流路径，并且在相邻的分隔部件之间保持空间; 以及粘合剂，其粘附分隔部件和间隔部件。 粘合剂是浸渍有水溶性吸湿剂的水溶剂型粘合剂。 分隔部件和间隔部件由吸收水分的液体吸收材料和溶解在水中的物质制成。

公开(公告)号：US20100089558A1

公开(公告)日：2010-04-15

申请号：US11885449

申请日：2006-10-03

申请人： Masaru Takada ,  Hidemoto Arai ,  Takanori Imai ,  Yoichi Sugiyama

发明人： Masaru Takada ,  Hidemoto Arai ,  Takanori Imai ,  Yoichi Sugiyama

IPC分类号： F28F21/00 ,  F28F3/08

CPC分类号： F28D9/0062 ,  F24F3/147 ,  F24F12/006 ,  F24F2003/1435 ,  F28D21/0015 ,  F28F3/025 ,  F28F2275/025 ,  Y02B30/563

摘要： A total heat exchanging element 10 includes a partitioning component 1, 1 to which a water-soluble moisture-absorbing agent has, been added that is a component partitioning between a first laminar air-flow path 4 and a second laminar air-flow path 5 that are layered; a spacing component 2, 2 that forms the first laminar air-flow path 4 and the second laminar air-flow path 5 and maintains a space between the partitioning components 1, 1; and an adhesive agent 3 that adheres the partitioning component 1, 1 and the spacing component 2, 2. The adhesive agent 3 is a water-solvent-type adhesive agent saturated with a water-soluble moisture-absorbing agent. The partitioning component 1, 1 and the spacing component 2, 2 are made from a liquid-absorbing material that absorbs water and substances dissolved in the water.

摘要翻译： 总热交换元件10包括分配组分1,1，其中添加有水溶性吸湿剂，其是在第一层流气路4和第二层流气流路5之间的部件分配 分层; 形成第一层流空气流路4和第二层流气路5的间隔部件2,2，保持分隔部件1,1之间的空间; 以及粘合剂3，其粘合分隔部件1,1和间隔部件2,2。粘合剂3是用水溶性吸湿剂饱和的水溶性型粘合剂。 分隔部件1,1和间隔部件2,2由吸收水分和溶解在水中的物质的吸液材料构成。

公开(公告)号：US07594320B2

公开(公告)日：2009-09-29

申请号：US11260077

申请日：2005-10-27

申请人： Masaru Takada ,  Hiroyuki Kobayashi ,  Kenji Chihara ,  Hisashi Minoura ,  Kiyotaka Tsukada ,  Mitsuhiro Kondo

发明人： Masaru Takada ,  Hiroyuki Kobayashi ,  Kenji Chihara ,  Hisashi Minoura ,  Kiyotaka Tsukada ,  Mitsuhiro Kondo

IPC分类号： H01K3/10 ,  H05K3/10

CPC分类号： H01L24/32 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/112 ,  H05K1/116 ,  H05K3/0008 ,  H05K3/0035 ,  H05K3/027 ,  H05K3/242 ,  H05K3/243 ,  H05K3/28 ,  H05K3/3452 ,  H05K3/3457 ,  H05K3/4038 ,  H05K3/421 ,  H05K3/428 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2201/09381 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2201/0959 ,  H05K2201/09781 ,  H05K2203/0554 ,  H05K2203/0571 ,  H05K2203/107 ,  H05K2203/175 ,  Y10S428/901 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (7) having a conductor circuit (6). The solder resist is then heat-cured to form an insulating film (1) having a low thermal expansion coefficient. A laser beam (2) is then applied to the portion of the insulating film in which an opening is to be formed, to burn off the same portion for forming an opening (10), whereby the conductor circuit (6) is exposed. This opening may be formed as a hole for conduction by forming a metal plating film on an inner surface thereof. It is preferable that an external connecting pad be formed so as to cover the opening. The film of coating of a metal is formed by using an electric plating lead, which is preferably cut off by a laser beam after the electric plating has finished.

摘要翻译： 在具有导体电路（6）的绝缘板（7）的表面上印刷包括热固性树脂的阻焊剂。 然后将阻焊剂热固化以形成具有低热膨胀系数的绝缘膜（1）。 然后将激光束（2）施加到要形成开口的绝缘膜的部分，以烧掉用于形成开口（10）的相同部分，由此导体电路（6）暴露。 该开口可以通过在其内表面上形成金属电镀膜而形成为导电孔。 优选地，形成外部连接垫以覆盖开口。 通过使用在电镀完成后优选用激光束切断的电镀铅来形成金属涂膜。

公开(公告)号：US20060042824A1

公开(公告)日：2006-03-02

申请号：US11260077

申请日：2005-10-27

申请人： Masaru Takada ,  Hiroyuki Kobayashi ,  Kenji Chihara ,  Hisashi Minoura ,  Kiyotaka Tsukada ,  Mitsuhiro Kondo

发明人： Masaru Takada ,  Hiroyuki Kobayashi ,  Kenji Chihara ,  Hisashi Minoura ,  Kiyotaka Tsukada ,  Mitsuhiro Kondo

IPC分类号： H05K5/06

CPC分类号： H01L24/32 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/112 ,  H05K1/116 ,  H05K3/0008 ,  H05K3/0035 ,  H05K3/027 ,  H05K3/242 ,  H05K3/243 ,  H05K3/28 ,  H05K3/3452 ,  H05K3/3457 ,  H05K3/4038 ,  H05K3/421 ,  H05K3/428 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2201/09381 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2201/0959 ,  H05K2201/09781 ,  H05K2203/0554 ,  H05K2203/0571 ,  H05K2203/107 ,  H05K2203/175 ,  Y10S428/901 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (7) having a conductor circuit (6). The solder resist is then heat-cured to form an insulating film (1) having a low thermal expansion coefficient. A laser beam (2) is then applied to the portion of the insulating film in which an opening is to be formed, to burn off the same portion for forming an opening (10), whereby the conductor circuit (6) is exposed. This opening may be formed as a hole for conduction by forming a metal plating film on an inner surface thereof. It is preferable that an external connecting pad be formed so as to cover the opening. The film of coating of a metal is formed by using an electric plating lead, which is preferably cut off by a laser beam after the electric plating has finished.

公开(公告)号：US06715204B1

公开(公告)日：2004-04-06

申请号：US09720953

申请日：2001-02-13

申请人： Kiyotaka Tsukada ,  Masaru Takada ,  Kenji Chihara

发明人： Kiyotaka Tsukada ,  Masaru Takada ,  Kenji Chihara

IPC分类号： H05K302

CPC分类号： H05K1/0265 ,  H01L21/486 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K1/113 ,  H05K1/114 ,  H05K3/0035 ,  H05K3/027 ,  H05K3/421 ,  H05K3/4652 ,  H05K2201/0352 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2201/09736 ,  H05K2201/10674 ,  H05K2203/0353 ,  H05K2203/0554 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/49167

摘要： A printed circuit board and a method for manufacturing the same that facilitates the formation of an upper surface pattern and prevents a lower surface metal foil from being damaged when forming a blind via hole with a laser. A lower surface and an upper surface of an insulative substrate (5) are respectively coated with a lower surface metal foil (220) and an upper surface metal foil (210), the thickness of which is less than that of the lower surface metal foil (220). Next, an opening (213) is formed in the upper surface metal foil at a location corresponding to a blind via hole formation portion (35) of the insulative substrate. A blind via hole (3), the bottom of which is the lower surface metal foil, is formed by emitting a laser (8) against the blind via hole formation portion (35) through the opening (213). Then, a metal plating film (23) is applied to the wall of the blind via hole (3), and an upper surface pattern (21) and a lower surface pattern (22) are formed through etching.

摘要翻译： 一种印刷电路板及其制造方法，其有助于形成上表面图案，并且在用激光形成盲孔时防止下表面金属箔被损坏。 绝缘基板（5）的下表面和上表面分别涂覆有下表面金属箔（220）和上表面金属箔（210），其厚度小于下表面金属箔的厚度 （220）。 接着，在与上述绝缘性基板的盲通孔形成部（35）对应的位置，在上表面金属箔上形成有开口部（213）。 通过开口（213）向盲通孔形成部分（35）发射激光器（8），形成底部金属薄片的盲孔（3）。 然后，将金属镀膜（23）施加到盲孔（3）的壁上，通过蚀刻形成上表面图案（21）和下表面图案（22）。

公开(公告)号：US06555208B2

公开(公告)日：2003-04-29

申请号：US09891819

申请日：2001-06-26

申请人： Masaru Takada ,  Hiroyuki Kobayashi ,  Kenji Chihara ,  Hisashi Minoura ,  Kiyotaka Tsukada ,  Mitsuhiro Kondo

发明人： Masaru Takada ,  Hiroyuki Kobayashi ,  Kenji Chihara ,  Hisashi Minoura ,  Kiyotaka Tsukada ,  Mitsuhiro Kondo

IPC分类号： B32B300

CPC分类号： H01L24/32 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/112 ,  H05K1/116 ,  H05K3/0008 ,  H05K3/0035 ,  H05K3/027 ,  H05K3/242 ,  H05K3/243 ,  H05K3/28 ,  H05K3/3452 ,  H05K3/3457 ,  H05K3/4038 ,  H05K3/421 ,  H05K3/428 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2201/09381 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2201/0959 ,  H05K2201/09781 ,  H05K2203/0554 ,  H05K2203/0571 ,  H05K2203/107 ,  H05K2203/175 ,  Y10S428/901 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (7) having a conductor circuit (6). The solder resist is then heat-cured to form an insulating film (1) having a low thermal expansion coefficient. A laser beam (2) is then applied to the portion of the insulating film in which an opening is to be formed, to burn off the same portion for forming an opening (10), whereby the conductor circuit (6) is exposed. This opening may be formed as a hole for conduction by forming a metal plating film on an inner surface thereof. It is preferable that an external connecting pad be formed so as to cover the opening. The film of coating of a metal is formed by using an electric plating lead, which is preferably cut off by a laser beam after the electric plating has finished.

公开(公告)号：US09903669B2

公开(公告)日：2018-02-27

申请号：US14385286

申请日：2012-06-13

申请人： Yuichi Ishimaru ,  Hajime Sotokawa ,  Masaru Takada ,  Takanori Imai ,  Mitsuhiko Ohira ,  Fumiaki Baba ,  Yuichi Matsuo ,  Shinya Tokizaki ,  Koji Kise ,  Masaru Shinozaki ,  Tetsuo Mitani

发明人： Yuichi Ishimaru ,  Hajime Sotokawa ,  Masaru Takada ,  Takanori Imai ,  Mitsuhiko Ohira ,  Fumiaki Baba ,  Yuichi Matsuo ,  Shinya Tokizaki ,  Koji Kise ,  Masaru Shinozaki ,  Tetsuo Mitani

IPC分类号： F28F7/00 ,  F28F9/00 ,  F28F3/04 ,  F28D9/00 ,  F28D21/00 ,  F28F21/06 ,  F24F12/00

CPC分类号： F28F9/00 ,  F24F12/006 ,  F28D9/0037 ,  F28D21/0015 ,  F28F3/048 ,  F28F21/06 ,  F28F2275/025 ,  Y02B30/563

摘要： Provided is a heat exchange element that suppresses an increase in air-flow resistance by suppressing deflection of a partition member caused by a change in temperature and humidity. The unit constituent members are stacked, each of which is formed of partition members that have heat-transfer properties and moisture permeability, and spacing members that hold the partition members. A primary air flow that passes along an upper-surface side of the partition member and a secondary air flow that passes along an undersurface side of the partition member cross each other so as to exchange heat and moisture via the partition member. The spacing member includes: spacing ribs that maintain the spacing between the partition members; and deflection suppressing ribs that have a height smaller than the spacing ribs so as to suppress deflection of the partition members.