公开(公告)号：US06650409B1

公开(公告)日：2003-11-18

申请号：US08617270

申请日：1996-03-14

申请人： Minori Noguchi ,  Yukio Kembo ,  Hiroshi Morioka ,  Hidetoshi Nishiyama ,  Hideaki Doi ,  Masataka Shiba ,  Yoshiharu Shigyo ,  Kazuhiko Matsuoka ,  Kenji Watanabe ,  Yoshimasa Ohshima ,  Fumiaki Endo ,  Yuzo Taniguchi

发明人： Minori Noguchi ,  Yukio Kembo ,  Hiroshi Morioka ,  Hidetoshi Nishiyama ,  Hideaki Doi ,  Masataka Shiba ,  Yoshiharu Shigyo ,  Kazuhiko Matsuoka ,  Kenji Watanabe ,  Yoshimasa Ohshima ,  Fumiaki Endo ,  Yuzo Taniguchi

IPC分类号： G01N2189

CPC分类号： H01L21/67288 ,  G01N21/9501 ,  H01J2237/0225 ,  H01L21/67253 ,  H01L21/681

摘要： A semiconductor device producing method and a semiconductor device producing system employs a processing apparatus provided with a dust particle detecting apparatus. The dust particle detecting apparatus measures the condition of adhesion of dust particles adhering to a work at least before or after processing the work, manages the condition of incremental adhesion of dust particles to the work resulting from processing for each lot of works or for each work on the basis of the measured condition of adhesion of dust particles measured before or after processing the work, and determines the time when the processing apparatus is to be cleaned or the cycle of cleaning the processing apparatus on the basis of the managed condition of adhesion of dust particles.

摘要翻译： 半导体器件制造方法和半导体器件制造系统采用具有灰尘粒子检测装置的处理装置。 尘埃粒子检测装置至少在工件加工之前或之后测量附着在工件上的灰尘颗粒的附着状态，管理灰尘颗粒对于每批工件或每个工件的加工产生的增加粘附的条件 基于在处理工件之前或之后测量的粉尘颗粒的粘附测量条件，并根据管理的粘附条件确定处理设备要清洁的时间或清洁处理设备的循环 灰尘颗粒。

公开(公告)号：US06542830B1

公开(公告)日：2003-04-01

申请号：US09142546

申请日：1998-09-10

申请人： Fumio Mizuno ,  Seiji Isogai ,  Kenji Watanabe ,  Yasuhiro Yoshitake ,  Terushige Asakawa ,  Yuichi Ohyama ,  Hidekuni Sugimoto ,  Seiji Ishikawa ,  Masataka Shiba ,  Jun Nakazato ,  Makoto Ariga ,  Tetsuji Yokouchi ,  Toshimitsu Hamada ,  Ikuo Suzuki ,  Masami Ikota ,  Mari Nozoe ,  Isao Miyazaki ,  Yoshiharu Shigyo

发明人： Fumio Mizuno ,  Seiji Isogai ,  Kenji Watanabe ,  Yasuhiro Yoshitake ,  Terushige Asakawa ,  Yuichi Ohyama ,  Hidekuni Sugimoto ,  Seiji Ishikawa ,  Masataka Shiba ,  Jun Nakazato ,  Makoto Ariga ,  Tetsuji Yokouchi ,  Toshimitsu Hamada ,  Ikuo Suzuki ,  Masami Ikota ,  Mari Nozoe ,  Isao Miyazaki ,  Yoshiharu Shigyo

IPC分类号： H01L2166

CPC分类号： H01L22/20 ,  G01N21/9501 ,  G01R31/2894 ,  G01R33/06 ,  H01L2223/54466 ,  H01L2924/0002 ,  H01L2924/00

摘要： A process management system in accordance with the present invention includes inspection apparatuses for inspecting defects on a wafer, the inspection apparatuses being connected through a communication network, inspection information and image information obtained from these inspection apparatuses being collected to construct a data base and an image file, therein definition of defects is given by combinations of elements which characterize the defect based on the inspection information and the image information obtained from the inspection apparatuses. By giving definition of the defect, characteristics of the defect can be subdivided and known. Therefore, the cause of a defect can be studied.

摘要翻译： 根据本发明的处理管理系统包括用于检查晶片上的缺陷的检查装置，通过通信网络连接的检查装置，从这些检查装置获得的检查信息和图像信息被收集以构建数据库和图像 文件，其中缺陷的定义通过基于检查信息和从检查装置获得的图像信息来表征缺陷的元件的组合来给出。 通过给出缺陷的定义，可以细分和知道缺陷的特征。 因此，可以研究缺陷的原因。

公开(公告)号：US06485891B1

公开(公告)日：2002-11-26

申请号：US09542072

申请日：2000-04-03

申请人： Minori Noguchi ,  Yukio Kenbo ,  Yoshitada Oshida ,  Masataka Shiba ,  Yasuhiro Yoshitaka ,  Makoto Murayama

发明人： Minori Noguchi ,  Yukio Kenbo ,  Yoshitada Oshida ,  Masataka Shiba ,  Yasuhiro Yoshitaka ,  Makoto Murayama

IPC分类号： G03F720

CPC分类号： G03F7/705 ,  G03F7/2002 ,  G03F7/701 ,  G03F7/70125 ,  G03F7/70308 ,  G03F7/70591 ,  Y10S430/146

摘要： A production method of a semiconductor device, includes the steps of emitting an excimer laser from a light source, illuminating a pattern on a mask with the excimer laser emitted from the light source and passed through a filter, exposing a resist on a substrate of the semiconductor with the excimer laser passed through the mask, and forming a pattern on the substrate in accordance with a portion of the resist exposed with the excimer laser.

摘要翻译： 一种半导体器件的制造方法，包括以下步骤：从光源发射准分子激光器，用从光源发射的准分子激光器照射掩模上的图案，并通过过滤器，将抗蚀剂暴露在基板上 半导体与准分子激光器通过掩模，并且根据暴露于准分子激光器的抗蚀剂的一部分在衬底上形成图案。

公开(公告)号：US6002989A

公开(公告)日：1999-12-14

申请号：US831298

申请日：1997-04-01

申请人： Masataka Shiba ,  Kenji Watanabe ,  Toshimitsu Hamada ,  Seiji Ishikawa ,  Naoki Go ,  Toshiaki Yachi ,  Tetsuya Watanabe ,  Takahiro Jingu

发明人： Masataka Shiba ,  Kenji Watanabe ,  Toshimitsu Hamada ,  Seiji Ishikawa ,  Naoki Go ,  Toshiaki Yachi ,  Tetsuya Watanabe ,  Takahiro Jingu

IPC分类号： G01N21/84 ,  B23Q41/08 ,  G05B19/418 ,  G06Q50/00 ,  G06Q50/04 ,  H01L21/66 ,  G06F15/18

CPC分类号： H01L22/20 ,  G05B19/41875 ,  H01L22/12 ,  H01L2924/0002 ,  Y02P90/14 ,  Y02P90/18 ,  Y02P90/22

摘要： Inspection apparatuses of an inspection apparatus group are connected to a network and transfer inspected result to a data collection system. The same wafer selected from a specific process is inspected by the different inspection apparatuses and the inspected data are collected and analyzed to calculate a correlation degree among the inspection apparatuses. On the other hand, the course of occurrence of failures in the same process can be analyzed to thereby calculate an average occurrence frequency of failures. An optimum inspection apparatus and inspection frequency are successively obtained on the basis of calculated results of an inter-apparatus correlation degree calculation process and a failure occurrence frequency calculation process, so that a feeding method of wafers to the inspection apparatus group is indicated through an inspection apparatus group management system. In the manufacturing of electronic components, complicated conditions such as the optimum inspection apparatus to be applied, the inspection frequency and the like can be set easily and the expected total loss value can be minimized to improve the economical efficiency of inspection remarkably.

摘要翻译： 检查装置组的检查装置连接到网络并将检查结果传送到数据收集系统。 通过不同的检查装置检查从具体处理中选出的相同的晶片，收集和分析检查数据，以计算检查装置之间的相关度。 另一方面，可以分析相同处理中的故障发生的过程，从而计算故障的平均发生频率。 基于设备间相关度计算处理和故障发生频率计算处理的计算结果连续获得最佳检查装置和检查频率，从而通过检查来指示晶片向检查装置组的馈送方法 设备组管理系统。 在电子部件的制造中，可以容易地设定诸如要应用的最佳检查装置等复杂的条件，并且可以将预期的总损失值最小化，从而提高检查的经济性。

公开(公告)号：US5324953A

公开(公告)日：1994-06-28

申请号：US12775

申请日：1993-02-03

申请人： Yasuhiro Yoshitake ,  Yoshitada Oshida ,  Masataka Shiba ,  Yasuhiko Nakayama

发明人： Yasuhiro Yoshitake ,  Yoshitada Oshida ,  Masataka Shiba ,  Yasuhiko Nakayama

IPC分类号： G02B5/32 ,  G02B27/00 ,  G03F7/23 ,  G03F9/00 ,  H01L21/027 ,  H01L21/30 ,  G06K7/015

CPC分类号： G03F9/70 ,  G02B27/0037 ,  G02B27/4211 ,  G02B27/4222 ,  G02B5/32

摘要： A novel exposure system includes a reduced-projection lens optimized for a predetermined single exposure wavelength and a chromatic aberration correction system for TTL (Through The Lens) alignment with broadband light. The correction system includes a holographic lens which dispersion has a negative number in contrast to a conventional glass lens which has a positive dispersion number. By employing a holographic lens, the total optical length of an alignment system can be made short enough to avoid the necessity of installing a mirror therein, thus realizing a highly accurate alignment system.

摘要翻译： 一种新颖的曝光系统包括针对预定的单一曝光波长优化的缩小投影透镜和用于与宽带光进行TTL（透镜））对准的色差校正系统。 校正系统包括与具有正色散数的常规玻璃透镜相反的色散具有负数的全息透镜。 通过采用全息透镜，可以使对准系统的总光学长度足够短以避免在其中安装反射镜，从而实现高精度的对准系统。

公开(公告)号：US5121449A

公开(公告)日：1992-06-09

申请号：US513911

申请日：1990-04-24

申请人： Masataka Shiba ,  Ryuichi Funatsu ,  Motoya Taniguchi ,  Minoru Tanaka ,  Akira Inagaki

发明人： Masataka Shiba ,  Ryuichi Funatsu ,  Motoya Taniguchi ,  Minoru Tanaka ,  Akira Inagaki

IPC分类号： G02F1/335 ,  G02B6/12 ,  G11B7/12

CPC分类号： G02B6/12004 ,  G11B7/1245

摘要： Disclosed is an information detecting system of scanning type which comprises a substrate formed with an optical waveguide layer, a laser oscillator emitting a laser beam, a SAW type beam deflecting device formed on the optical waveguide layer, a beam irradiating section irradiating a specimen with the laser beam derived from the optical waveguide layer, a controller controlling the frequency of a high-frequency voltage applied to the SAW type beam deflecting device so as to scan the specimen with the laser beam directed from the beam irradiating section, and a detecting section detecting the position and/or the intensity of the laser beam scanning the specimen with respect to the SAW control signal controlled by the controller.

摘要翻译： 公开了一种扫描型信息检测系统，其包括形成有光波导层的基板，发射激光束的激光振荡器，形成在光波导层上的SAW型光束偏转装置，用该光波导层照射试样的光束照射部 衍生自光波导层的激光束，控制施加到SAW型光束偏转装置的高频电压的频率的控制器，以便用从光束照射部分引导的激光束扫描样本;以及检测部分检测 相对于由控制器控制的SAW控制信号扫描样本的激光束的位置和/或强度。

公开(公告)号：US4676637A

公开(公告)日：1987-06-30

申请号：US790475

申请日：1985-10-23

申请人： Sachio Uto ,  Masataka Shiba ,  Yoshitada Oshida

发明人： Sachio Uto ,  Masataka Shiba ,  Yoshitada Oshida

IPC分类号： H01L21/027 ,  B65G1/00 ,  G01N21/21 ,  G01N21/88 ,  G01N21/94 ,  G01N21/956 ,  G03F1/84 ,  G03F7/20 ,  H01L21/30 ,  H01L21/66 ,  G01N21/00

CPC分类号： G03F7/70741 ,  G01N21/94 ,  G03F7/70866 ,  G01N2021/9563 ,  G01N21/21

摘要： A plurality of substrate assemblies each including a substrate such as a reticle or photomask used for exposure and frames, mounted to the opposite surfaces of the substrate, to which foreign particle deposition preventive films are applied are stored in a magazine. By using a transport unit, a substrate assembly is taken out of the magazine, transported from the magazine to a mask table disposed at an exposure position and set at the mask table. A foreign particle detector is provided near the transport unit to optically detect foreign particles present on the foreign particle deposition preventive film of the substrate assembly. The substrate assembly set at the mask table is aligned to a wafer. A light beam is irradiated on the substrate assembly aligned relative to the wafer and a circuit pattern formed on the substrate is projected upon the wafer through a projection optical system to expose the wafer to the light beam through the circuit pattern.

摘要翻译： 多个基板组件，其各自包括安装到基板的相反表面上的诸如用于曝光的掩模版或光掩模的基板和施加有外来颗粒沉积预防膜的相对表面的基板组件。 通过使用传送单元，将基板组件从盒中取出，从盒传送到设置在曝光位置并设置在掩模台上的掩模台。 在输送单元附近设有异物检测器，以光学检测存在于基板组件的异物颗粒沉积防止膜上的异物。 设置在掩模台上的基板组件与晶片对准。 将光束照射在相对于晶片对准的基板组件上，并且通过投影光学系统将形成在基板上的电路图案投影到晶片上，以通过电路图案将晶片暴露于光束。

公开(公告)号：US07604925B2

公开(公告)日：2009-10-20

申请号：US11117493

申请日：2005-04-29

申请人： Minori Noguchi ,  Yukio Kenbo ,  Yoshitada Oshida ,  Masataka Shiba ,  Yasuhiro Yoshitaka ,  Makoto Murayama

发明人： Minori Noguchi ,  Yukio Kenbo ,  Yoshitada Oshida ,  Masataka Shiba ,  Yasuhiro Yoshitaka ,  Makoto Murayama

IPC分类号： H01L21/00

CPC分类号： G03F7/705 ,  G03F7/2002 ,  G03F7/701 ,  G03F7/70125 ,  G03F7/70308 ,  G03F7/70591 ,  Y10S430/146

摘要： A production method of a semiconductor device which includes the steps of exposing a resist coated on a substrate of a semiconductor device by projecting a light pattern on the substrate of the semiconductor device, developing the resist exposed by the light pattern to form a wafer pattern with the resist, and etching the substrate on which the wafer pattern with the resist is formed. In the step of exposing the light pattern is formed by illuminating a mask with excimer laser light having an annular shape.

摘要翻译： 一种半导体器件的制造方法，包括以下步骤：通过在半导体器件的衬底上投射光图案来曝光涂覆在半导体器件的衬底上的抗蚀剂的步骤，使由光图案曝光的抗蚀剂显影以形成具有 并且蚀刻其上形成有抗蚀剂的晶片图案的基板。 在曝光的步骤中，通过用具有环形形状的准分子激光照射掩模形成光图案。

公开(公告)号：US07012671B2

公开(公告)日：2006-03-14

申请号：US10282081

申请日：2002-10-29

申请人： Minori Noguchi ,  Yukio Kenbo ,  Yoshitada Oshida ,  Masataka Shiba ,  Yasuhiro Yoshitaka ,  Makoto Murayama

发明人： Minori Noguchi ,  Yukio Kenbo ,  Yoshitada Oshida ,  Masataka Shiba ,  Yasuhiro Yoshitaka ,  Makoto Murayama

IPC分类号： G03B27/42 ,  G03B27/54

CPC分类号： G03F7/705 ,  G03F7/2002 ,  G03F7/701 ,  G03F7/70125 ,  G03F7/70308 ,  G03F7/70591 ,  Y10S430/146

摘要： An apparatus and method for projecting a pattern includes a light source for emitting a laser; an illuminating unit which illuminates a mask on which a pattern is formed with the laser emitted from the light source and formed in a particular shape; a holder which holds the mask; an optical lens unit which projects the pattern formed on the mask onto a surface of a substrate by the laser illuminated on the mask; and a table which mounts the substrate and moves in at least one direction.

公开(公告)号：US06456951B1

公开(公告)日：2002-09-24

申请号：US09553944

申请日：2000-04-21

申请人： Shunji Maeda ,  Yasuhiro Yoshitake ,  Kenji Oka ,  Masataka Shiba ,  Atsushi Shimoda

发明人： Shunji Maeda ,  Yasuhiro Yoshitake ,  Kenji Oka ,  Masataka Shiba ,  Atsushi Shimoda

IPC分类号： G06F1132

CPC分类号： H01L22/20 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention is related to an inspection data processing method for processing inspection data composed of coordinates data and characteristic quantity data about a defect generated on a subject of inspection detected with a visual inspection apparatus. The inspection data processing method comprises the following steps: a preparation step of storing a first fatality judgment data group corresponding to the kinds of areas on the subject of inspection and a second fatality judgment data group corresponding to categories of defects beforehand; a first fatality judgment step of judging a first fatality level of a defect corresponding to the kind of an area where the defect exists; a category giving step of giving category to the defect in the inspection data; and a second fatality judgment step of judging a second fatality of the defect based on second fatality judgment data selected according to the category which are given based on the first fatality level of defects judged in the first fatality judgment step.

摘要翻译： 本发明涉及一种用于处理检查数据的检查数据处理方法，该检查数据由关于在用目视检查装置检测到的检查对象上产生的缺陷的坐标数据和特征量数据组成。 检查数据处理方法包括以下步骤：预先存储与检查对象的区域的种类对应的第一死亡判定数据组和对应于缺陷类别的第二死亡判定数据组的准备步骤; 判断与存在缺陷的区域的种类相对应的缺陷的第一死亡水平的第一死亡判定步骤; 类别给出检查数据中的缺陷类别的步骤; 以及第二死亡判定步骤，基于根据在第一死亡判定步骤中判断的缺陷的第一死亡水平给出的根据类别选择的第二死亡判定数据来判断缺陷的第二死亡。