公开(公告)号：US08703583B2

公开(公告)日：2014-04-22

申请号：US12618292

申请日：2009-11-13

申请人： Hiroshi Maki ,  Masayuki Mochizuki ,  Ryuichi Takano ,  Yoshiaki Makita ,  Haruhiko Fukasawa ,  Keisuke Nadamoto ,  Tatsuyuki Okubo

发明人： Hiroshi Maki ,  Masayuki Mochizuki ,  Ryuichi Takano ,  Yoshiaki Makita ,  Haruhiko Fukasawa ,  Keisuke Nadamoto ,  Tatsuyuki Okubo

IPC分类号： H01L21/00

CPC分类号： H01L21/67132 ,  H01L21/67092 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/6838 ,  H01L21/68742 ,  H01L21/78 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/75 ,  H01L24/83 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/27436 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01032 ,  H01L2924/00 ,  H01L2924/3512

摘要： A technique with which die bonding can be carried out without forming a void in a bond area is provided. A vacuum supply line that connects to a vacuum chuck hole formed in the bottom face of a vacuuming collet and supplies the vacuuming collet with reduced pressure for vacuum chucking a chip is constructed of two systems. That is, the vacuum supply line is so structured that a first pipe and a second pipe connect to the vacuuming collet. The first pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is unstuck from a dicing tape and transported to a mounting position on a wiring substrate. The second pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is mounted over a wiring substrate. The intensity of the vacuum (suction force) supplied to the vacuuming collet is controlled by opening or closing valves respectively installed in the pipes.

摘要翻译： 提供了一种可以在不在接合区域形成空隙的情况下进行管芯接合的技术。 连接到真空吸盘孔的真空供给线，其形成在真空夹头的底面，并且用于减压的真空吸盘用于真空夹紧芯片由两个系统构成。 也就是说，真空供给管的结构使得第一管和第二管连接到抽真空夹头。 第一管为真空提供真空，当芯片从切割胶带脱离并传送到布线基板上的安装位置时，该真空提供吸力。 第二个管道为抽真空筒提供一个真空，当芯片安装在布线基板上时，该真空提供吸力。 通过打开或关闭分别安装在管道中的阀门来控制提供给抽真空夹头的真空强度（吸力）。

公开(公告)号：US20130068826A1

公开(公告)日：2013-03-21

申请号：US13415920

申请日：2012-03-09

申请人： Hiroshi Maki ,  Masayuki Mochizuki ,  Yukio Tani ,  Takehito Mochizuki

发明人： Hiroshi Maki ,  Masayuki Mochizuki ,  Yukio Tani ,  Takehito Mochizuki

IPC分类号： B23K31/02 ,  B23K37/04

CPC分类号： H01L24/27 ,  H01L24/75 ,  H01L2224/83191 ,  H01L2224/83192

摘要： A die bonder includes a die supply stage, which is configured to hold a wafer; a first head having a first collet, which is configured to pick up a die from the wafer and to attach the die, provisionally, on a target to be conducted with mounting thereon, on the attach stage; a second head having a second collet, which is configured to conduct main compression of the die, which is provisionally attached on the attach stage, on the target to be conducted with mounting; and a controller apparatus, wherein the controller apparatus controls the first head to pick up a next die from the die supply stage, during when the second head conducts the main compression on the die onto the target to be conducted with mounting, thereby achieving the die bonder and the die bonding method being stable in quality.

摘要翻译： 芯片接合器包括：晶片供给台，其配置成保持晶片; 第一头具有第一夹头，其被配置为从所述晶片拾取模具并且临时地将所述管芯附着到要安装在其上的待导电的靶上; 具有第二夹头的第二头部，其被构造成在临时安装在附接台上的模具上进行主压缩，以安装在导向件上; 以及控制装置，其特征在于，所述控制装置控制所述第一头从所述模具供给台拾取下一个模具，在所述第二头部将所述模具上的主压缩导向所述待进行导向的所述靶上，从而实现所述模具 粘合剂和芯片焊接方法质量稳定。

公开(公告)号：US08367433B2

公开(公告)日：2013-02-05

申请号：US12840333

申请日：2010-07-21

申请人： Hideharu Kobashi ,  Hiroshi Maki ,  Masayuki Mochizuki ,  Yoshiaki Makita

发明人： Hideharu Kobashi ,  Hiroshi Maki ,  Masayuki Mochizuki ,  Yoshiaki Makita

IPC分类号： H01L21/66

CPC分类号： H01L22/12 ,  H01L21/67132 ,  H01L21/67271 ,  H01L24/45 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A technique is provided which can exactly recognize a chip to be picked up when picking up the chip from a wafer sheet in a process of die bonding a thin chip. A camera is coupled to one end of a lens barrel, an objective lens is attached to an opposite end of the lens barrel, and an image of a main surface of a chip is photographed through the objective lens. A surface-emitting lighting unit, a diffusing plate and a half mirror are internally provided between the lens barrel and the chip. Further, another lens barrel having a coaxial drop lighting function of radiating light to the main surface of the chip along the same optical axis as that of the camera is disposed.

公开(公告)号：US20110259525A1

公开(公告)日：2011-10-27

申请号：US12880399

申请日：2010-09-13

申请人： Masayuki MOCHIZUKI ,  Yasushi ISHII

发明人： Masayuki MOCHIZUKI ,  Yasushi ISHII

IPC分类号： H01L21/50 ,  B25J11/00

CPC分类号： H01L24/75 ,  F16F15/28 ,  H01L24/83 ,  H01L2224/83192 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01082 ,  H01L2924/014 ,  Y10T29/5313

摘要： The present invention aims to provide a lightened reaction absorber or to provide a semiconductor assembling system with further shorter processing time and high productivity or high quality using the lightened reaction absorber. The present invention is based upon a reaction absorber provided with a counter mechanism equipped with a load unit moved in a predetermined direction by a first ball screw, a second ball screw that generates reactive force in a reverse direction to the predetermined direction and a driving unit having a driving motor that drives the first ball screw and the second ball screw, and has a characteristic of including a reaction absorbing unit with one end side equipped with a nut connected to the second ball screw and the other end side fixed to a unit base movable relatively to the counter mechanism.

摘要翻译： 本发明的目的在于提供一种减轻反应吸收剂，或提供一种半导体组装体系，其使用更轻的反应吸收剂，具有更短的加工时间和高的生产率或高质量。 本发明是基于一种反应吸收器，该反应吸收器设置有一个配备有通过第一滚珠丝杠沿预定方向移动的载荷单元的反作用机构，产生与预定方向相反的方向产生反作用力的第二滚珠丝杠和驱动单元 具有驱动第一滚珠丝杠和第二滚珠丝杠的驱动马达，具有包括反应吸收单元的特性，该反应吸收单元的一端侧配备有连接到第二滚珠丝杠的螺母，另一端侧固定在单元基座 相对于计数器机构可移动。

公开(公告)号：US20090215204A1

公开(公告)日：2009-08-27

申请号：US12436647

申请日：2009-05-06

申请人： Hideharu KOBASHI ,  Hiroshi Maki ,  Masayuki Mochizuki ,  Yoshiaki Makita

发明人： Hideharu KOBASHI ,  Hiroshi Maki ,  Masayuki Mochizuki ,  Yoshiaki Makita

IPC分类号： H01L21/66

CPC分类号： H01L22/12 ,  H01L21/67132 ,  H01L21/67271 ,  H01L24/45 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A technique is provided which can exactly recognize a chip to be picked up when picking up the chip from a wafer sheet in a process of die bonding a thin chip. A camera is coupled to one end of a lens barrel, an objective lens is attached to an opposite end of the lens barrel, and an image of a main surface of a chip is photographed through the objective lens. A surface-emitting lighting unit, a diffusing plate and a half mirror are internally provided between the lens barrel and the chip. Further, another lens barrel having a coaxial drop lighting function of radiating light to the main surface of the chip along the same optical axis as that of the camera is disposed.

摘要翻译： 提供一种技术，其可以在芯片接合薄片的过程中从晶片片上拾取芯片时精确地识别要拾取的芯片。 相机耦合到镜筒的一端，物镜附着到镜筒的相对端，并且通过物镜拍摄芯片的主表面的图像。 在透镜筒和芯片之间内部设置表面发射照明单元，漫射板和半反射镜。 此外，设置具有沿着与照相机相同的光轴向芯片的主表面照射光的同轴放置点亮功能的另一个镜筒。

公开(公告)号：US20070275544A1

公开(公告)日：2007-11-29

申请号：US11735741

申请日：2007-04-16

申请人： Hiroshi Maki ,  Masayuki Mochizuki ,  Ryuichi Takano ,  Yoshiaki Makita ,  Haruhiko Fukasawa ,  Keisuke Nadamoto ,  Tatsuyuki Okubo

发明人： Hiroshi Maki ,  Masayuki Mochizuki ,  Ryuichi Takano ,  Yoshiaki Makita ,  Haruhiko Fukasawa ,  Keisuke Nadamoto ,  Tatsuyuki Okubo

IPC分类号： H01L21/00

CPC分类号： H01L21/67132 ,  H01L21/67092 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/6838 ,  H01L21/68742 ,  H01L21/78 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/75 ,  H01L24/83 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/27436 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01032 ,  H01L2924/00 ,  H01L2924/3512

摘要： A technique with which die bonding can be carried out without forming a void in a bond area is provided. A vacuum supply line that connects to a vacuum chuck hole formed in the bottom face of a vacuuming collet and supplies the vacuuming collet with reduced pressure for vacuum chucking a chip is constructed of two systems. That is, the vacuum supply line is so structured that a first pipe and a second pipe connect to the vacuuming collet. The first pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is unstuck from a dicing tape and transported to a mounting position on a wiring substrate. The second pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is mounted over a wiring substrate. The intensity of the vacuum (suction force) supplied to the vacuuming collet is controlled by opening or closing valves respectively installed in the pipes.

摘要翻译： 提供了一种可以在不在接合区域形成空隙的情况下进行管芯接合的技术。 连接到真空吸盘孔的真空供给线，其形成在真空夹头的底面，并且用于减压的真空吸盘用于真空夹紧芯片由两个系统构成。 也就是说，真空供给管的结构使得第一管和第二管连接到抽真空夹头。 第一管为真空提供真空，当芯片从切割胶带脱离并传送到布线基板上的安装位置时，该真空提供吸力。 第二个管道为抽真空筒提供一个真空，当芯片安装在布线基板上时，该真空提供吸力。 通过打开或关闭分别安装在管道中的阀门来控制提供给抽真空夹头的真空强度（吸力）。

公开(公告)号：US10096526B2

公开(公告)日：2018-10-09

申请号：US13585900

申请日：2012-08-15

申请人： Masayuki Mochizuki ,  Hiroshi Maki ,  Yukio Tani ,  Takehito Mochizuki

发明人： Masayuki Mochizuki ,  Hiroshi Maki ,  Yukio Tani ,  Takehito Mochizuki

IPC分类号： H01L21/66 ,  H01L21/67 ,  H01L21/68 ,  H01L23/00

摘要： A bonding method of a die bonder with a single conveyance lane and a single bonding head, or a plurality of conveyance lanes and a plurality of bonding heads includes the steps of generating a classification map of class dies with different electric properties on the wafer, which are classified in accordance with a plurality of grades, picking up the die from the wafer, bonding the die onto a substrate or the die using a bonding head, conveying a class substrate corresponding to the class die on the conveyance lane in a unit of the class substrate, and further bonding the class die to the corresponding class substrate based on the classification map.

公开(公告)号：US08457505B2

公开(公告)日：2013-06-04

申请号：US12850048

申请日：2010-08-04

申请人： Masayuki Mochizuki

发明人： Masayuki Mochizuki

IPC分类号： G03G15/00

CPC分类号： G03G15/80 ,  G03G15/2039

摘要： An image forming apparatus according to the present invention includes: a fixing part having a heater; a control part controlling ON/OFF of power distribution to the heater; a power source part generating a voltage for driving the control part; a main switch for turning ON/OFF power supply from outside to the power source part; and an interrupt signal generation part generating a periodical interrupt signal. The control part, based on the interrupt signal, controls ON/OFF of the power distribution to the heater, turns OFF power supply to the heater upon passage of predetermined time since disappearance of the interrupt signal, and judges that an error has occurred, when the control part is still driving after passage of driving stop time from when the main switch is turned OFF to when the control part stops its driving since the disappearance of the interrupt signal.

摘要翻译： 根据本发明的图像形成装置包括：具有加热器的固定部件; 控制部，其控制对所述加热器的配电的ON / OFF; 产生用于驱动所述控制部的电压的电源部; 用于从外部向电源部分接通/断开电源的主开关; 以及产生周期性中断信号的中断信号生成部。 控制部分基于中断信号控制对加热器的配电的ON / OFF，在中断信号消失后经过预定时间后关闭加热器的电源，并判断发生错误，当 控制部分在从主开关断开到从中断信号消失后控制部分停止其驱动的驱动停止时间之后仍然行驶。

公开(公告)号：US08452202B2

公开(公告)日：2013-05-28

申请号：US12392807

申请日：2009-02-25

申请人： Masayuki Mochizuki

发明人： Masayuki Mochizuki

IPC分类号： G03G15/00 ,  G03G15/20

CPC分类号： G03G15/5004 ,  B41J29/38 ,  G03G15/2039

摘要： A controller outputs a heater control signal in synchronization with a rise in a zero-cross signal. In response to the heater control signal, a switching device of a heater driving circuit switches ON/OFF. However, a noise occurs in an output voltage of an AC power source at the time of switching, and this noise causes a false zero-cross signal. For the purpose of preventing operation of a heater in accordance with the false zero-cross signal, the controller disregards the rise in the zero-cross signal during a set time period after the rise in the heater control signal.

摘要翻译： 控制器与零交叉信号的上升同步地输出加热器控制信号。 响应于加热器控制信号，加热器驱动电路的开关装置切换ON / OFF。 然而，在切换时，在交流电源的输出电压中产生噪声，该噪声导致假的零交叉信号。 为了防止根据伪零交叉信号的加热器的操作，控制器在加热器控制信号的上升之后的设定时间段期间忽略过零信号的上升。

公开(公告)号：US06817537B2

公开(公告)日：2004-11-16

申请号：US10101349

申请日：2002-03-20

申请人： Hirosada Watanabe ,  Mitsuru Saito ,  Masayuki Mochizuki ,  Hiroaki Yamagishi ,  Yuichi Ishizuka

发明人： Hirosada Watanabe ,  Mitsuru Saito ,  Masayuki Mochizuki ,  Hiroaki Yamagishi ,  Yuichi Ishizuka

IPC分类号： G06K1906

CPC分类号： G07C1/18

摘要： A time card may have first and second card identifying sections disposed on opposite faces of the time card. The first card identifying section stores a most significant value of an identification of the time card, and the second card identifying section stores a least significant value of the card's identification. When combined to form a single value, the most and least significant values provide the time card identification. Also, a printing position indicator on the card identifies an initial printing position for the first and second card identifying sections to a time card recorder.

摘要翻译： 时间卡可以具有设置在时间卡的相对面上的第一和第二卡片识别部分。 第一卡识别部存储时间卡的识别的最高有效值，第二卡识别部存储卡的识别的最低有效值。 当组合形成单个值时，最重要和最不重要的值提供时间卡识别。 此外，卡上的打印位置指示符标识用于第一和第二卡识别部分的时间卡记录器的初始打印位置。