公开(公告)号：US06769855B2

公开(公告)日：2004-08-03

申请号：US10032528

申请日：2001-12-27

申请人： Masayuki Yokomori ,  Osamu Kuroda

发明人： Masayuki Yokomori ,  Osamu Kuroda

IPC分类号： B65G6500

CPC分类号： H01L21/67781 ,  G06F9/4493 ,  Y10S414/138

摘要： A substrate processing apparatus (1) includes a wafer loading/unloading and arraying part (14) to remove substrates W from a container (C) where a plurality of unprocessed substrates W to be processed are accommodated at regular intervals, substrate arraying part (51a, 51b, 60) for arranging the substrates W having been removed from two containers (C) at the loading/unloading and arraying part (14) at pitches half the pitch to arrange the substrates in the container (C), a processing part (4) for applying a designated process on the substrates (W), a transfer mechanism (17) for transporting the substrates (W) arranged by the substrate array part (51a, 51b, 60) to the processing part (4) and a stand-by part (75) to allow the substrates arranged by the substrate array parts to stand in readiness temporarily.

摘要翻译： 衬底处理装置（1）包括晶片装载/排出部分（14），用于从要容纳多个待处理的多个未处理衬底W的容器（C）移除衬底W，所述衬底W以规则的间隔被容纳，衬底排列部分（51a ，51b，60），用于将已经从加载/卸载和排列部分（14）两个容器（C）移除的基板W以间距的一半排列，以将基板布置在容器（C）中，处理部分 4），用于在基板（W）上施加指定的处理;传送机构（17），用于将由基板阵列部分（51a，51b，60）布置的基板（W）传送到处理部分（4） - 通过部分（75），以允许由衬底阵列部分布置的衬底临时立即准备就绪。