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公开(公告)号：US4251595A
公开(公告)日：1981-02-17
申请号：US74012
申请日：1979-09-10
CPC分类号： C03C8/245 , C03C3/0745
摘要： Lead borate and lead zinc borate glasses containing from 0.1 to 10% by weight cuprous oxide (Cu.sub.2 O) and fluoride, the molar ratio of cuprous oxide to fluoride being in the range 1:0.25 to 1:10, preferably in the range 1:1 to 1:5, up to 5% by weight bismuth oxide and from 0.1 to 5.0% alumina are disclosed. These glasses are mixed with particulate lead titanate in amounts up to about 56% by volume. These mixtures have very low coefficients of thermal expansion and are useful for bonding ceramic, glass and metal parts together at low temperatures. They are especially useful as semiconductor package sealants.
摘要翻译： 含有0.1至10重量％的氧化亚铜（Cu 2 O）和氟化物的硼酸铅和硼酸铅锌玻璃，氧化亚铜与氟化物的摩尔比在1:0.25至1:10的范围内，优选在1：1范围内 至1：5，高达5重量％的氧化铋和0.1至5.0％的氧化铝。 将这些玻璃与高达约56体积％的量的颗粒状钛酸铅混合。 这些混合物具有非常低的热膨胀系数，并且可用于在低温下将陶瓷，玻璃和金属部件结合在一起。 它们特别适用于半导体封装密封剂。
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公开(公告)号：US5188990A
公开(公告)日：1993-02-23
申请号：US795873
申请日：1991-11-21
摘要： Low temperature sealing glass compositions comprising 35 to 80% by weight TeO.sub.2, 15 to 50% V.sub.2 O.sub.5 and 0.1 to 20% Nb.sub.2 O.sub.5, ZrO.sub.2 and/or ZnO.
摘要翻译： 包含35至80重量％的TeO 2，15至50％V 2 O 5和0.1至20％的Nb 2 O 5，ZrO 2和/或ZnO的低温密封玻璃组合物。
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公开(公告)号：US5013360A
公开(公告)日：1991-05-07
申请号：US407470
申请日：1989-09-15
CPC分类号： H01L24/83 , C03C14/004 , C03C3/122 , C03C8/24 , H01L23/10 , H01L24/28 , C03C2214/04 , C03C2214/08 , H01L2224/8319 , H01L2224/8385 , H01L2224/8389 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01055 , H01L2924/01056 , H01L2924/01073 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/15787
摘要： Fluid, stable glasses useful for low-temperature sealing applications are made by adding jointly bismuth oxide, zinc oxide, phosphorus pentoxide, titania and/or zirconium oxide to the lead oxide vanadium oxide binary. The phosphorus pentoxide may be replaced partially or entirely with niobium pentoxide and/or tantalum oxide.Sealing glass compositions comprising these low-melting lead-vanadia glasses in powder form and refractory fillers of lower thermal expansion for use in hermetically sealing semiconductor devices in ceramic packages are disclosed. Group V metal oxides, particularly niobium-containing oxides, are preferred fillers. Silver metal is a preferred filler for making die-attach compositions.
摘要翻译： 通过向氧化铅氧化钒二元体中加入联合氧化铋，氧化锌，五氧化二磷，二氧化钛和/或氧化锆来制备用于低温密封应用的液体稳定的玻璃。 五氧化二磷可以部分或全部用五氧化二铌和/或氧化钽代替。 公开了包含粉末形式的这些低熔点铅 - 钒酸盐玻璃和用于密封陶瓷封装中的半导体器件的具有较低热膨胀性的耐火填料的密封玻璃组合物。 V族金属氧化物，特别是含铌的氧化物是优选的填料。 银金属是用于制造芯片附着组合物的优选填料。
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公开(公告)号：US4743302A
公开(公告)日：1988-05-10
申请号：US5040
申请日：1987-01-20
摘要： Fluid, stable glasses that are useful for low temperature sealing applications are made by adding jointly bismuth oxide, zinc oxide, and phosphorus pentoxide to the lead oxide-vanadium oxide binary. The phosphorous pentoxide may be replaced partially or entirely with niobium pentoxide and/or tantalum pentoxide. Additives and fillers may be incorporated into the glass composition to enhance the fluidity or adhesive characteristics of the glass, alter its coefficient of linear thermal expansion or make it suitable for die attach application. Group V metal oxides, particularly niobium pentoxide, are preferred fillers for altering the coefficient of linear thermal expansion. Similarly these Group V metal oxides may also be added as particulate fillers to lead borate, lead borosilicate and zinc borate glasses. Silver metal is a preferred filler for making die attach compositions.
摘要翻译： 用于低温密封应用的液体稳定的玻璃是通过将氧化铋，氧化锌和五氧化二磷加入到氧化铅 - 氧化钒二元体中制成的。 五氧化二磷可以部分或全部用五氧化二铌和/或五氧化二钽替代。 可以将添加剂和填料掺入到玻璃组合物中以增强玻璃的流动性或粘合特性，改变其线性热膨胀系数或使其适合于模具附着应用。 V族金属氧化物，特别是五氧化二铌，是用于改变线性热膨胀系数的优选填料。 类似地，这些V族金属氧化物也可作为颗粒填料加入到硼酸铅，硼硅酸铅和硼酸锌玻璃中。 银金属是制造贴片组合物的优选填料。
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公开(公告)号：US4186023A
公开(公告)日：1980-01-29
申请号：US901467
申请日：1978-05-01
CPC分类号： C03C27/00 , C03C12/00 , C03C8/245 , C04B35/632 , C04B37/025 , C04B37/042 , C04B2235/656 , C04B2235/6565 , C04B2235/6567 , C04B2237/10 , C04B2237/30 , C04B2237/343 , C04B2237/405 , C04B2237/406
摘要： Lead borate and lead zinc borate glasses containing from 0.1 to 10% by weight cuprous oxide (Cu.sub.2 O) and fluoride, the molar ratio of cuprous oxide to fluoride being in the range 1:0.25 to 1:10, preferably in the range 1:1 to 1:5, and up to 5% by weight bismuth oxide. These glasses may be mixed with particulate refractory fillers in amounts up to about 56% by volume. The sealing glasses are useful for bonding ceramic, glass and metal parts together at low temperatures. They are especially useful as semiconductor package sealants.
摘要翻译： 含有0.1至10重量％的氧化亚铜（Cu 2 O）和氟化物的硼酸铅和硼酸铅锌玻璃，氧化亚铜与氟化物的摩尔比在1:0.25至1:10的范围内，优选在1：1范围内 至1：5，和最多5％（重量）氧化铋。 这些玻璃可以与高达约56体积％的量的颗粒耐火填料混合。 密封玻璃可用于在低温下将陶瓷，玻璃和金属部件粘合在一起。 它们特别适用于半导体封装密封剂。
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公开(公告)号：US4002799A
公开(公告)日：1977-01-11
申请号：US658660
申请日：1976-02-17
CPC分类号： C03C10/0054 , C03C27/00 , C03C3/142 , C03C8/24 , C04B37/005 , C04B37/025 , C04B37/045 , C04B2235/6562 , C04B2235/6565 , C04B2235/6567 , C04B2235/662 , C04B2237/09 , C04B2237/10 , C04B2237/343 , C04B2237/40 , C04B2237/525 , C04B2237/708
摘要： Sealed semiconductor packages and the like and a method of making them are described. The sealant compositions employed are mixtures of finely divided solder glass and an oxygen containing zinc material. The solder glasses are either lead-boron glasses or lead-zinc-boran glasses in which the zinc-lead mol ratio is below 1:2.
摘要翻译： 对密封半导体封装等及其制造方法进行说明。 所使用的密封剂组合物是细碎的焊料玻璃和含氧锌材料的混合物。 焊锡玻璃是铅 - 硼玻璃或铅 - 锌 - 硼烷玻璃，其中锌铅摩尔比低于1：2。
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公开(公告)号：US5281561A
公开(公告)日：1994-01-25
申请号：US15460
申请日：1993-02-09
CPC分类号： C03C3/142 , C03C3/0745 , C03C8/245
摘要： A low temperature sealing glass composition suitable for sealing integrated circuit alumina packages at temperatures below 400.degree. C. in a short time of about ten minutes. This sealing glass composition is a mixture of a glass powder and 1 to 50% (by weight) of one or more low expansion ceramic powders. The glass powder comprises a lead borate or lead zinc borate glass and the joint addition of Cu.sub.2 O, Tl.sub.2 O and F in a range of 6.3 to 20% (by weight) wherein the molar ratio of Cu to Tl to F is in the range between 0.8 Cu: 0.8 Tl: 0.8 F to 1.2 Cu: 1.2 Tl: 1.2 F. The glass in powder form is blended with one or more compatible low expansion ceramic powders including cordierite, zircon, willemite, lead titanate or modified tin oxide.
摘要翻译： 一种低温密封玻璃组合物，适用于在短时间内约10分钟内在低于400摄氏度的温度下密封集成电路氧化铝包装。 该密封玻璃组合物是玻璃粉末和1至50％（重量）的一种或多种低膨胀陶瓷粉末的混合物。 该玻璃粉末包括硼酸铅或硼酸锌锌玻璃，Cu 2 O，Tl 2 O和F的连接添加量为6.3至20％（重量），其中Cu与Tl与F的摩尔比在0.8 Cu：0.8Tl：0.8F至1.2 Cu：1.2Tl：1.2F。粉末形式的玻璃与一种或多种兼容的低膨胀陶瓷粉末混合，包括堇青石，锆石，硅锌矿，钛酸铅或改性氧化锡。
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公开(公告)号：US4997718A
公开(公告)日：1991-03-05
申请号：US433539
申请日：1989-11-08
CPC分类号： H01L24/83 , C03C3/16 , C03C8/18 , C03C8/24 , H01L24/29 , H01L2224/29 , H01L2224/29101 , H01L2224/29288 , H01L2224/29339 , H01L2224/29344 , H01L2224/8319 , H01L2224/8389 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01041 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01073 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/15747 , H01L2924/15787
摘要： Extremely low-melting oxide glasses useful in silver/glass die-attach materials are disclosed. These glasses are composed of silver oxide, phosphorus oxide and a third component comprising PbO, CdO, ZnO or combination thereof. Their melting point lies in the 200.degree.-300.degree. C. range.
摘要翻译： 公开了用于银/玻璃芯片附着材料的极低熔点氧化物玻璃。 这些玻璃由氧化银，氧化磷和包含PbO，CdO，ZnO或其组合的第三组分组成。 它们的熔点在200-300℃的范围内。
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公开(公告)号：US4699888A
公开(公告)日：1987-10-13
申请号：US776610
申请日：1985-09-16
CPC分类号： H01L24/83 , C03C8/245 , C04B35/62655 , C04B35/63424 , C04B35/6365 , H01L23/4828 , H01L24/29 , C04B2237/062 , C04B2237/064 , C04B2237/122 , C04B2237/125 , C04B2237/126 , C04B2237/343 , C04B2237/708 , C04B2237/72 , H01L2224/29339 , H01L2224/32225 , H01L2224/8319 , H01L2224/8385 , H01L2224/8389 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01013 , H01L2924/01019 , H01L2924/01024 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01047 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/07802 , H01L2924/15787 , H01L2924/351
摘要： A silver-glass composition for use in attaching a semiconductor support and a method for making the attachment are disclosed. The glass component of the composition is a low melting point glass comprising about 75-85 wt. % lead oxide, about 8-15% boron oxide, about 0.75 to 2.5 wt. % silicon-dioxide, 0-10 wt. % zinc oxide, 0 to 3 wt. % alumina, 0.5 to 5.5 wt. % cuprousoxide and a non-volatile metal fluoride in amount such that the mol ratio of cuprous oxide to the fluoride content of the metal fluoride is in the range 1.0:0.25 to 1.0:10. The weight ratio of silver to glass in the composition is in the range about 2:1 to 9:1.
摘要翻译： 公开了一种用于安装半导体支架的银玻璃组合物和用于制造附件的方法。 该组合物的玻璃组分是一种低熔点玻璃，其包含约75-85wt。 ％氧化铅，约8-15％氧化硼，约0.75至2.5wt。 ％二氧化硅，0-10重量％ 氧化锌％，0〜3重量％ ％氧化铝，0.5〜5.5重量％ 量的氧化亚铜和非挥发性金属氟化物，使得氧化亚铜与金属氟化物的氟化物含量的摩尔比在1.0:0.25至1.0:10的范围内。 组合物中银与玻璃的重量比在约2:1至9:1的范围内。
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公开(公告)号：US3963505A
公开(公告)日：1976-06-15
申请号：US418247
申请日：1973-11-23
IPC分类号： C04B37/02 , C03C3/074 , C03C3/14 , C03C8/10 , C03C8/24 , C03C10/00 , C03C27/00 , C03C27/10 , C04B37/00 , H01L23/10 , C03C3/10 , C03C3/30
CPC分类号： C03C8/24 , C03C10/0054 , C03C27/00 , C03C3/142 , C03C8/245 , C04B37/005 , C04B37/045 , C04B2237/10 , C04B2237/343 , C04B2237/52 , C04B2237/525
摘要： Sealing compositions suitable for sealing semi-conductor packages and the like at temperatures below about 450.degree.C. The compositions are mixtures of finely divided solder glass and an oxygen containing zinc material. The solder glasses are either lead-boron glasses or lead-zinc-boron glasses in which the zinc-lead mol ratio is below 1:2.
摘要翻译： 适用于在低于约450℃的温度下密封半导体封装等的密封组合物。该组合物是细分的焊料玻璃和含氧锌材料的混合物。 焊接玻璃是铅 - 硼玻璃或铅 - 锌 - 硼玻璃，其中锌 - 铅摩尔比低于1：2。
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