公开(公告)号：US20100210759A1

公开(公告)日：2010-08-19

申请号：US12767857

申请日：2010-04-27

申请人： David Christopher Graham ,  Gary Anthony Holt, JR. ,  Jonathan Harold Laurer ,  Johnny Dale Massie, II ,  Melissa Marie Waldeck ,  Sean Terrence Weaver ,  Rich Wells

发明人： David Christopher Graham ,  Gary Anthony Holt, JR. ,  Jonathan Harold Laurer ,  Johnny Dale Massie, II ,  Melissa Marie Waldeck ,  Sean Terrence Weaver ,  Rich Wells

IPC分类号： C09J163/00

CPC分类号： B41J2/1623 ,  B41J2/14024 ,  B41J2/1408 ,  B41J2/1601

摘要： Adhesive compositions, micro-fluid ejection devices, and methods for attaching micro-fluid ejection heads to devices. One such adhesive composition is provided for use in attaching a micro-fluid ejection head to a device, such as to reduce chip bowing and/or to decrease chip fragility upon curing of the adhesive. Such an exemplary composition may include one having from about 50.0 to about 95.0 percent by weight of at least one cross-linkable resin selected from the group consisting of epoxy resins, siloxane resins, urethane resins, and functionalized olefin resins; from about 0.1 to about 25.0 percent by weight of at least one thermal curative agent; and from about 0.0 to about 30.0 percent by weight filler, and exhibit a relatively low shear modulus upon curing (e.g., less than about 10.0 MPa at 25° C.).

摘要翻译： 粘合剂组合物，微流体喷射装置和用于将微流体喷射头附接到装置的方法。 提供一种这样的粘合剂组合物用于将微流体喷射头附接到装置，例如在粘合剂固化时减少切屑弯曲和/或降低切屑脆性。 这样的示例性组合物可以包括具有约50.0至约95.0重量％的至少一种选自环氧树脂，硅氧烷树脂，聚氨酯树脂和官能化烯烃树脂的交联树脂; 约0.1至约25.0重量％的至少一种热固化剂; 和约0.0-约30.0重量％的填料，并且在固化时表现出相对低的剪切模量（例如在25℃下小于约10.0MPa）。

公开(公告)号：US20080079779A1

公开(公告)日：2008-04-03

申请号：US11536438

申请日：2006-09-28

申请人： Robert Lee Cornell ,  Robert Wilson Cornell ,  Curtis Ray Droege ,  Elios Klemo ,  Timothy Lowell Strunk ,  Melissa Marie Waldeck

发明人： Robert Lee Cornell ,  Robert Wilson Cornell ,  Curtis Ray Droege ,  Elios Klemo ,  Timothy Lowell Strunk ,  Melissa Marie Waldeck

IPC分类号： B41J2/06

CPC分类号： B41J2/14129 ,  B41J2/1408

摘要： Methods for improving the thermal conductivity of a substrate for a micro-fluid ejection head and micro-fluid ejection heads are provided. One such head includes a substrate having a thermal conductivity ranging from about 1.4 W/m-° C. to about 148 W/m-° C., a fluid ejection actuator, and a thermal bus thermally adjacent to the substrate and configured to dissipate heat associated with the operation of the actuator. Exemplary modified substrates have improved thermal conductivity characteristics as compared to a corresponding substrate not modified to include the thermal bus.

摘要翻译： 提供了用于提高用于微流体喷射头和微流体喷射头的基底的导热性的方法。 一个这样的头包括具有从约1.4W / m-℃至约148W / m-℃的热导率的衬底，流体喷射致动器和与衬底热相邻并且被配置为消散 与致动器的操作相关联的热量。 与没有修改为包括热母线的相应衬底相比，示例性的改性衬底具有改善的导热特性。

公开(公告)号：US08163819B2

公开(公告)日：2012-04-24

申请号：US12767857

申请日：2010-04-27

申请人： David Christopher Graham ,  Gary Anthony Holt, Jr. ,  Jonathan Harold Laurer ,  Johnny Dale Massie, II ,  Melissa Marie Waldeck ,  Sean Terrence Weaver ,  Rich Wells

发明人： David Christopher Graham ,  Gary Anthony Holt, Jr. ,  Jonathan Harold Laurer ,  Johnny Dale Massie, II ,  Melissa Marie Waldeck ,  Sean Terrence Weaver ,  Rich Wells

IPC分类号： C08L63/00 ,  C09J163/00

CPC分类号： B41J2/1623 ,  B41J2/14024 ,  B41J2/1408 ,  B41J2/1601

摘要： Adhesive compositions, micro-fluid ejection devices, and methods for attaching micro-fluid ejection heads to devices. One such adhesive composition is provided for use in attaching a micro-fluid ejection head to a device, such as to reduce chip bowing and/or to decrease chip fragility upon curing of the adhesive. Such an exemplary composition may include one having from about 50.0 to about 95.0 percent by weight of at least one cross-linkable resin selected from the group consisting of epoxy resins, siloxane resins, urethane resins, and functionalized olefin resins; from about 0.1 to about 25.0 percent by weight of at least one thermal curative agent; and from about 0.0 to about 30.0 percent by weight filler, and exhibit a relatively low shear modulus upon curing (e.g., less than about 10.0 MPa at 25° C.).

摘要翻译： 粘合剂组合物，微流体喷射装置和用于将微流体喷射头附接到装置的方法。 提供一种这样的粘合剂组合物用于将微流体喷射头附接到装置，例如在粘合剂固化时减少切屑弯曲和/或降低切屑脆性。 这样的示例性组合物可以包括具有约50.0至约95.0重量％的至少一种选自环氧树脂，硅氧烷树脂，聚氨酯树脂和官能化烯烃树脂的交联树脂; 约0.1至约25.0重量％的至少一种热固化剂; 和约0.0-约30.0重量％的填料，并且在固化时表现出相对低的剪切模量（例如在25℃下小于约10.0MPa）。

公开(公告)号：US07267431B2

公开(公告)日：2007-09-11

申请号：US10881961

申请日：2004-06-30

申请人： Frank Edward Anderson ,  Jeffery James Buchanan ,  Curtis Ray Droege ,  David Emerson Greer ,  Kin Ming Kwan ,  Gregory Alan Long ,  Ganesh Vinayak Phatak ,  Paul Timothy Spivey ,  Carl Edmond Sullivan ,  Kent Lee Ubellacker ,  Melissa Marie Waldeck

发明人： Frank Edward Anderson ,  Jeffery James Buchanan ,  Curtis Ray Droege ,  David Emerson Greer ,  Kin Ming Kwan ,  Gregory Alan Long ,  Ganesh Vinayak Phatak ,  Paul Timothy Spivey ,  Carl Edmond Sullivan ,  Kent Lee Ubellacker ,  Melissa Marie Waldeck

IPC分类号： B41J2/05 ,  B41J2/015

CPC分类号： B41J2/17513

摘要： A multi-fluid body and an ejection head substrate connected in fluid flow communication with the multi-fluid body for ejecting multiple fluids therefrom. The multi-fluid body includes at least two segregated fluid chambers. Independent fluid supply paths lead from each of the fluid chambers providing fluid to multiple fluid flow paths in the ejection head substrate. The ejection head substrate is attached adjacent an ejection head area of the body. The fluid flow paths in the ejection head substrate have a flow path density of greater than about one flow paths per millimeter.

摘要翻译： 多流体和喷射头基板，其与多流体本体流体连通地连通，用于从其中喷射多个流体。 多流体包括至少两个分离的流体室。 独立的流体供应路径从每个流体室引导，以提供流体到喷射头基板中的多个流体流动路径。 喷射头基板被附接在身体的喷射头部区域附近。 喷射头基板中的流体流动路径具有大于每毫米约一个流动路径的流路密度。

公开(公告)号：US07025439B2

公开(公告)日：2006-04-11

申请号：US10800989

申请日：2004-03-15

申请人： Jonathon Harold Laurer ,  Paul Timothy Spivey ,  Melissa Marie Waldeck ,  John Thomas Warren

发明人： Jonathon Harold Laurer ,  Paul Timothy Spivey ,  Melissa Marie Waldeck ,  John Thomas Warren

IPC分类号： B41J2/14

CPC分类号： B41J2/1433 ,  B41J2/162 ,  B41J2/1623 ,  B41J2/1634 ,  B41J2002/14387 ,  B41J2002/14491

摘要： The invention provides a micro-fluid ejection head for a micro-fluid ejection device and a method for making a micro-fluid ejection head. The micro-fluid ejection head includes a semiconductor substrate containing fluid ejection devices electrically connected to contact pads on a surface thereof. A TAB circuit including lead beams is electrically connected to the contact pads on the semiconductor substrate surface. A nozzle plate structure is provided and installed relative to the TAB circuit so as to substantially cover the lead beams and contact pads in order to protect the lead beams and contact pads from exposure to fluid ejected by the micro-fluid ejection device. The micro-fluid ejection head is effective to reduce contact between electrical components and the fluid without the use of a separate encapsulant material.

摘要翻译： 本发明提供了一种用于微流体喷射装置的微流体喷射头和用于制造微流体喷射头的方法。 微流体喷射头包括含有与其表面上的接触焊盘电连接的流体喷射装置的半导体衬底。 包括引导光束的TAB电路电连接到半导体衬底表面上的接触焊盘。 提供并相对于TAB电路安装喷嘴板结构，以便基本上覆盖引导梁和接触垫，以便保护引导梁和接触垫不被暴露于由微流体喷射装置喷射的流体。 微流体喷射头有效地减少电气部件和流体之间的接触，而不使用单独的密封剂材料。