公开(公告)号：US06840374B2

公开(公告)日：2005-01-11

申请号：US10050908

申请日：2002-01-18

Applicant: Igor Y. Khandros ,  Benjamin N. Eldridge ,  Treliant Fang ,  Gaetan L. Mathieu ,  Gary W. Grube ,  Michael A. Drush ,  Christopher C. Buckholtz

Inventor： Igor Y. Khandros ,  Benjamin N. Eldridge ,  Treliant Fang ,  Gaetan L. Mathieu ,  Gary W. Grube ,  Michael A. Drush ,  Christopher C. Buckholtz

IPC: A47L25/00 ,  B08B1/00 ,  B08B7/00 ,  C08L83/05 ,  C08L83/07 ,  C08L83/08 ,  G01R1/067 ,  G01R3/00 ,  H01L21/304 ,  H01L21/66 ,  B65D69/00 ,  B32B5/00 ,  B32B9/04

CPC classification number: C08G77/48 ,  B08B1/00 ,  B08B7/0028 ,  G01R1/06711 ,  G01R3/00 ,  Y10T428/24388 ,  Y10T428/31663

Abstract: A probe cleaning apparatus for cleaning a probe tip use to test semiconductors dies having an abrasive substrate layer an a tacky gel layer on top of the abrasive surface of the abrasive substrate layer. The probe tip is cleaned by passing it through the tacky gel layer so that it comes in contact with the abrasive surface of the abrasive substrate, moving the probe tip across the abrasive surface of the substrate layer, and then removing the probe tip from the successive layers of the cleaning apparatus. The probe tip emerges from the cleaning apparatus free from debris associated with testing the semiconductor dies.

Abstract translation: 用于清洁探针头的探针清洁装置用于测试在磨料基底层的研磨表面的顶部上具有磨料基底层和粘性凝胶层的半导体模具。 通过将探针尖端通过粘性凝胶层进行清洁，使其与磨料基材的研磨表面接触，使探针尖端跨过基底层的研磨表面，然后从连续的 层的清洁装置。 探针尖端从清洁设备中出来，没有与测试半导体管芯相关的碎片。