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公开(公告)号：US20170176116A1
公开(公告)日：2017-06-22
申请号：US14975676
申请日：2015-12-18
Applicant: Renee Wu , Michael Nikkhoo
Inventor： Renee Wu , Michael Nikkhoo
CPC classification number: F28F21/02 , B23P15/26 , F28F21/065 , H01L23/3737 , H01L23/42 , H01L23/552
Abstract: A formable structure comprises a first material having a first level of viscosity and a second material having a second level of viscosity, wherein the second material is formed to hold at least a portion of the first material in a particular position or a particular shape. The first material can be configured to function as a thermal interface between two or more hardware components. The second material can be configured to have a higher viscosity than the first material. In one illustrative example, the second material can include a light-activated resin that is configured to harden when exposed to one or more treatments. By the use of the first material and second material, the techniques disclosed herein are adaptable to gaps having a wide range of sizes, which is difficult to do with traditional thermal interface materials. The second material can also function as an EMI shield.
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公开(公告)号：US20160381832A1
公开(公告)日：2016-12-29
申请号：US14754483
申请日：2015-06-29
Applicant: Erin Hurbi , Michael Nikkhoo , Douglas L. Heirich
Inventor： Erin Hurbi , Michael Nikkhoo , Douglas L. Heirich
CPC classification number: H05K7/20509 , B23P15/26 , B23P2700/10 , F28D2021/0028 , F28F21/02 , F28F2013/001 , F28F2255/00 , G02B27/0176 , H01L23/373 , H01L23/3733
Abstract: A thermal conduit configured to conduct heat from a heat source to a heat sink and method of forming said conduit are disclosed herein. The thermal conduit may comprise a plurality of stacked sheets formed of an anisotropically thermally conductive material, a non-limiting example of which is graphite, each sheet with a respective orientation of thermal conduction. The orientations of thermal conduction of the plurality of sheets may change stepwise in a stacking direction to form a curved thermal flow path.
Abstract translation: 本文公开了一种构造成将热量从热源传导到散热器的热导管和形成所述导管的方法。 热导管可以包括由各向异性导热材料形成的多个堆叠片材，其非限制性实例是石墨，每个片材具有相应的导热取向。 多个片材的热传导取向可以在层叠方向上逐步变化，形成弯曲的热流路径。
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公开(公告)号：US20160375600A1
公开(公告)日：2016-12-29
申请号：US14754505
申请日：2015-06-29
Applicant: Igor Markovsky , Michael Nikkhoo , Scott Francis Fullam
Inventor： Igor Markovsky , Michael Nikkhoo , Scott Francis Fullam
IPC: B26D7/10
CPC classification number: B26D7/10
Abstract: Examples are disclosed that relate to heat-based cutting of an adhesive joint of a device. One disclosed example provides a device, comprising an adhesive joint connecting a first component and a second component via an adhesive layer, and a cutting affordance incorporated within the device and positioned within the adhesive joint or adjacent the adhesive joint.
Abstract translation: 公开了与装置的粘合剂接头的热基切割有关的实例。 一个公开的示例提供了一种装置，其包括通过粘合剂层连接第一部件和第二部件的粘合剂接合件，以及结合在该装置内并定位在粘合剂接合部内或邻近粘合剂接头的切割加工件。
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公开(公告)号：US20160252724A1
公开(公告)日：2016-09-01
申请号：US14600659
申请日：2015-01-20
Applicant: Michael Nikkhoo
Inventor： Michael Nikkhoo
CPC classification number: G02B27/0172 , G02B6/0043 , G02B6/005 , G02B6/0065 , G02B27/0081 , G02B2027/0178 , G02B2027/0194 , G02B2027/0196
Abstract: The technology provides a waveguide display including an optical waveguide comprising a plurality of separated parallel optical substrates. The substrates are joined by an adhesive configured to have suspended therein a plurality of hard microspheres. The adhesive may be a pressure sensitive adhesive designed to have suspended therein the microspheres. Microspheres may have diameters on the order of a few microns up to 100 microns. The waveguide may be constructed of first and second optical substrates, and a pressure sensitive adhesive including embedded microspheres joining and spacing the substrates apart from each other. Additional substrates may be provided. The technology also provides a method of manufacturing a waveguide.
Abstract translation: 该技术提供一种波导显示器，其包括包括多个分离的平行光学基板的光波导。 基板通过被配置为在其中悬挂有多个硬微球体的粘合剂连接。 粘合剂可以是设计成在其中悬浮在其中的压敏粘合剂。 微球可以具有几微米直到100微米的直径。 波导可以由第一和第二光学基底构成，并且压敏粘合剂包括嵌入的微球，将基片彼此分开连接并间隔开。 可以提供附加的基底。 该技术还提供了制造波导的方法。
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公开(公告)号：US20170332070A1
公开(公告)日：2017-11-16
申请号：US15154809
申请日：2016-05-13
Applicant: Igor Markovsky , Michael Nikkhoo
Inventor： Igor Markovsky , Michael Nikkhoo
CPC classification number: H04N13/341 , G02B27/017 , G02B27/0172 , G02B2027/0134 , G02B2027/0136 , G02B2027/0178
Abstract: A head-up display system comprises a microprojector, first and second viewer optics, a redirection optic, and an electronic controller. Switchable electronically between first and second optical states, the redirection optic is configured to receive a display image from the microprojector, to convey the display image, in the first optical state, to the first viewer optic, and to convey the display image, in the second optical state, to the second viewer optic. The electronic controller is configured to, during a first interval, switch and maintain the redirection optic in the first optical state and cause the microprojector to form the display image based on first image data. The electronic controller is further configured to, during a second interval, switch and maintain the redirection optic in the second optical state and cause the microprojector to form the display image based on second image data.
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Patent Agency Ranking
公开(公告)号：US20160209660A1
公开(公告)日：2016-07-21
申请号：US14601097
申请日：2015-01-20
Applicant: Michael Nikkhoo , Erin Hurbi
Inventor： Michael Nikkhoo , Erin Hurbi
CPC classification number: G02B27/0176 , B29D12/02 , G02B6/0085 , G02B27/017 , G02B2027/0178
Abstract: A passive thermal heat-pipe material comprising an optical mounting structure including heat producing electronic components is provided. Each structural component of the optical mounting structure may be at least partially comprised of a polymer including a plurality of carbon nanoparticles. In a further aspect, a method of creating an optical structure adapted to support a plurality of heat emitting components is provided. The method includes adding a percentage by concentration of carbon nanoparticles to a polymer base material, mixing the polymer base material and carbon nanoparticles uniformly, melting the mixture at high temperature, forming the melted mixture into a component of the optical structure, and cooling the formed component to solidify the component. The percentage may be between 2 and 10 percent.
Abstract translation: 提供了一种包括包括发热电子部件的光学安装结构的被动热管材。 光学安装结构的每个结构部件可以至少部分地由包括多个碳纳米颗粒的聚合物组成。 在另一方面，提供了一种创建适于支撑多个发热部件的光学结构的方法。 该方法包括将碳纳米颗粒的浓度百分比加入到聚合物基材中，均匀混合聚合物基材和碳纳米颗粒，在高温下熔融混合物，将熔融混合物形成为光学结构的组分，并冷却形成 组分固化组分。 百分比可能在2％到10％之间。
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公开(公告)号：US08881387B2
公开(公告)日：2014-11-11
申请号：US13270448
申请日：2011-10-11
Applicant: Gloria Lin , Wyeman Chen , Michael Nikkhoo , Michael Rosenblatt , Hammid Mohammadinia , Ziv Wolkowicki , Amir Salehi
Inventor： Gloria Lin , Wyeman Chen , Michael Nikkhoo , Michael Rosenblatt , Hammid Mohammadinia , Ziv Wolkowicki , Amir Salehi
CPC classification number: H05K9/0024 , H05K1/0218 , H05K1/095 , H05K3/1241 , H05K3/245 , H05K3/284 , H05K2203/0126 , H05K2203/1476 , Y10T29/49117 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T29/49158 , Y10T29/49169 , Y10T29/49171
Abstract: This is directed to methods and apparatus for shielding a circuitry region of an electronic device from interference (e.g., EMI). A conductive dam may be formed about a periphery of the circuitry region. A non-conductive or electrically insulating fill may then be applied to the circuitry region within the dam. Next, a conductive cover may be applied above the fill. The cover may be electrically coupled to the dam. The dam may include two or more layers of conductive material stacked on top of one another. In some embodiments, the conductive cover may be pad printed or screen printed above the fill. In other embodiments, the conductive cover may be a conductive tablet that is melted above the fill.
Abstract translation: 这涉及用于屏蔽电子设备的电路区域的干扰（例如，EMI）的方法和装置。 可以围绕电路区域的外围形成导电阻挡层。 然后可以将非导电或电绝缘填充物施加到坝内的电路区域。 接下来，可以在填充物上方施加导电盖。 盖可以电连接到大坝。 大坝可以包括堆叠在彼此之上的两层或更多层导电材料。 在一些实施例中，导电盖可以在填充物上方被印刷或丝网印刷。 在其他实施例中，导电盖可以是在填充物上方熔化的导电片。
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公开(公告)号：US20120024588A1
公开(公告)日：2012-02-02
申请号：US13270421
申请日：2011-10-11
Applicant: Gloria Lin , Wyeman Chen , Michael Nikkhoo , Michael Rosenblatt , Hammid Mohammadinia , Ziv Wolkowicki , Amir Salehi
Inventor： Gloria Lin , Wyeman Chen , Michael Nikkhoo , Michael Rosenblatt , Hammid Mohammadinia , Ziv Wolkowicki , Amir Salehi
IPC: H05K9/00
CPC classification number: H05K9/0024 , H05K1/0218 , H05K1/095 , H05K3/1241 , H05K3/245 , H05K3/284 , H05K2203/0126 , H05K2203/1476 , Y10T29/49117 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T29/49158 , Y10T29/49169 , Y10T29/49171
Abstract: This is directed to methods and apparatus for shielding a circuitry region of an electronic device from interference (e.g., EMI). A conductive dam may be formed about a periphery of the circuitry region. A non-conductive or electrically insulating fill may then be applied to the circuitry region within the dam. Next, a conductive cover may be applied above the fill. The cover may be electrically coupled to the dam. The dam may include two or more layers of conductive material stacked on top of one another. In some embodiments, the conductive cover may be pad printed or screen printed above the fill. In other embodiments, the conductive cover may be a conductive tablet that is melted above the fill.
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公开(公告)号：US20100224401A1
公开(公告)日：2010-09-09
申请号：US12397922
申请日：2009-03-04
Applicant: Gloria Lin , Wyeman Chen , Michael Nikkhoo , Michael Rosenblatt , Hammid Mohammadinia , Ziv Wolkowicki , Amir Salehi
Inventor： Gloria Lin , Wyeman Chen , Michael Nikkhoo , Michael Rosenblatt , Hammid Mohammadinia , Ziv Wolkowicki , Amir Salehi
CPC classification number: H05K9/0024 , H05K1/0218 , H05K1/095 , H05K3/1241 , H05K3/245 , H05K3/284 , H05K2203/0126 , H05K2203/1476 , Y10T29/49117 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T29/49158 , Y10T29/49169 , Y10T29/49171
Abstract: This is directed to methods and apparatus for shielding a circuitry region of an electronic device from interference (e.g., EMI). A conductive dam may be formed about a periphery of the circuitry region. A non-conductive or electrically insulating fill may then be applied to the circuitry region within the dam. Next, a conductive cover may be applied above the fill. The cover may be electrically coupled to the dam. The dam may include two or more layers of conductive material stacked on top of one another. In some embodiments, the conductive cover may be pad printed or screen printed above the fill. In other embodiments, the conductive cover may be a conductive tablet that is melted above the fill.
Abstract translation: 这涉及用于屏蔽电子设备的电路区域的干扰（例如，EMI）的方法和装置。 可以围绕电路区域的外围形成导电阻挡层。 然后可以将非导电或电绝缘填充物施加到坝内的电路区域。 接下来，可以在填充物上方施加导电盖。 盖可以电连接到大坝。 大坝可以包括堆叠在彼此之上的两层或更多层导电材料。 在一些实施例中，导电盖可以在填充物上方被印刷或丝网印刷。 在其他实施例中，导电盖可以是在填充物上方熔化的导电片。
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公开(公告)号：US09726962B1
公开(公告)日：2017-08-08
申请号：US15143362
申请日：2016-04-29
Applicant: Ravi Nalla , Michael Nikkhoo , Igor Markovsky
Inventor： Ravi Nalla , Michael Nikkhoo , Igor Markovsky
IPC: G03B17/56
CPC classification number: G03B17/561 , F16M13/00
Abstract: The techniques disclosed herein provide an enhanced mount for a camera module. The mount comprises at least a first side and a second side. The sides are formed to enable contact with at least a portion of the camera module. The sides are configured with openings to enable a fastening material, such as an adhesive, to secure the camera module to the mount. Openings within the mount enable the use of a fastening material to secure the camera module to at least one surface of the mount while allowing the camera module and at least one surface to maintain the mechanical contact. In some configurations, one or more openings are formed such that a contraction of the fastening material pulls the camera module toward at least one surface of the mount.
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