Modular display rack
    2.
    发明申请
    Modular display rack 审中-公开
    模块化展示架

    公开(公告)号:US20060273056A1

    公开(公告)日:2006-12-07

    申请号:US11433828

    申请日:2006-05-15

    IPC分类号: A47B47/00

    CPC分类号: A47F5/01

    摘要: The display rack of the present invention includes a main frame, at least two shelf receiving portions, a plurality of shelves and at least one basket, peg hook basket or reel assembly. The main frame has a back portion and side portions. Each shelf receiving portion is attached to the main frame and has a plurality of generally vertically spaced apart shelf receiving apertures formed therein. Each shelf has spaced apart shelf fingers adapted to be received in the shelf receiving apertures. The plurality of shelves is chosen from the group consisting of shelf basket racks and shelf reel racks. In another aspect of the invention there is provided a web basket for use in association with hanging products. The web basket includes a hook portion, a basket portion and a means for attaching the basket to a shelf. The basket portion is spaced below the hook portion.

    摘要翻译: 本发明的显示架包括主框架,至少两个搁架接收部分,多个架子和至少一个篮子,钉钩篮或卷轴组件。 主框架具有后部和侧部。 每个搁架接收部分附接到主框架并且具有形成在其中的多个大致垂直间隔的搁架接收孔。 每个搁板具有适于容纳在搁板接收孔中的间隔开的搁板指状物。 多个货架选自货架架架和货架卷架。 在本发明的另一方面,提供了一种用于与悬挂产品相关联的网篮。 网篮包括钩部,篮部和用于将篮附接到搁架的装置。 筐部分在钩部下方间隔开。

    METHOD OF FORMING NITRIDE FILMS WITH HIGH COMPRESSIVE STRESS FOR IMPROVED PFET DEVICE PERFORMANCE
    3.
    发明申请
    METHOD OF FORMING NITRIDE FILMS WITH HIGH COMPRESSIVE STRESS FOR IMPROVED PFET DEVICE PERFORMANCE 有权
    用于改进PFET器件性能的用于形成具有高压应力的氮化物膜的方法

    公开(公告)号:US20080036007A1

    公开(公告)日:2008-02-14

    申请号:US11875217

    申请日:2007-10-19

    IPC分类号: H01L21/8234

    摘要: A method is provided for making a FET device in which a nitride layer overlies the PFET gate structure, where the nitride layer has a compressive stress with a magnitude greater than about 2.8 GPa. This compressive stress permits improved device performance in the PFET. The nitride layer is deposited using a high-density plasma (HDP) process, wherein the substrate is disposed on an electrode to which a bias power in the range of about 50 W to about 500 W is supplied. The bias power is characterized as high-frequency power (supplied by an RF generator at 13.56 MHz). The FET device may also include NFET gate structures. A blocking layer is deposited over the NFET gate structures so that the nitride layer overlies the blocking layer; after the blocking layer is removed, the nitride layer is not in contact with the NFET gate structures. The nitride layer has a thickness in the range of about 300-2000 Å.

    摘要翻译: 提供了一种用于制造其中氮化物层覆盖PFET栅极结构的FET器件的方法,其中氮化物层具有大于约2.8GPa的量级的压缩应力。 这种压应力允许改进PFET中的器件性能。 使用高密度等离子体(HDP)工艺沉积氮化物层,其中衬底设置在供给约50W至约500W范围内的偏置功率的电极上。 偏置功率被表征为高频功率(由13.56MHz的RF发生器提供)。 FET器件还可以包括NFET栅极结构。 在NFET栅极结构上沉积阻挡层,使得氮化物层覆盖阻挡层; 在去除阻挡层之后,氮化物层不与NFET栅极结构接触。 氮化物层的厚度在约300-2000埃的范围内。

    METHOD OF FORMING NITRIDE FILMS WITH HIGH COMPRESSIVE STRESS FOR IMPROVED PFET DEVICE PERFORMANCE
    4.
    发明申请
    METHOD OF FORMING NITRIDE FILMS WITH HIGH COMPRESSIVE STRESS FOR IMPROVED PFET DEVICE PERFORMANCE 失效
    用于改进PFET器件性能的用于形成具有高压应力的氮化物膜的方法

    公开(公告)号:US20070007548A1

    公开(公告)日:2007-01-11

    申请号:US11160705

    申请日:2005-07-06

    摘要: A method is provided for making a FET device in which a nitride layer overlies the PFET gate structure, where the nitride layer has a compressive stress with a magnitude greater than about 2.8 GPa. This compressive stress permits improved device performance in the PFET. The nitride layer is deposited using a high-density plasma (HDP) process, wherein the substrate is disposed on an electrode to which a bias power in the range of about 50 W to about 500 W is supplied. The bias power is characterized as high-frequency power (supplied by an RF generator at 13.56 MHz). The FET device may also include NFET gate structures. A blocking layer is deposited over the NFET gate structures so that the nitride layer overlies the blocking layer; after the blocking layer is removed, the nitride layer is not in contact with the NFET gate structures. The nitride layer has a thickness in the range of about 300-2000 Å.

    摘要翻译: 提供了一种用于制造其中氮化物层覆盖PFET栅极结构的FET器件的方法,其中氮化物层具有大于约2.8GPa的量级的压缩应力。 这种压应力允许改进PFET中的器件性能。 使用高密度等离子体(HDP)工艺沉积氮化物层,其中衬底设置在供给约50W至约500W范围内的偏置功率的电极上。 偏置功率被表征为高频功率(由13.56MHz的RF发生器提供)。 FET器件还可以包括NFET栅极结构。 在NFET栅极结构上沉积阻挡层,使得氮化物层覆盖阻挡层; 在去除阻挡层之后,氮化物层不与NFET栅极结构接触。 氮化物层的厚度在约300-2000埃的范围内。