公开(公告)号：US06946052B2

公开(公告)日：2005-09-20

申请号：US10834932

申请日：2004-04-30

申请人： Kazutaka Yanagita ,  Mitsuharu Kohda ,  Kiyofumi Sakaguchi ,  Akira Fujimoto

发明人： Kazutaka Yanagita ,  Mitsuharu Kohda ,  Kiyofumi Sakaguchi ,  Akira Fujimoto

IPC分类号： H01L27/12 ,  H01L21/00 ,  H01L21/02 ,  H01L21/20 ,  H01L21/301 ,  H01L21/336 ,  H01L21/762 ,  H01L29/786 ,  H01L21/46

CPC分类号： H01L21/67253 ,  H01L21/67092 ,  H01L21/76259 ,  Y10T156/1126 ,  Y10T156/19 ,  Y10T156/1928 ,  Y10T156/1939

摘要： This invention is to guarantee that in separating a plate member such as a bonded substrate stack, a fluid is injected to an appropriate portion of the plate member. While a bonded substrate stack (50) is rotated, the vertical position of its peripheral portion is measured throughout its perimeter by a measuring device (150). Then, while the vertical position of a nozzle (120) is dynamically adjusted on the basis of the measurement result, and at the same time, the bonded substrate stack (50) is rotated, the bonded substrate stack (50) is separated into two substrates at a porous layer by injecting a fluid ejected from the nozzle (120).

摘要翻译： 本发明是为了保证在分离诸如键合衬底叠层之类的板件时，将流体注入板件的适当部分。 当键合衬底叠层（50）旋转时，其周边部分的垂直位置通过测量装置（150）在其整个周边被测量。 然后，在基于测定结果对喷嘴（120）的垂直位置进行动态调整的同时，键合衬底叠层（50）同时旋转，键合衬底叠层（50）分成两部分 通过注射从喷嘴（120）喷出的流体在多孔层处的基底。

公开(公告)号：US06867110B2

公开(公告)日：2005-03-15

申请号：US10152690

申请日：2002-05-23

申请人： Kazutaka Yanagita ,  Mitsuharu Kohda ,  Kiyofumi Sakaguchi ,  Akira Fujimoto

发明人： Kazutaka Yanagita ,  Mitsuharu Kohda ,  Kiyofumi Sakaguchi ,  Akira Fujimoto

IPC分类号： H01L27/12 ,  H01L21/00 ,  H01L21/02 ,  H01L21/20 ,  H01L21/301 ,  H01L21/336 ,  H01L21/762 ,  H01L29/786 ,  H01L21/46

CPC分类号： H01L21/67253 ,  H01L21/67092 ,  H01L21/76259 ,  Y10T156/1126 ,  Y10T156/19 ,  Y10T156/1928 ,  Y10T156/1939

摘要： This invention is to guarantee that in separating a plate member such as a bonded substrate stack, a fluid is injected to an appropriate portion of the plate member. While a bonded substrate stack (50) is rotated, the vertical position of its peripheral portion is measured throughout its perimeter by a measuring device (150). Then, while the vertical position of a nozzle (120) is dynamically adjusted on the basis of the measurement result, and at the same time, the bonded substrate stack (50) is rotated, the bonded substrate stack (50) is separated into two substrates at a porous layer by injecting a fluid ejected from the nozzle (120).

摘要翻译： 本发明是为了保证在分离诸如键合衬底叠层之类的板件时，将流体注入板件的适当部分。 当键合衬底叠层（50）旋转时，其周边部分的垂直位置通过测量装置（150）在其整个周边被测量。 然后，在基于测定结果对喷嘴（120）的垂直位置进行动态调整的同时，键合衬底叠层（50）同时旋转，键合衬底叠层（50）分成两部分 通过注射从喷嘴（120）喷出的流体在多孔层处的基底。

公开(公告)号：US06946046B2

公开(公告)日：2005-09-20

申请号：US10944864

申请日：2004-09-21

申请人： Kazutaka Yanagita ,  Mitsuharu Kohda ,  Kiyofumi Sakaguchi ,  Akira Fujimoto

发明人： Kazutaka Yanagita ,  Mitsuharu Kohda ,  Kiyofumi Sakaguchi ,  Akira Fujimoto

IPC分类号： H01L21/762 ,  H01L21/00 ,  H01L21/02 ,  H01L21/20 ,  H01L21/336 ,  H01L27/12 ,  H01L29/786 ,  B32B31/00

CPC分类号： H01L21/67092 ,  Y10S156/937 ,  Y10T83/364 ,  Y10T156/1137 ,  Y10T156/19 ,  Y10T156/1906 ,  Y10T156/1939

摘要： This invention is to appropriately separate a bonded substrate stack regardless of some distortion in the bonded substrate stack or the like. This separating apparatus includes a first nozzle which forms a jet with a large width and a second nozzle which forms a jet with a small width. When the outer portion of a bonded substrate stack is to be separated, a jet formed by the first nozzle is used. After that, when a portion inside the outer portion is to be separated, a jet formed by the second nozzle is used.

公开(公告)号：US20050034821A1

公开(公告)日：2005-02-17

申请号：US10944864

申请日：2004-09-21

申请人： Kazutaka Yanagita ,  Mitsuharu Kohda ,  Kiyofumi Sakaguchi ,  Akira Fujimoto

发明人： Kazutaka Yanagita ,  Mitsuharu Kohda ,  Kiyofumi Sakaguchi ,  Akira Fujimoto

IPC分类号： H01L21/762 ,  H01L21/00 ,  H01L21/02 ,  H01L21/20 ,  H01L21/336 ,  H01L27/12 ,  H01L29/786 ,  B32B1/00 ,  B32B31/00

CPC分类号： H01L21/67092 ,  Y10S156/937 ,  Y10T83/364 ,  Y10T156/1137 ,  Y10T156/19 ,  Y10T156/1906 ,  Y10T156/1939

摘要： This invention is to appropriately separate a bonded substrate stack regardless of some distortion in the bonded substrate stack or the like. This separating apparatus includes a first nozzle which forms a jet with a large width and a second nozzle which forms a jet with a small width. When the outer portion of a bonded substrate stack is to be separated, a jet formed by the first nozzle is used. After that, when a portion inside the outer portion is to be separated, a jet formed by the second nozzle is used.

摘要翻译： 本发明是为了适当地分离键合衬底叠层而不管键合衬底叠层等中的某些变形。 这种分离装置包括形成大宽度射流的第一喷嘴和形成小宽度的射流的第二喷嘴。 当键合衬底叠层的外部部分被分离时，使用由第一喷嘴形成的射流。 此后，当外部部分内的部分被分离时，使用由第二喷嘴形成的射流。

公开(公告)号：US06852187B2

公开(公告)日：2005-02-08

申请号：US10178359

申请日：2002-06-25

申请人： Kazutaka Yanagita ,  Mitsuharu Kohda ,  Kiyofumi Sakaguchi ,  Akira Fujimoto

发明人： Kazutaka Yanagita ,  Mitsuharu Kohda ,  Kiyofumi Sakaguchi ,  Akira Fujimoto

IPC分类号： H01L21/762 ,  H01L21/00 ,  H01L21/02 ,  H01L21/20 ,  H01L21/336 ,  H01L27/12 ,  H01L29/786 ,  B32B31/00

CPC分类号： H01L21/67092 ,  Y10S156/937 ,  Y10T83/364 ,  Y10T156/1137 ,  Y10T156/19 ,  Y10T156/1906 ,  Y10T156/1939

摘要： This invention is to appropriately separate a bonded substrate stack regardless of some distortion in the bonded substrate stack or the like. This separating apparatus includes a first nozzle which forms a jet with a large width and a second nozzle which forms a jet with a small width. When the outer portion of a bonded substrate stack is to be separated, a jet formed by the first nozzle is used. After that, when a portion inside the outer portion is to be separated, a jet formed by the second nozzle is used.

摘要翻译： 本发明是为了适当地分离键合衬底叠层而不管键合衬底叠层等中的某些变形。 这种分离装置包括形成大宽度射流的第一喷嘴和形成小宽度的射流的第二喷嘴。 当键合衬底叠层的外部部分被分离时，使用由第一喷嘴形成的射流。 此后，当外部部分内的部分被分离时，使用由第二喷嘴形成的射流。

公开(公告)号：US06833312B2

公开(公告)日：2004-12-21

申请号：US10152830

申请日：2002-05-23

申请人： Kazutaka Yanagita ,  Mitsuharu Kohda ,  Kiyofumi Sakaguchi ,  Akira Fujimoto

发明人： Kazutaka Yanagita ,  Mitsuharu Kohda ,  Kiyofumi Sakaguchi ,  Akira Fujimoto

IPC分类号： H01L2130

CPC分类号： H01L21/67092 ,  Y10T156/1374 ,  Y10T156/19 ,  Y10T156/1906

摘要： This invention is to support a plate member such as a bonded substrate stack in a horizontal state without coming into contact with one surface of the member and also to efficiently progress separation. Separation is executed while arranging a bonded substrate stack (50) generated by bonding a seed substrate (10) to a handle substrate (20) such that the seed substrate (10) remains on the lower side. At the first stage, the peripheral portion is separated while causing a first substrate support section (101) to chuck and support the central portion of the lower surface of the bonded substrate stack (50). Then, at the second stage, the central portion is separated while causing a second substrate support section (102) to support the lower peripheral portion and side of the bonded substrate stack (50).

摘要翻译： 本发明是在水平状态下支撑诸如键合衬底叠层的板构件，而不与构件的一个表面接触并且还有效地进行分离。 在将通过将种子基板（10）接合到手柄基板（20）而产生的键合衬底叠层（50）使得种子基板（10）保持在下侧的同时进行分离。 在第一阶段，周边部分被分离，同时使第一基板支撑部分（101）夹持并支撑键合衬底叠层（50）的下表面的中心部分。 然后，在第二阶段，分离中心部分，同时使第二基板支撑部分（102）支撑键合衬底叠片（50）的下周边部分和侧面。

公开(公告)号：US06825099B2

公开(公告)日：2004-11-30

申请号：US10178746

申请日：2002-06-25

申请人： Kazutaka Yanagita ,  Mitsuharu Kohda ,  Kiyofumi Sakaguchi ,  Akira Fujimoto

发明人： Kazutaka Yanagita ,  Mitsuharu Kohda ,  Kiyofumi Sakaguchi ,  Akira Fujimoto

IPC分类号： H01L2146

CPC分类号： H01L21/67092 ,  H01L21/76259

摘要： This invention is to appropriately separate a bonded substrate stack regardless of some distortion in the bonded substrate stack or the like. This separating apparatus includes a position adjusting mechanism (140) for adjusting the position of a nozzle (120) which ejects a fluid. A bonded substrate stack (50) is separated while changing the level of the nozzle (120) stepwise by the position adjusting mechanism (140) in accordance with a program which is set in advance on the assumption that the bonded substrate stack (50) has a distortion within a predetermined range.

摘要翻译： 本发明是为了适当地分离键合衬底叠层而不管键合衬底叠层等中的某些变形。 该分离装置包括用于调节喷射流体的喷嘴（120）的位置的位置调节机构（140）。 在键合衬底叠层（50）具有的假设下，根据预先设定的程序，通过位置调整机构（140）逐步改变喷嘴（120）的水平而分离键合衬底叠层（50） 在预定范围内的失真。