公开(公告)号：US20120193784A1

公开(公告)日：2012-08-02

申请号：US13353535

申请日：2012-01-19

申请人： Norihiro Togasaki ,  Mitsuhiro Nakao ,  Yosuke Morita

发明人： Norihiro Togasaki ,  Mitsuhiro Nakao ,  Yosuke Morita

IPC分类号： H01L23/498 ,  H01L21/60

CPC分类号： H01L24/49 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/78 ,  H01L24/85 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45164 ,  H01L2224/45169 ,  H01L2224/45565 ,  H01L2224/45644 ,  H01L2224/45664 ,  H01L2224/45669 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48479 ,  H01L2224/48499 ,  H01L2224/48824 ,  H01L2224/49429 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85051 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2224/85986 ,  H01L2225/06506 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2224/48471 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/00015 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/01046

摘要： Provided is a method for joining a bonding wire, the method including wedge-joining a bonding wire which has a core whose main component is a non-noble metal and a noble metal layer covering the core to a bump formed on an electrode of a semiconductor element via the noble metal layer.

摘要翻译： 提供了一种接合线的方法，该方法包括将具有主成分为非贵金属的芯和覆盖芯的贵金属层的接合线楔形接合到形成在半导体的电极上的凸块 元素通过贵金属层。

公开(公告)号：US08231046B2

公开(公告)日：2012-07-31

申请号：US12564276

申请日：2009-09-22

申请人： Mitsuhiro Nakao ,  Junya Sagara ,  Katsuhiro Ishida ,  Noboru Okane

发明人： Mitsuhiro Nakao ,  Junya Sagara ,  Katsuhiro Ishida ,  Noboru Okane

IPC分类号： B23K20/00 ,  B23K31/12

CPC分类号： B23K20/005 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/851 ,  H01L2224/85148 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2224/48 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00

摘要： A wire bonding method involves bonding a wire in order at a first bonding point and a second bonding point; raising a capillary, through which the wire is inserted, on the second bonding point; cutting the wire by closing a clamper provided above the capillary at a time when the capillary has reached a prescribed height; and measuring a load incurred on the wire at a time of cutting of the wire.

摘要翻译： 引线接合方法包括在第一接合点和第二接合点处按顺序接合线; 在所述第二接合点上升起所述电线插入的毛细管; 通过在毛细管达到规定高度的时候关闭设置在毛细管上方的夹持器来切断线; 并测量在切割线时在线上产生的负载。

公开(公告)号：US08043148B2

公开(公告)日：2011-10-25

申请号：US11989999

申请日：2008-01-16

申请人： Tsuyoshi Eguchi ,  Atsushi Suzuki ,  Tetsuo Tominaga ,  Mitsuhiro Nakao ,  Hajime Izumi ,  Jun Ito ,  Satoshi Kominami

发明人： Tsuyoshi Eguchi ,  Atsushi Suzuki ,  Tetsuo Tominaga ,  Mitsuhiro Nakao ,  Hajime Izumi ,  Jun Ito ,  Satoshi Kominami

IPC分类号： F24F13/14 ,  F24F13/10 ,  F24F13/04

CPC分类号： B60H1/00671 ,  B60H2001/006 ,  B60H2001/00714 ,  F24F13/1406

摘要： A damper is provided to suppress the abnormal noise or air noise at the small opening of the damper. The damper includes a wall surface which forms an air flow passage, a stationary portion which extends from the wall surface to the center of a flow passage, and a rotating portion rotatably disposed in the flow passage, having one end in contact with a portion of the stationary portion at a downstream side of an air flow through the flow passage. A curved wall portion as a convex curved surface protruding to the center of the flow passage is formed on a position of the wall surface on which the air flow passing between the one end and the stationary portion impinges.

摘要翻译： 提供阻尼器以抑制阻尼器小开口处的异常噪声或空气噪声。 阻尼器包括形成空气流动通道的壁表面，从壁表面延伸到流动通道的中心的静止部分和可旋转地设置在流动通道中的旋转部分，其一端与一部分 通过流路的空气流的下游侧的静止部分。 在通过一端与静止部之间的空气流碰撞的壁面的位置上形成作为突出于流路中心的凸曲面的弯曲壁部。

公开(公告)号：US07675183B2

公开(公告)日：2010-03-09

申请号：US12081818

申请日：2008-04-22

申请人： Hiroshi Toyoda ,  Mitsuhiro Nakao ,  Masahiko Hasunuma ,  Hisashi Kaneko ,  Atsuko Sakata ,  Toshiaki Komukai

发明人： Hiroshi Toyoda ,  Mitsuhiro Nakao ,  Masahiko Hasunuma ,  Hisashi Kaneko ,  Atsuko Sakata ,  Toshiaki Komukai

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L21/76846 ,  H01L21/76834 ,  H01L21/76849 ,  H01L21/76858 ,  H01L21/76886 ,  H01L21/76888 ,  H01L22/32 ,  H01L23/53233 ,  H01L23/53238 ,  H01L23/53295 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/02166 ,  H01L2224/0392 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05009 ,  H01L2224/05017 ,  H01L2224/05082 ,  H01L2224/05083 ,  H01L2224/05093 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05187 ,  H01L2224/05546 ,  H01L2224/05552 ,  H01L2224/05557 ,  H01L2224/05558 ,  H01L2224/05559 ,  H01L2224/05567 ,  H01L2224/05605 ,  H01L2224/05611 ,  H01L2224/05613 ,  H01L2224/05616 ,  H01L2224/0562 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/13105 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/1312 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/45105 ,  H01L2224/45109 ,  H01L2224/45111 ,  H01L2224/45113 ,  H01L2224/45116 ,  H01L2224/4512 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4807 ,  H01L2224/48453 ,  H01L2224/48463 ,  H01L2224/48505 ,  H01L2224/48611 ,  H01L2224/48616 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48711 ,  H01L2224/48716 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48747 ,  H01L2224/48799 ,  H01L2224/48805 ,  H01L2224/48811 ,  H01L2224/48813 ,  H01L2224/48816 ,  H01L2224/4882 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/85375 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/01327 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/00014 ,  H01L2924/04941 ,  H01L2224/05609 ,  H01L2924/00 ,  H01L2224/48744 ,  H01L2224/48713 ,  H01L2224/48705 ,  H01L2224/4872 ,  H01L2224/48605 ,  H01L2224/48613 ,  H01L2224/4862 ,  H01L2924/00015

摘要： A semiconductor device, which is comprised of a copper wiring layer which is formed above a semiconductor substrate, a pad electrode layer which conducts electrically to the copper wiring layer and has an alloy, which contains copper and a metal whose oxidation tendency is higher than copper, formed to extend to the bottom surface, and an insulating protective film which has an opening extended to the pad electrode layer, is provided.

摘要翻译： 一种半导体器件，其由形成在半导体衬底上的铜布线层构成，该电极层与铜布线层电连接并具有合金，所述焊接电极层含有铜和氧化倾向高于铜的金属 形成为延伸到底表面，并且具有延伸到焊盘电极层的开口的绝缘保护膜。

公开(公告)号：US08105026B2

公开(公告)日：2012-01-31

申请号：US12224442

申请日：2008-05-08

申请人： Tsuyoshi Eguchi ,  Atsushi Suzuki ,  Mitsuhiro Nakao ,  Tetsuo Tominaga

发明人： Tsuyoshi Eguchi ,  Atsushi Suzuki ,  Mitsuhiro Nakao ,  Tetsuo Tominaga

IPC分类号： F04D29/44

CPC分类号： F04D29/663 ,  F04D29/422 ,  F04D29/4226 ,  F05D2250/232

摘要： It is intended to provide a centrifugal blower capable of suppressing the generation of noise including periodic noise that is caused by interference between a tongue and an impeller. The centrifugal blower is provided with an impeller (2) provided with plural blades around a rotating shaft; a casing (3) which houses the impeller (2) and has a suction portion at one end in an axial line direction of the rotating shaft; a spiral flow passage (4) formed around the impeller (2) in the casing (3); and a tongue (6) for suppressing inflow of air from a winding end to a winding origin of the spiral flow passage (4). The centrifugal blower is characterized in that an extension (20) is provided at a tip of the tongue (6) in a reverse rotational direction that is reverse to a rotational direction of the impeller (2) in such a manner that it projects in the reverse rotational direction by a length that varies depending on the position in the axial line direction and that the gap between itself and the impeller (2) in the radial direction of the impeller (2) is kept approximately constant.

摘要翻译： 旨在提供一种能够抑制噪声的产生的离心鼓风机，包括由舌片和叶轮之间的干扰引起的周期性噪声。 离心式鼓风机设置有围绕旋转轴设置有多个叶片的叶轮（2） 壳体（3），其容纳所述叶轮（2），并且在所述旋转轴的轴线方向上的一端具有吸引部; 围绕所述壳体（3）中的所述叶轮（2）形成的螺旋流动通道（4）; 以及用于抑制空气从螺旋流路（4）的卷绕端到卷绕原点的流入的舌部（6）。 离心式鼓风机的特征在于，在与叶轮（2）的旋转方向相反的反向旋转方向上，在舌部（6）的前端设置有延伸部（20） 反转旋转方向取决于轴线方向上的位置而变化的长度，并且其与叶轮（2）在叶轮（2）的径向方向上的间隙保持大致恒定。

公开(公告)号：US20100261303A1

公开(公告)日：2010-10-14

申请号：US12662368

申请日：2010-04-13

申请人： Keisuke Ogata ,  Kenzo Fukuyoshi ,  Tadashi Ishimatsu ,  Mitsuhiro Nakao ,  Satoshi Kitamura

发明人： Keisuke Ogata ,  Kenzo Fukuyoshi ,  Tadashi Ishimatsu ,  Mitsuhiro Nakao ,  Satoshi Kitamura

IPC分类号： H01L31/18

CPC分类号： G02B5/201 ,  G02B3/0018 ,  G02B3/0056 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14685 ,  H04N9/045

摘要： A method of manufacturing a solid state image pickup device including photoelectric conversion elements which are two-dimensionally arranged in a semiconductor substrate, and a color filter having a plurality of color filter patterns differing in color from each other and disposed on a surface of the semiconductor substrate according to the photoelectric conversion elements. The method includes successively subjecting a plurality of filter layers differing in color from each other to a patterning process to form the plurality of color filter patterns. At least one color filter pattern to be formed at first among the plurality of color filter patterns is formed by dry etching, and the rest of the plurality of the color filter pattern is formed by photolithography.

摘要翻译： 一种制造固体摄像装置的方法，该固体摄像装置包括二维排列在半导体衬底中的光电转换元件，以及滤色器，其具有彼此不同颜色的多个滤色器图案，并配置在半导体衬底的表面上 基板根据光电转换元件。 该方法包括将彼此不同颜色的多个滤光层连续地进行图案化处理以形成多个滤色器图案。 通过干蚀刻形成要在多个滤色器图案中形成的至少一个滤色器图案，并且通过光刻形成多个滤色器图案的其余部分。

公开(公告)号：US20090206435A1

公开(公告)日：2009-08-20

申请号：US12385969

申请日：2009-04-24

申请人： Kenzo Fukuyoshi ,  Tadashi Ishimatsu ,  Keisuke Ogata ,  Mitsuhiro Nakao ,  Akiko Ushibori

发明人： Kenzo Fukuyoshi ,  Tadashi Ishimatsu ,  Keisuke Ogata ,  Mitsuhiro Nakao ,  Akiko Ushibori

IPC分类号： H01L31/0232

CPC分类号： H01L27/14601 ,  H01L27/14627 ,  H01L27/14685

摘要： A method of manufacturing a solid state imaging device having photoelectric conversion devices, the method including: 1) forming a plurality of color filters differing in color from each other, 2) forming a transparent resin layer on the color filters, 3) forming an etching control layer on the transparent resin layer, the etching control layer being enabled to be etched at a different etching rate from the etching rate of the transparent resin layer, 4) forming a lens master on the etching control layer by using a heatflowable resin material, 5) transferring a pattern of the lens master to the etching control layer by dry etching to form an intermediate micro lens, and 6) transferring a pattern of the intermediate micro lens to the transparent resin layer by dry etching to form the transfer lenses.

摘要翻译： 一种制造具有光电转换装置的固态成像装置的方法，所述方法包括：1）形成多个不同颜色的滤色器，2）在滤色器上形成透明树脂层，3）形成蚀刻 控制层，能够以与透明树脂层的蚀刻速率不同的蚀刻速率蚀刻蚀刻控制层，4）通过使用可流动的树脂材料在蚀刻控制层上形成透镜主体， 5）通过干蚀刻将透镜主体的图案转印到蚀刻控制层上以形成中间微透镜，以及6）通过干法蚀刻将中间微透镜的图案转印到透明树脂层上以形成转印透镜。

公开(公告)号：US20080237863A1

公开(公告)日：2008-10-02

申请号：US12081818

申请日：2008-04-22

申请人： Hiroshi Toyoda ,  Mitsuhiro Nakao ,  Masahiko Hasunuma ,  Hisashi Kaneko ,  Atsuko Sakata ,  Toshiaki Komukai

发明人： Hiroshi Toyoda ,  Mitsuhiro Nakao ,  Masahiko Hasunuma ,  Hisashi Kaneko ,  Atsuko Sakata ,  Toshiaki Komukai

IPC分类号： H01L23/49

CPC分类号： H01L21/76846 ,  H01L21/76834 ,  H01L21/76849 ,  H01L21/76858 ,  H01L21/76886 ,  H01L21/76888 ,  H01L22/32 ,  H01L23/53233 ,  H01L23/53238 ,  H01L23/53295 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/02166 ,  H01L2224/0392 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05009 ,  H01L2224/05017 ,  H01L2224/05082 ,  H01L2224/05083 ,  H01L2224/05093 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05187 ,  H01L2224/05546 ,  H01L2224/05552 ,  H01L2224/05557 ,  H01L2224/05558 ,  H01L2224/05559 ,  H01L2224/05567 ,  H01L2224/05605 ,  H01L2224/05611 ,  H01L2224/05613 ,  H01L2224/05616 ,  H01L2224/0562 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/13105 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/1312 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/45105 ,  H01L2224/45109 ,  H01L2224/45111 ,  H01L2224/45113 ,  H01L2224/45116 ,  H01L2224/4512 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4807 ,  H01L2224/48453 ,  H01L2224/48463 ,  H01L2224/48505 ,  H01L2224/48611 ,  H01L2224/48616 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48711 ,  H01L2224/48716 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48747 ,  H01L2224/48799 ,  H01L2224/48805 ,  H01L2224/48811 ,  H01L2224/48813 ,  H01L2224/48816 ,  H01L2224/4882 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/85375 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/01327 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/00014 ,  H01L2924/04941 ,  H01L2224/05609 ,  H01L2924/00 ,  H01L2224/48744 ,  H01L2224/48713 ,  H01L2224/48705 ,  H01L2224/4872 ,  H01L2224/48605 ,  H01L2224/48613 ,  H01L2224/4862 ,  H01L2924/00015

摘要： A semiconductor device, which is comprised of a copper wiring layer which is formed above a semiconductor substrate, a pad electrode layer which conducts electrically to the copper wiring layer and has an alloy, which contains copper and a metal whose oxidation tendency is higher than copper, formed to extend to the bottom surface, and an insulating protective film which has an opening extended to the pad electrode layer, is provided.

摘要翻译： 一种半导体器件，其由形成在半导体衬底上的铜布线层构成，该电极层与铜布线层电连接并具有合金，所述焊接电极层含有铜和氧化倾向高于铜的金属 形成为延伸到底表面，并且具有延伸到焊盘电极层的开口的绝缘保护膜。

公开(公告)号：US20080099532A1

公开(公告)日：2008-05-01

申请号：US11867307

申请日：2007-10-04

申请人： Mitsuhiro Nakao ,  Junya Sagara ,  Katsuhiro Ishida ,  Noboru Okane

发明人： Mitsuhiro Nakao ,  Junya Sagara ,  Katsuhiro Ishida ,  Noboru Okane

IPC分类号： B23K1/06 ,  B23K3/00

CPC分类号： B23K20/005 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/851 ,  H01L2224/85148 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2224/48 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00

摘要： A wire bonding apparatus comprising: a capillary configured to have inserted therethrough a wire; a damper provided above the capillary and able to clamp hold the wire; and a load sensor configured to measure load incurred on the wire.

摘要翻译： 一种引线接合装置，包括：毛细管，其被配置为插入其中; 设置在毛细管上方的阻尼器，能够夹紧电线; 以及负载传感器，其被配置为测量在所述电线上产生的负载。

公开(公告)号：US20070298164A1

公开(公告)日：2007-12-27

申请号：US11889070

申请日：2007-08-08

申请人： Keisuke Ogata ,  Kenzo Fukuyoshi ,  Tadashi Ishimatsu ,  Mitsuhiro Nakao ,  Satoshi Kitamura

发明人： Keisuke Ogata ,  Kenzo Fukuyoshi ,  Tadashi Ishimatsu ,  Mitsuhiro Nakao ,  Satoshi Kitamura

IPC分类号： B05D5/06

CPC分类号： G02B5/201 ,  G02B3/0018 ,  G02B3/0056 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14685 ,  H04N9/045

摘要： A method of manufacturing a solid state image pickup device including photoelectric conversion elements which are two-dimensionally arranged in a semiconductor substrate, and a color filter having a plurality of color filter patterns differing in color from each other and disposed on a surface of the semiconductor substrate according to the photoelectric conversion elements. The method including the steps of successively subjecting a plurality of filter layers differing in color from each other to a patterning process to form the plurality of color filter patterns. At least one color filter pattern to be formed at first among the plurality of color filter patterns is formed by means of dry etching, and the rest of the plurality of the color filter pattern is formed by means of photolithography.

摘要翻译： 一种制造固体摄像装置的方法，该固体摄像装置包括二维排列在半导体衬底中的光电转换元件，以及滤色器，其具有彼此不同颜色的多个滤色器图案，并配置在半导体衬底的表面上 基板根据光电转换元件。 该方法包括以下步骤：将彼此不同颜色的多个滤光层连续地进行图案化处理，以形成多个滤色器图案。 通过干法蚀刻形成要在多个滤色器图案中首先形成的至少一个滤色器图案，并且通过光刻法形成多个滤色器图案的其余部分。