公开(公告)号：US06812570B2

公开(公告)日：2004-11-02

申请号：US10184061

申请日：2002-06-28

申请人： Raj N. Master ,  Mohammad Zubair Khan ,  Maria Guardado ,  Charles Anderson

发明人： Raj N. Master ,  Mohammad Zubair Khan ,  Maria Guardado ,  Charles Anderson

IPC分类号： H01L2348

CPC分类号： H01L24/81 ,  H01L23/145 ,  H01L23/49883 ,  H01L2224/13111 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H05K3/3463 ,  Y10T29/49144 ,  Y10T428/24917

摘要： An organic carrier member for mounting a semiconductor device is provided that has a plurality of solder pads containing low amounts of tin and bismuth. Embodiments include a bismaleimide-triazine epoxy laminate having a plurality of solder pads on the surface thereof where the solder pads contain no more than about 20 weight percent tin and has a reflow temperature of no greater than about 270° C.

摘要翻译： 提供一种用于安装半导体器件的有机载体构件，其具有多个含有少量锡和铋的焊盘。 实施方案包括其表面上具有多个焊料垫的双马来酰亚胺 - 三嗪环氧层压板，其中焊盘含有不超过约20重量％的锡并具有不大于约270℃的回流温度。

公开(公告)号：US6103549A

公开(公告)日：2000-08-15

申请号：US40643

申请日：1998-03-17

申请人： Raj N. Master ,  Orion K. Starr ,  Maria Guardado ,  Mohammad Zubair Khan

发明人： Raj N. Master ,  Orion K. Starr ,  Maria Guardado ,  Mohammad Zubair Khan

IPC分类号： H05K3/34 ,  H01L21/56 ,  H01L21/60 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L21/563 ,  H01L24/81 ,  H01L2224/13111 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/351

摘要： A method of assembling a substrate and die in a flip chip configuration using a no clean flux. The no clean fluxes have sufficient chemical activity to activate solder bumps contacting bond pads to form reliable solder joints, sufficient tackiness to hold the substrate and die in alignment with the solder bumps contacting the bond pads, and a viscosity to enable a high volume manufacturing process to be used. The no clean fluxes leave a minimal amount of residue during a reflow process that does not interfere with an underfill operation and does not adversely affect the solder joints. The no clean fluxes that can be used for this application are RM1919 from Alpha Metals, Co. and H208 from Indium Company.

摘要翻译： 使用无清洁焊剂以倒装芯片配置组装衬底和管芯的方法。 不干净的焊剂具有足够的化学活性以激活焊料凸点接触焊盘以形成可靠的焊接接头，足够的粘性以保持衬底和管芯与接触焊盘接触的焊料凸块对齐，并且具有使得能够进行大量制造工艺的粘度 要使用的。 不干净的焊剂在回流过程中留下最少量的残留物，其不会妨碍底部填充操作，并且不会不利地影响焊点。 可用于本应用的无清洁助焊剂来自Alpha Metals，Co.的RM1919和Indium Company的H208。

公开(公告)号：US06857790B2

公开(公告)日：2005-02-22

申请号：US09904163

申请日：2001-07-11

申请人： Edwin Fontecha ,  Mohammad Zubair Khan

发明人： Edwin Fontecha ,  Mohammad Zubair Khan

IPC分类号： G02B6/42 ,  G02B6/40

CPC分类号： G02B6/4248

摘要： An apparatus and method to vertically route and physically pass multiple optical fibers through the walls of a package. One variation is a method to route an optical fiber ribbon through a wall of a package by routing and securing the width of the optical fiber ribbon perpendicularly to a component within the package. Another variation involves a package having an enclosure with an opening through which a group of optical fibers are arrayed in a rectangular cross-section with a width which is longer than a thickness. The package includes a component inside the enclosure, a group of optical fibers routed through the opening to the component where the width of the rectangular cross-section is perpendicularly oriented to the base of the enclosure, and a clamp to secure the width of the rectangular cross-section of the group of optical fibers perpendicularly to the base of the enclosure.

摘要翻译： 一种用于垂直地路由和物理地通过多个光纤通过封装的壁的装置和方法。 一种变型是通过将光纤带的宽度垂直于包装内的部件布置并固定而将光纤带穿过包装壁的方法。 另一变型涉及一种具有开口的外壳，其中一组光纤通过该开口排列成具有比厚度更长的宽度的矩形横截面。 该封装包括在外壳内部的一个部件，一组光纤通过开口被引导到部件，其中矩形横截面的宽度垂直地定向到外壳的底部，以及用于固定矩形的宽度的夹具 垂直于外壳底部的光纤组的横截面。

公开(公告)号：US06671450B2

公开(公告)日：2003-12-30

申请号：US09887367

申请日：2001-06-21

申请人： Mohammad Zubair Khan ,  Maria G. Guardado ,  Rickquel B. Garcia

发明人： Mohammad Zubair Khan ,  Maria G. Guardado ,  Rickquel B. Garcia

IPC分类号： G02B600

CPC分类号： G02B6/4248

摘要： Apparatus and methods to metallize, reinforce, and hermetically seal multiple optical fibers are described herein. A ribbon of optical fibers may be placed into a fixture to expose a mid-span segment for removal of the coatings from the optical fibers by acid etching, laser, etc. A variety of metallic coatings may then be deposited onto the bare segment of the optical fibers. The metallized segment of optical fibers are then deposited with solderable alloy onto a plate for attachment to the plate for reinforcement of the metallized segment. The plate and metallized segment is then fed through a package opening and hermetically sealed to internally connect one or more components inside the package by heating the package to melt additional solder around the opening or gap. Epoxy is then applied over the solder to help protect the solder and additionally seal the package.

公开(公告)号：US6098867A

公开(公告)日：2000-08-08

申请号：US40511

申请日：1998-03-17

申请人： Raj N. Master ,  Maria G. Guardado ,  Mohammad Zubair Khan

发明人： Raj N. Master ,  Maria G. Guardado ,  Mohammad Zubair Khan

IPC分类号： H01L21/60 ,  H01L21/48 ,  B23K1/00 ,  B23K1/20 ,  B23K31/02

CPC分类号： H01L21/4864

摘要： An automated method of applying flux to substrate on which a semiconductor chip is to be assembled in a flip chip configuration by applying a controlled amount of flux to the substrate by a brush that applies the flux to the substrate in a programmed pattern of strokes thereby overcoming the surface tension of the flux/substrate surface. The programmed pattern of brush strokes is determined empirically for the specific combination of substrate and chip that is being assembled and is thus repeatable and operator independent. The empirically determined program also determines the amount of flux that will be applied to the substrate for the specific combination of substrate and chip being assembled. The empirically determined program is applied to a mechanical stage that moves the brush and to a flux reservoir by a CPU.

摘要翻译： 一种自动化方法，其通过将刷子施加受控量的通量施加到衬底上，以编程的行程模式将焊剂施加到衬底上，从而将焊剂施加到以半导体芯片组装的半导体芯片组装的衬底上，从而克服 助焊剂/基材表面的表面张力。 根据经验来确定编程的画笔笔画样式，用于正在组装的衬底和芯片的特定组合，并因此可重复且与操作者无关。 经验确定的程序还确定将被组装的衬底和芯片的特定组合将施加到衬底的通量的量。 经验确定的程序应用于通过CPU移动刷子和通量储存器的机械平台。

公开(公告)号：US06382500B1

公开(公告)日：2002-05-07

申请号：US09642835

申请日：2000-08-22

申请人： Raj N. Master ,  Mohammad Zubair Khan ,  Maria Guardado ,  Sp Lee ,  Sofi Mohd

发明人： Raj N. Master ,  Mohammad Zubair Khan ,  Maria Guardado ,  Sp Lee ,  Sofi Mohd

IPC分类号： B23K100

CPC分类号： B23K1/203 ,  B23K1/0016 ,  B23K1/008 ,  B23K2101/40

摘要： When soldering semiconductor devices in a solder reflow furnace flux is vaporized and carried to the furnace exhaust pipe. The flux condenses on the walls of the exhaust pipe and drips back into the furnace contaminating production parts. A solder reflow furnace with a flux effluent collector prevents flux drip-back. The flux effluent collector has an exhaust gas heater that maintains flux effluent in a gaseous state, a flux cooler, to subsequently condense flux, and a flux condensation region where the flux condenses. The flux condensation region is offset from the furnace's exhaust opening so that condensed flux cannot drip back into the furnace.

摘要翻译： 当在焊料回流炉中焊接半导体器件时，助熔剂被蒸发并运送到炉排气管。 助焊剂在排气管的壁上冷凝并滴入炉中，污染生产部件。 具有助焊剂流出物收集器的焊料回流炉防止焊剂滴落。 助焊剂流出物收集器具有一个废气加热器，其保持处于气态的助熔剂流出物，助熔剂冷却器，随后冷凝助熔剂，以及通量冷凝的助熔剂冷凝区域。 助熔剂冷凝区域与炉的排气口偏离，使得冷凝的通量不能滴入炉中。