公开(公告)号：US07423334B2

公开(公告)日：2008-09-09

申请号：US11283596

申请日：2005-11-17

申请人： Hsiu Wen Tu ,  Chen Pin Peng ,  Mon Nan Ho ,  Chung Hsien Hsin

发明人： Hsiu Wen Tu ,  Chen Pin Peng ,  Mon Nan Ho ,  Chung Hsien Hsin

IPC分类号： H01L23/02 ,  H01L29/22

CPC分类号： H01L27/14625 ,  H01L23/10 ,  H01L23/3157 ,  H01L27/14618 ,  H01L27/14685 ,  H01L2924/0002 ,  H01L2924/00

摘要： An image sensor module with a protection layer and a method for manufacturing the same includes a substrate with an upper surface and a lower surface, a chip is mounted on the upper surface of the substrate, a plurality of wires are electrically connected the bonding pads of the chip to the first electrodes of the substrate, a adhered layer is coated on the upper surface of the substrate, a lens holder has a lateral wall, a protection layer and internal thread, the lateral wall is adhered on the upper surface of the substrate by the adhered layer to encapsulate the chip, so that the protection layer is located on adjacent the sensor region of the chip to prevent adhered layer flowed to the sensor region of the chip; and a lens barrel is formed with external thread screwed on the internal thread of the lens holder.

摘要翻译： 具有保护层的图像传感器模块及其制造方法包括具有上表面和下表面的基板，芯片安装在基板的上表面上，多条导线电连接到 芯片到基板的第一电极，粘合层涂覆在基板的上表面上，透镜保持器具有侧壁，保护层和内螺纹，侧壁粘附在基板的上表面上 通过粘附层封装芯片，使得保护层位于与芯片的传感器区域相邻的位置，以防止粘附层流到芯片的传感器区域; 并且透镜筒形成有拧在透镜架的内螺纹上的外螺纹。

公开(公告)号：US06627983B2

公开(公告)日：2003-09-30

申请号：US09770083

申请日：2001-01-24

申请人： Hsiu Wen Tu ,  Wen Chuan Chen ,  Mon Nan Ho ,  Li Huan Chen ,  Nai Hua Yeh ,  Yen Cheng Huang ,  Yung Sheng Chiu ,  Jichen Wu ,  Joe Liu ,  Wu Hsiang Lee

发明人： Hsiu Wen Tu ,  Wen Chuan Chen ,  Mon Nan Ho ,  Li Huan Chen ,  Nai Hua Yeh ,  Yen Cheng Huang ,  Yung Sheng Chiu ,  Jichen Wu ,  Joe Liu ,  Wu Hsiang Lee

IPC分类号： H01L2302

CPC分类号： H01L27/14618 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/00014

摘要： A stacked package structure of an image sensor for electrically connecting to a printed circuit board includes a first substrate, a second substrate, an integrated circuit, an image sensing chip, and a transparent layer. The second substrate is mounted on the first substrate so as to a cavity formed between the first substrate and second substrate. The integrated circuit is located within the cavity and electrically connected the first substrate. The image-sensing chip is arranged on the second substrate. The transparent layer covers over the image sensing chip, wherein the image sensing chip receives image signals via the transparent layer and transforms the image signals into electrical signals transmitted to the first substrate. Thus, the image sensing chip of the image sensing product and the integrated circuit can be integrally package.

公开(公告)号：US08847146B2

公开(公告)日：2014-09-30

申请号：US12579493

申请日：2009-10-15

申请人： Hsiu-Wen Tu ,  Ren-Long Kuo ,  Young-Houng Shiao ,  Tsao-Pin Chen ,  Mon-Nan Ho ,  Chih-Cheng Hsu ,  Chin-Fu Lin ,  Chung-Hsien Hsin

发明人： Hsiu-Wen Tu ,  Ren-Long Kuo ,  Young-Houng Shiao ,  Tsao-Pin Chen ,  Mon-Nan Ho ,  Chih-Cheng Hsu ,  Chin-Fu Lin ,  Chung-Hsien Hsin

IPC分类号： H01J5/02 ,  H01L31/0203 ,  H01L27/146 ,  H01L23/10 ,  H01L23/04

CPC分类号： H01L27/14618 ,  H01L23/04 ,  H01L23/10 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00

摘要： The present invention discloses an image sensor package structure. The image sensor package structure includes a substrate, a chip, a transparent lid, a first casing and a package material. The transparent lid covers a sensitization area of the chip and it also adheres to the chip which is deposed on the substrate. The first casing, which adheres to the transparent lid, forms an opening so that light can pass through the opening and the transparent lid to enter into the sensitization area. The package material covers around the chip and the transparent lid and fills between the substrate and the first casing. Because of the arrangement of adhesive layers placed between the first casing and the transparent lid and between the transparent lid and the chip, the blockage area from moisture is elongated. Therefore, the reliability of the image sensor package structure can be enhanced.

摘要翻译： 本发明公开了一种图像传感器封装结构。 图像传感器封装结构包括基板，芯片，透明盖，第一壳体和封装材料。 透明盖子覆盖了芯片的敏化区域，并且还粘附在衬底上的芯片上。 附着在透明盖上的第一壳体形成开口，使得光线可以穿过开口和透明盖子进入致敏区域。 封装材料围绕芯片和透明盖子覆盖并填充在基板和第一壳体之间。 由于布置在第一壳体和透明盖之间以及透明盖和芯片之间的粘合剂层的布置，所以来自湿气的阻塞区域被拉长。 因此，可以提高图像传感器封装结构的可靠性。

公开(公告)号：US07554599B2

公开(公告)日：2009-06-30

申请号：US11367867

申请日：2006-03-02

申请人： Hsiu wen Tu ,  Mon nan Ho ,  Jason Chuang ,  Chen pin Peng ,  Chung hsien Hsin ,  Wei Chang

发明人： Hsiu wen Tu ,  Mon nan Ho ,  Jason Chuang ,  Chen pin Peng ,  Chung hsien Hsin ,  Wei Chang

IPC分类号： H04N5/225

CPC分类号： H04N5/2251

摘要： An image sensor module with air escape hole includes a substrate having an upper surface and a lower surface. A chip is mounted on the upper surface of the substrate. A plurality of wires are electrically connected the chip to the upper surface of the substrate. An adhered layer is coated on the upper surface of the substrate. A lens holder is mounted on the upper surface of the substrate by the adhered glue, and formed with a top wall, a lateral wall, and an internal thread, wherein the top wall is formed with an air escape hole. A lens barrel is formed with an external thread screwed on the internal thread of the lens holder. And a filled glue is filled within the air escape hole of the lens holder.

摘要翻译： 具有排气孔的图像传感器模块包括具有上表面和下表面的基板。 芯片安装在基板的上表面上。 多个导线将芯片电连接到基板的上表面。 在基材的上表面上涂布粘附层。 透镜支架通过粘合胶安装在基板的上表面上，并形成有顶壁，侧壁和内螺纹，其中顶壁形成有排气孔。 镜筒形成有螺纹拧在透镜架的内螺纹上的外螺纹。 并且在透镜保持器的空气逸出孔内填充填充的胶水。

公开(公告)号：US06521881B2

公开(公告)日：2003-02-18

申请号：US09836160

申请日：2001-04-16

申请人： Hsiu Wen Tu ,  Wen Chuan Chen ,  Mon Nan Ho ,  Li Huan Chen ,  Jichen Wu ,  Meng Ru Tsai

发明人： Hsiu Wen Tu ,  Wen Chuan Chen ,  Mon Nan Ho ,  Li Huan Chen ,  Jichen Wu ,  Meng Ru Tsai

IPC分类号： H01L2700

CPC分类号： H01L27/14618 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/00014

摘要： A stacked structure of an image sensor includes a substrate, an integrated circuit, a package layer, an image sensing chip, and a transparent layer. The integrated circuit is formed on the substrate and electrically connected to the substrate. The package layer covers the integrated circuit. The image sensing chip is placed on the package layer to form the stacked structure with the integrated circuit and is electrically connected to the substrate. The transparent layer is arranged above the image sensing chip for the image sensing chip to receive image signals via the transparent layer. According to this structure, the image sensing chip and the integrated circuit can be integrally stacked easily.

摘要翻译： 图像传感器的堆叠结构包括基板，集成电路，封装层，图像感测芯片和透明层。 集成电路形成在基板上并电连接到基板。 封装层覆盖集成电路。 将图像感测芯片放置在封装层上，以形成具有集成电路的堆叠结构，并与基板电连接。 透明层设置在用于图像感测芯片的图像感测芯片上方以经由透明层接收图像信号。 根据该结构，可以容易地整合图像感测芯片和集成电路。

公开(公告)号：US06489572B2

公开(公告)日：2002-12-03

申请号：US09768981

申请日：2001-01-23

申请人： Mon Nan Ho ,  Chih-Hong Chen ,  Yen Cheng Huang ,  Li Huan Chen ,  Kuo Feng Peng ,  Jichen Wu ,  Allis Chen ,  Wen Chuan Chen

发明人： Mon Nan Ho ,  Chih-Hong Chen ,  Yen Cheng Huang ,  Li Huan Chen ,  Kuo Feng Peng ,  Jichen Wu ,  Allis Chen ,  Wen Chuan Chen

IPC分类号： H05K103

CPC分类号： H01L23/49861 ,  H01L2224/48091 ,  H01L2224/48465 ,  Y10T29/49128 ,  Y10T29/49158 ,  Y10T29/4916 ,  Y10T156/109 ,  H01L2924/00014 ,  H01L2924/00

摘要： A substrate structure for an integrated circuit package. The substrate is electrically connected to a circuit board and an integrated circuit. The substrate includes a plurality of metal sheets and glue. The metal sheets are arranged opposite to each other. Each of the metal sheets includes a first surface and a second surface. The glue is used for sealing the plurality of metal sheet to form the substrate. The first surfaces and second surfaces of the metal sheets are exposed to the outside of the glue so as to form a plurality of signal input terminals for electrically connecting to the integrated circuit and a plurality of signal output terminals for electrically connecting to the circuit board. Thus, the signal output terminals of the metal sheets can be electrically connected to the circuit board smoothly. Furthermore, the signal transmission distance between the integrated circuit and the circuit board can be shortened so that better signal transmission effect can be obtained. A method for manufacturing the substrate is also disclosed.

摘要翻译： 一种用于集成电路封装的衬底结构。 基板电连接到电路板和集成电路。 基板包括多个金属片和胶。 金属板彼此相对布置。 每个金属片包括第一表面和第二表面。 胶被用于密封多个金属片以形成基底。 金属板的第一表面和第二表面暴露于胶的外部，以形成用于电连接到集成电路的多个信号输入端子和用于电连接到电路板的多个信号输出端子。 因此，金属片的信号输出端子可以平滑地电连接到电路板。 此外，可以缩短集成电路和电路板之间的信号传输距离，从而可以获得更好的信号传输效果。 还公开了一种用于制造衬底的方法。

公开(公告)号：US20070206109A1

公开(公告)日：2007-09-06

申请号：US11367867

申请日：2006-03-02

申请人： Hsiu wen Tu ,  Mon nan Ho ,  Jason Chuang ,  Chen pin Peng ,  Chung hsien Hsin ,  Wei Chang

发明人： Hsiu wen Tu ,  Mon nan Ho ,  Jason Chuang ,  Chen pin Peng ,  Chung hsien Hsin ,  Wei Chang

IPC分类号： H04N5/225

CPC分类号： H04N5/2251

摘要： An image sensor module with air escape hole includes a substrate having an upper surface and a lower surface. A chip is mounted on the upper surface of the substrate. A plurality of wires are electrically connected the chip to the upper surface of the substrate. An adhered layer is coated on the upper surface of the substrate. A lens holder is mounted on the upper surface of the substrate by the adhered glue, and formed with a top wall, a lateral wall, and an internal thread, wherein the top wall is formed with an air escape hole. A lens barrel is formed with an external thread screwed on the internal thread of the lens holder. And a filled glue is filled within the air escape hole of the lens holder.

摘要翻译： 具有排气孔的图像传感器模块包括具有上表面和下表面的基板。 芯片安装在基板的上表面上。 多个导线将芯片电连接到基板的上表面。 在基材的上表面上涂布粘附层。 透镜支架通过粘合胶安装在基板的上表面上，并形成有顶壁，侧壁和内螺纹，其中顶壁形成有排气孔。 镜筒形成有螺纹拧在透镜架的内螺纹上的外螺纹。 并且在透镜保持器的空气逸出孔内填充填充的胶水。

公开(公告)号：US06590269B1

公开(公告)日：2003-07-08

申请号：US10114201

申请日：2002-04-01

申请人： Jason Chuang ,  Allis Chen ,  Jachson Hsieh ,  Hsiu Wen Tu ,  Meng Ru Tsai ,  Mon Nan Ho ,  Fu Yung Huang ,  Yung Sheng Chiu ,  Jichen Wu ,  Chih Cheng Hsu

发明人： Jason Chuang ,  Allis Chen ,  Jachson Hsieh ,  Hsiu Wen Tu ,  Meng Ru Tsai ,  Mon Nan Ho ,  Fu Yung Huang ,  Yung Sheng Chiu ,  Jichen Wu ,  Chih Cheng Hsu

IPC分类号： H01L310203

CPC分类号： H01L31/0203 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

摘要： A package structure for a photosensitive chip includes a substrate having an upper surface and a lower surface, and a frame layer having a first surface and a second surface. The frame layer is formed on the substrate by way of injection molding with the first surface contacting the upper surface. A cavity is formed between the substrate and the frame layer. The second surface is formed with a depression in which plural projections each having a suitable height are formed. The frame layer is formed directly on the substrate by way of injection molding. The package structure further includes a photosensitive chip arranged within the cavity, a plurality of wires for connecting the substrate to the photosensitive chip, and a transparent layer rested on the projections within the depression. Accordingly, the yield can be improved and the manufacturing processes can be facilitated.

摘要翻译： 用于感光芯片的封装结构包括具有上表面和下表面的基片和具有第一表面和第二表面的框架层。 框架层通过注射成型形成在基板上，第一表面接触上表面。 在基板和框架层之间形成空腔。 第二表面形成有凹部，其中形成有具有适当高度的多个凸起。 框架层通过注射成型直接形成在基板上。 封装结构还包括布置在空腔内的感光芯片，用于将基板连接到感光芯片的多根导线以及搁置在凹陷内的凸起上的透明层。 因此，可以提高收率并且可以促进制造过程。

公开(公告)号：US06565008B2

公开(公告)日：2003-05-20

申请号：US10018072

申请日：2001-12-04

申请人： Mon Nan Ho ,  Hsiu Wen Tu ,  Kuo Feng Feng ,  Yung Sheng Chiu ,  Joe Liu ,  Nai Hua Yeh ,  Wen Chuan Chen ,  Allis Chen

发明人： Mon Nan Ho ,  Hsiu Wen Tu ,  Kuo Feng Feng ,  Yung Sheng Chiu ,  Joe Liu ,  Nai Hua Yeh ,  Wen Chuan Chen ,  Allis Chen

IPC分类号： G06K1906

CPC分类号： H01L23/49855 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A manufacturing method of a module card comprises steps of: providing a base board having a golden finger; mounting a chip on the base board for electrically connecting to the golden finger; and forming a packing layer on the chip for forming the module card. A module card comprises: a base board; a chip mounting on a surface of the base board; a golden finger on the board and electrically connecting to the chip; and a packing layer forming on the chip for covering the chip.

摘要翻译： 模块卡的制造方法包括以下步骤：提供具有金手指的基板; 在基板上安装芯片以电连接到金手指; 以及在芯片上形成用于形成模块卡的填充层。 模块卡包括：基板; 芯片安装在基板的表面上; 一个金手指在电路板上并与芯片电连接; 以及形成在芯片上用于覆盖芯片的填充层。

公开(公告)号：US06559539B2

公开(公告)日：2003-05-06

申请号：US09770084

申请日：2001-01-24

申请人： Hsiu Wen Tu ,  Wen Chuan Chen ,  Mon Nan Ho ,  Li Huan Chen ,  Nai Hua Yeh ,  Yen Cheng Huang ,  Yung Sheng Chiu ,  Jichen Wu

发明人： Hsiu Wen Tu ,  Wen Chuan Chen ,  Mon Nan Ho ,  Li Huan Chen ,  Nai Hua Yeh ,  Yen Cheng Huang ,  Yung Sheng Chiu ,  Jichen Wu

IPC分类号： H01L2334

CPC分类号： H01L25/0657 ,  H01L31/0203 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/16195 ,  H01L2924/1627 ,  H01L2924/00 ,  H01L2224/0401

摘要： A stacked package structure of an image sensor used for electrically connecting to a printed circuit board includes a substrate, an image sensing chip, an integrated circuit, and a transparent layer. The substrate has a first surface and a second surface. The first surface is formed with signal input terminals. The second surface is formed with signal input terminals and signal output terminals for electrically connecting to the printed circuit board. The image sensing chip is mounted on the first surface of the substrate and is electrically to the signal input terminals of the substrate. The integrated circuit is arranged on the second surface of the substrate and is electrically connected to the signal input terminals of the substrate. The transparent layer covers over the image sensing chip, which can receive the image signals via the transparent layer and convert the image signals into electrical signals that are to be transmitted to the substrate. Thus, the image sensing chip of the image sensing product and integrated circuit can be integrally packaged.

摘要翻译： 用于电连接到印刷电路板的图像传感器的堆叠封装结构包括基板，图像感测芯片，集成电路和透明层。 基板具有第一表面和第二表面。 第一表面由信号输入端子形成。 第二表面形成有用于电连接到印刷电路板的信号输入端子和信号输出端子。 图像感测芯片安装在基板的第一表面上并且电连接到基板的信号输入端子。 集成电路布置在基板的第二表面上并且电连接到基板的信号输入端子。 透明层覆盖图像感测芯片，其可以经由透明层接收图像信号，并将图像信号转换成要传输到基板的电信号。 因此，图像感测产品和集成电路的图像感测芯片可以被整体封装。