公开(公告)号：US08204295B2

公开(公告)日：2012-06-19

申请号：US12475354

申请日：2009-05-29

申请人： Moshe E. Preil ,  Alex N. Hegyi ,  Daniel S. Abrams

发明人： Moshe E. Preil ,  Alex N. Hegyi ,  Daniel S. Abrams

IPC分类号： G06K9/36

CPC分类号： G06T7/001 ,  G03F1/84 ,  G06T2207/30148

摘要： A system receives a mask pattern and a first image of at least a portion of a photo-mask corresponding to the mask pattern. The system determines a second image of at least the portion of the photo-mask based on the first image and the mask pattern. This second image is characterized by additional spatial frequencies than the first image.

摘要翻译： 系统接收掩模图案和对应于掩模图案的光掩模的至少一部分的第一图像。 该系统基于第一图像和掩模图案来确定光掩模的至少一部分的第二图像。 该第二图像的特征在于比第一图像更多的空间频率。

公开(公告)号：US07769225B2

公开(公告)日：2010-08-03

申请号：US11314813

申请日：2005-12-20

申请人： Sagar A. Kekare ,  Ingrid B. Peterson ,  Moshe E. Preil

发明人： Sagar A. Kekare ,  Ingrid B. Peterson ,  Moshe E. Preil

IPC分类号： G06K9/00 ,  G01N21/00 ,  G01B5/28

CPC分类号： G01N21/95607 ,  G03F1/84

摘要： Computer-implemented methods and systems for detecting defects in a reticle design pattern are provided. One computer-implemented method includes acquiring images of a field in the reticle design pattern. The images illustrate how the field will be printed on a wafer at different values of one or more parameters of a wafer printing process. The field includes a first die and a second die. The method also includes detecting defects in the field based on a comparison of two or more of the images corresponding to two or more of the different values. In addition, the method includes determining if individual defects located in the first die have substantially the same within die position as individual defects located in the second die.

摘要翻译： 提供了用于检测标线设计图案中的缺陷的计算机实现的方法和系统。 一种计算机实现的方法包括获取标线设计图案中的场的图像。 这些图像示出了如何以晶片印刷过程的一个或多个参数的不同值将晶片印刷在晶片上。 该领域包括第一模具和第二模具。 该方法还包括基于对应于两个或多个不同值的两个或更多个图像的比较来检测场中的缺陷。 另外，该方法包括确定位于第一管芯中的各个缺陷是否位于与位于第二管芯内的各个缺陷的管芯位置内基本相同的位置。

公开(公告)号：US20100119143A1

公开(公告)日：2010-05-13

申请号：US12475349

申请日：2009-05-29

申请人： Moshe E. Preil ,  Alex N. Hegyi ,  Daniel S. Abrams

发明人： Moshe E. Preil ,  Alex N. Hegyi ,  Daniel S. Abrams

IPC分类号： G06K9/00

CPC分类号： G06T7/001 ,  G03F1/84 ,  G06T2207/30148

摘要： A system receives a mask pattern and a first image of at least a portion of a photo-mask corresponding to the mask pattern. The system determines a second image of at least the portion of the photo-mask based on the first image and the mask pattern. This second image is characterized by additional spatial frequencies than the first image.

公开(公告)号：US07646906B2

公开(公告)日：2010-01-12

申请号：US11048630

申请日：2005-01-31

申请人： Zain K. Saidin ,  Yalin Xiong ,  Lance Glasser ,  Carl Hess ,  Moshe E. Preil

发明人： Zain K. Saidin ,  Yalin Xiong ,  Lance Glasser ,  Carl Hess ,  Moshe E. Preil

IPC分类号： G06K9/00

CPC分类号： G03F1/84 ,  G03F1/36 ,  G03F7/70433 ,  G03F7/70441 ,  G03F7/705 ,  G03F7/70533 ,  G03F7/70616 ,  G03F7/7065 ,  G03F7/70666 ,  G06Q30/0206

摘要： Computer-implemented methods for detecting defects in reticle design data are provided. One method includes generating a first simulated image illustrating how the reticle design data will be printed on a reticle using a reticle manufacturing process. The method also includes generating second simulated images using the first simulated image. The second simulated images illustrate how the reticle will be printed on a wafer at different values of one or more parameters of a wafer printing process. The method further includes detecting defects in the reticle design data using the second simulated images. Another method includes the generating steps described above in addition to determining a rate of change in a characteristic of the second simulated images as a function of the different values. This method also includes detecting defects in the reticle design data based on the rate of change.

摘要翻译： 提供了用于检测标线设计数据缺陷的计算机实现方法。 一种方法包括生成第一模拟图像，其示出如何使用标线制造工艺将掩模版设计数据印刷在掩模版上。 该方法还包括使用第一模拟图像生成第二模拟图像。 第二模拟图像示出了在晶片印刷过程的一个或多个参数的不同值下如何将掩模版印刷在晶片上。 该方法还包括使用第二模拟图像检测掩模版设计数据中的缺陷。 除了确定作为不同值的函数的第二模拟图像的特性的变化率之外，另一种方法包括上述生成步骤。 该方法还包括基于变化率检测掩模版设计数据中的缺陷。

公开(公告)号：US20120189187A9

公开(公告)日：2012-07-26

申请号：US12475338

申请日：2009-05-29

申请人： Moshe E. Preil ,  Alex N. Hegyi ,  Daniel S. Abrams

发明人： Moshe E. Preil ,  Alex N. Hegyi ,  Daniel S. Abrams

IPC分类号： G06T7/00

CPC分类号： G06T7/001 ,  G03F1/84 ,  G06T2207/30148

摘要： A system receives a mask pattern and a first image of at least a portion of a photo-mask corresponding to the mask pattern. The system determines a second image of at least the portion of the photo-mask based on the first image and the mask pattern. This second image is characterized by additional spatial frequencies than the first image.

摘要翻译： 系统接收掩模图案和对应于掩模图案的光掩模的至少一部分的第一图像。 该系统基于第一图像和掩模图案来确定光掩模的至少一部分的第二图像。 该第二图像的特征在于比第一图像更多的空间频率。

公开(公告)号：US20120021343A1

公开(公告)日：2012-01-26

申请号：US13244218

申请日：2011-09-23

申请人： Jun Ye ,  Moshe E. Preil ,  Xun Chen ,  Shauh-Teh Juang ,  James Wiley

发明人： Jun Ye ,  Moshe E. Preil ,  Xun Chen ,  Shauh-Teh Juang ,  James Wiley

IPC分类号： G03F1/00

CPC分类号： G03F7/70641 ,  G03F1/44 ,  G03F7/705 ,  G03F7/70625

摘要： A method for identifying process window signature patterns in a device area of a mask is disclosed. The signature patterns collectively provide a unique response to changes in a set of process condition parameters to the lithography process. The signature patterns enable monitoring of associated process condition parameters for signs of process drift, analyzing of the process condition parameters to determine which are limiting and affecting the chip yields, analyzing the changes in the process condition parameters to determine the corrections that should be fed back into the lithography process or forwarded to an etch process, identifying specific masks that do not transfer the intended pattern to wafers as intended, and identifying groups of masks that share common characteristics and behave in a similar manner with respect to changes in process condition parameters when transferring the pattern to the wafer.

摘要翻译： 公开了一种用于识别掩模的设备区域中的处理窗口签名图案的方法。 签名图案集合地提供了对一组工艺条件参数对光刻工艺的变化的唯一响应。 签名模式可以监控相关的过程状态参数，以了解过程漂移的迹象，分析过程状态参数，以确定哪些是限制和影响芯片产量，分析过程状态参数的变化以确定应反馈的校正 进入光刻工艺或转发到蚀刻工艺，识别不按照预期将预期图案转印到晶片的特定掩模，以及鉴定相对于工艺条件参数的变化共享共同特性并以类似方式表现的掩模组， 将图案转移到晶片。

公开(公告)号：US07749666B2

公开(公告)日：2010-07-06

申请号：US11462022

申请日：2006-08-02

申请人： Michael J. Gassner ,  Stefan Hunsche ,  Yu Cao ,  Jun Ye ,  Moshe E. Preil

发明人： Michael J. Gassner ,  Stefan Hunsche ,  Yu Cao ,  Jun Ye ,  Moshe E. Preil

IPC分类号： G03C5/00 ,  G01B9/00 ,  G01B9/08 ,  G01B11/00 ,  G01N21/00

CPC分类号： G03F7/70666 ,  G03F7/70641

摘要： A method of using an in-situ aerial image sensor array is disclosed to separate and remove the focal plane variations caused by the image sensor array non-flatness and/or by the exposure tool by collecting sensor image data at various nominal focal planes and by determining best focus at each sampling location by analysis of the through-focus data. In various embodiments, the method provides accurate image data at best focus anywhere in the exposure field, image data covering an exposure-dose based process window area, and a map of effective focal plane distortions. The focus map can be separated into contributions from the exposure tool and contributions due to topography of the image sensor array by suitable calibration or self-calibration procedures. The basic method enables a wide range of applications, including for example qualification testing, process monitoring, and process control by deriving optimum process corrections from analysis of the image sensor data.

摘要翻译： 公开了一种使用原位空间图像传感器阵列的方法，以分离和去除由图像传感器阵列非平坦度引起的焦平面变化和/或通过曝光工具通过在各种标称焦平面处收集传感器图像数据，并且通过 通过分析焦点数据确定每个采样位置的最佳焦点。 在各种实施例中，该方法在曝光区域的任何地方提供最佳焦点上的精确图像数据，覆盖基于曝光剂量的过程窗口区域的图像数据和有效焦平面失真的映射。 焦点图可以通过适当的校准或自校准程序分为曝光工具的贡献和由于图像传感器阵列的形貌造成的贡献。 基本方法可以通过从图像传感器数据分析中得出最佳的过程校正，实现广泛的应用，包括例如鉴定测试，过程监控和过程控制。

公开(公告)号：US20100151364A1

公开(公告)日：2010-06-17

申请号：US12660313

申请日：2010-02-23

申请人： Jun Ye ,  Moshe E. Preil ,  Xun Chen ,  Shauh-Teh Juang ,  James Wiley

发明人： Jun Ye ,  Moshe E. Preil ,  Xun Chen ,  Shauh-Teh Juang ,  James Wiley

IPC分类号： G03F1/00

CPC分类号： G03F7/70641 ,  G03F1/44 ,  G03F7/705 ,  G03F7/70625

摘要： A method for identifying process window signature patterns in a device area of a mask is disclosed. The signature patterns collectively provide a unique response to changes in a set of process condition parameters to the lithography process. The signature patterns enable monitoring of associated process condition parameters for signs of process drift, analyzing of the process condition parameters to determine which are limiting and affecting the chip yields, analyzing the changes in the process condition parameters to determine the corrections that should be fed back into the lithography process or forwarded to an etch process, identifying specific masks that do not transfer the intended pattern to wafers as intended, and identifying groups of masks that share common characteristics and behave in a similar manner with respect to changes in process condition parameters when transferring the pattern to the wafer.

公开(公告)号：US07695876B2

公开(公告)日：2010-04-13

申请号：US11466978

申请日：2006-08-24

申请人： Jun Ye ,  Moshe E. Preil ,  Xun Chen ,  Shauh-Teh Juang ,  James Wiley

发明人： Jun Ye ,  Moshe E. Preil ,  Xun Chen ,  Shauh-Teh Juang ,  James Wiley

IPC分类号： G03F9/00 ,  G03C5/00

CPC分类号： G03F7/70641 ,  G03F1/44 ,  G03F7/705 ,  G03F7/70625

摘要： A method for identifying process window signature patterns in a device area of a mask is disclosed. The signature patterns collectively provide a unique response to changes in a set of process condition parameters to the lithography process. The signature patterns enable monitoring of associated process condition parameters for signs of process drift, analyzing of the process condition parameters to determine which are limiting and affecting the chip yields, analyzing the changes in the process condition parameters to determine the corrections that should be fed back into the lithography process or forwarded to an etch process, identifying specific masks that do not transfer the intended pattern to wafers as intended, and identifying groups of masks that share common characteristics and behave in a similar manner with respect to changes in process condition parameters when transferring the pattern to the wafer.

摘要翻译： 公开了一种用于识别掩模的设备区域中的处理窗口签名图案的方法。 签名图案集合地提供了对一组工艺条件参数对光刻工艺的变化的唯一响应。 签名模式可以监控相关的过程状态参数，以了解过程漂移的迹象，分析过程状态参数，以确定哪些是限制和影响芯片产量，分析过程状态参数的变化以确定应反馈的校正 进入光刻过程或转发到蚀刻工艺，识别不按照预期将预期图案转印到晶片的特定掩模，以及鉴定相对于工艺条件参数的变化共享共同特性并以类似方式表现的掩模组， 将图案转移到晶片。

公开(公告)号：US08318391B2

公开(公告)日：2012-11-27

申请号：US13244218

申请日：2011-09-23

申请人： Jun Ye ,  Moshe E. Preil ,  Xun Chen ,  Shauh-Teh Juang ,  James Wiley

发明人： Jun Ye ,  Moshe E. Preil ,  Xun Chen ,  Shauh-Teh Juang ,  James Wiley

IPC分类号： G03F9/00 ,  G03C5/00

CPC分类号： G03F7/70641 ,  G03F1/44 ,  G03F7/705 ,  G03F7/70625

摘要： A method for identifying process window signature patterns in a device area of a mask is disclosed. The signature patterns collectively provide a unique response to changes in a set of process condition parameters to the lithography process. The signature patterns enable monitoring of associated process condition parameters for signs of process drift, analyzing of the process condition parameters to determine which are limiting and affecting the chip yields, analyzing the changes in the process condition parameters to determine the corrections that should be fed back into the lithography process or forwarded to an etch process, identifying specific masks that do not transfer the intended pattern to wafers as intended, and identifying groups of masks that share common characteristics and behave in a similar manner with respect to changes in process condition parameters when transferring the pattern to the wafer.

摘要翻译： 公开了一种用于识别掩模的设备区域中的处理窗口签名图案的方法。 签名图案集合地提供了对一组工艺条件参数对光刻工艺的变化的唯一响应。 签名模式可以监控相关的过程状态参数，以了解过程漂移的迹象，分析过程状态参数，以确定哪些是限制和影响芯片产量，分析过程状态参数的变化以确定应反馈的校正 进入光刻过程或转发到蚀刻工艺，识别不按照预期将预期图案转印到晶片的特定掩模，以及鉴定相对于工艺条件参数的变化共享共同特性并以类似方式表现的掩模组， 将图案转移到晶片。