POLYAMIDE-LONG GLASS FIBER REINFORCED COMPOSITE MATERIAL AND METHOD FOR PRODUCING THE SAME

    公开(公告)号:US20240317948A1

    公开(公告)日:2024-09-26

    申请号:US18347539

    申请日:2023-07-05

    IPC分类号: C08J5/04 C08K5/092

    摘要: A polyamide-long glass fiber reinforced composite material and a method for producing the same are respectively provided. The composite material includes an impregnating material and a glass fiber material. The impregnating material includes a polyamide resin, a toughener, and a compatibilizer. The toughener is an elastomer composed of a first polyolefin material and modified by maleic anhydride. The compatibilizer is a resin material composed of a second polyolefin material and modified by the maleic anhydride. A first melt flow index of the toughener is less than a second melt flow index of the compatibilizer. The glass fiber material is impregnated and covered by the impregnating material. The glass fiber material includes a long glass fiber, and a surface of the long glass fiber is modified by at least one of a hydroxyl group and a carboxyl group.

    MANUFACTURING METHOD OF COMPOSITE COPPER FOIL

    公开(公告)号:US20240216947A1

    公开(公告)日:2024-07-04

    申请号:US18184695

    申请日:2023-03-16

    IPC分类号: B05D1/38 B05D5/12 B05D7/14

    摘要: A manufacturing method of composite copper foil includes the following steps: providing a copper foil, wherein the copper foil has a first surface and a second surface opposite to each other; performing a surface treatment with a surface treatment solution to form a first surface treatment layer on the first surface of the copper foil; and forming a first lithium metal layer on the first surface treatment layer. Another manufacturing method of composite copper foil includes the following steps: providing a copper foil, wherein the copper foil has a first surface and a second surface opposite to each other; preparing a conductive material; adding a filling material, an adhesive material and a solvent to the conductive material to form a slurry; coating the slurry on the first surface of the copper foil to form a first conductive layer.

    UV RELEASE TAPE
    8.
    发明公开
    UV RELEASE TAPE 审中-公开

    公开(公告)号:US20240191102A1

    公开(公告)日:2024-06-13

    申请号:US18169847

    申请日:2023-02-15

    IPC分类号: C09J7/20 C09J7/24 C09J133/08

    摘要: A UV release tape includes a substrate layer, a UV release layer, and a separation layer. The UV release layer is disposed between the substrate layer and the separation layer. A material of the substrate layer includes a polyvinyl chloride, a plasticizer, and a metal salt compound. Relative to 100 phr of the polyvinyl chloride, an amount of the metal salt compound ranges from 1 phr to 8 phr. The metal salt compound includes a calcium salt compound and a zinc salt compound. A peeling strength of the UV release layer toward a silicon wafer is higher than 10 N/in. After being exposed to UV light, the peeling strength of the UV release layer toward the silicon wafer is lower than 0.3 N/in.

    MODIFIED DICYCLOPENTADIENE-BASED RESIN
    9.
    发明公开

    公开(公告)号:US20240166788A1

    公开(公告)日:2024-05-23

    申请号:US18178547

    申请日:2023-03-06

    IPC分类号: C08F232/08

    CPC分类号: C08F232/08

    摘要: A modified dicyclopentadiene-based resin is provided. The modified dicyclopentadiene-based resin is formed from a dicyclopentadiene-based resin having an amino group, a phenol and a polyoxymethylene by a cyclization reaction. The dicyclopentadiene-based resin having an amino group is formed by nitration reaction and hydrogenation reaction of dicyclopentadiene phenolic resin.