Method for manufacturing holding device and holding device

    公开(公告)号:US12027406B2

    公开(公告)日:2024-07-02

    申请号:US17052634

    申请日:2019-01-08

    摘要: A holding device manufacturing method includes a step of preparing a first joined body which includes a pre-machining ceramic member having a first surface and a fifth surface located opposite the first surface and approximately parallel to the first surface, a base member, and a joining portion disposed between the first surface of the pre-machining ceramic member and a third surface of the base member and joining the pre-machining ceramic member and the base member together. The thickness of the joining portion of the first joined body in a first direction, in which the first surface and the third surface face each other via the joining portion, increases from one end side toward the other end side of the joining portion in a second direction perpendicular to the first direction. The method includes a step of machining the fifth surface of the pre-machining ceramic member in the first joined body.

    Electrode-embedded member and method for manufacturing same, electrostatic chuck, and ceramic heater

    公开(公告)号:US11869796B2

    公开(公告)日:2024-01-09

    申请号:US17416127

    申请日:2020-03-19

    发明人: Masaki Yabuhana

    摘要: An electrode-embedded member 1 includes a ceramic-made substrate 2, an electrode 3, a connection member 4 containing at least one of tungsten and molybdenum and embedded in the substrate 2 in a state in which a first principal surface 4a faces the electrode 3 and is electrically connected to the electrode 3, and a hole portion 5 extending from an outer surface of the substrate 2 to a second principal surface 4b of the connection member 4. A buffer member 10 embedded in the substrate 2 contains at least a ceramic material forming the substrate 2 and a conductive material containing at least one of tungsten and molybdenum as a constituent element. The buffer member 10 covers at least part of an edge of the connection member 4.

    Light-emitting apparatus and light-emitting element housing

    公开(公告)号:US11824325B2

    公开(公告)日:2023-11-21

    申请号:US17463714

    申请日:2021-09-01

    发明人: Shingo Totani

    IPC分类号: H01S5/06 H01S5/0225 H01S5/00

    摘要: A multilayer wiring substrate includes a first wiring substrate including a plurality of stacked layers made of a thermo setting resin and having a wiring layer formed between each adjacent layer of the layers in a state in contact with the adjacent layers, a second wiring substrate made of a ceramic, and a joining layer disposed between a back surface of the first wiring substrate and a front surface of the second wiring substrate and configured to join the first wiring substrate and the second wiring substrate to each other, wherein at least a surface of the joining layer adjacent to the second wiring substrate is made of a thermo plastic resin.

    Sensor and method for manufacturing same

    公开(公告)号:US11768168B2

    公开(公告)日:2023-09-26

    申请号:US16986483

    申请日:2020-08-06

    摘要: A sensor (1) comprising: a sensor element (10); metal terminals; and a front side separator (90) and a rear side separator (95) to hold the metal terminals, the metal terminals each include a front side metal terminal (30) and a rear side metal terminal (40) respectively held by the front side separator and the rear side separator, a first connection portion (33) is provided on a rear side of the front side metal terminal, a second connection portion (43) is provided on a front side of the rear side metal terminal, and an axis P2 of one of the first and the second connection portion, in all of the plurality of metal terminals, is displaced toward a radially outer side of the sensor element relative to an axis P1 of a counterpart thereof, and the first connection portion and the second connection portion are in contact with each other.