公开(公告)号：US07880091B2

公开(公告)日：2011-02-01

申请号：US11645948

申请日：2006-12-27

申请人： Nobuaki Miyamoto ,  Akira Chinda ,  Koki Hirasawa ,  Kenji Uchida

发明人： Nobuaki Miyamoto ,  Akira Chinda ,  Koki Hirasawa ,  Kenji Uchida

IPC分类号： H05K1/03

CPC分类号： H01L21/4832 ,  H01L21/568 ,  H01L23/3121 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2221/68345 ,  H01L2224/05553 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48664 ,  H01L2224/49171 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/0023 ,  H05K3/007 ,  H05K3/06 ,  H05K3/243 ,  H05K3/284 ,  H05K2203/0156 ,  H05K2203/0571 ,  H05K2203/1469 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An electronic device substrate having: a base material formed of a thin board; an electrical insulation layer formed on the base material and having plural openings in a thickness direction thereof; and a metal plating layer filled in the plural openings. The base material has a metal layer, a release layer formed contacting the metal layer, and a metal film formed contacting the release layer.

摘要翻译： 一种电子器件基板，具有：由薄板形成的基材; 电绝缘层，形成在基材上，在其厚度方向上具有多个开口; 以及填充在所述多个开口中的金属镀层。 基材具有金属层，与金属层接触形成的剥离层和与剥离层接触形成的金属膜。

公开(公告)号：US20080201943A1

公开(公告)日：2008-08-28

申请号：US12081538

申请日：2008-04-17

申请人： Akira Chinda ,  Nobuaki Miyamoto ,  Koki Hirasawa ,  Kenji Uchida ,  Mamoru Mita

发明人： Akira Chinda ,  Nobuaki Miyamoto ,  Koki Hirasawa ,  Kenji Uchida ,  Mamoru Mita

IPC分类号： H05K3/30 ,  H05K3/00

CPC分类号： H01L21/486 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3121 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2221/68345 ,  H01L2224/05554 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/85001 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： An electronic device substrate is provided with a thin-plate core substrate; a metal electrode provided on the core substrate and electrically connected to an electrode of an electronic component to be packaged thereon; and an electrical insulation layer on which is mounted the electronic component, and which is provided to surround the metal electrode.

摘要翻译： 电子器件基板设置有薄板芯基板; 金属电极，其设置在所述芯基板上并电连接到要封装在其上的电子部件的电极; 以及电绝缘层，电绝缘层上安装有电子部件，并且设置成围绕金属电极。

公开(公告)号：US20070235218A1

公开(公告)日：2007-10-11

申请号：US11530344

申请日：2006-09-08

申请人： Nobuaki Miyamoto ,  Akira Chinda ,  Koki Hirasawa ,  Kenji Uchida

发明人： Nobuaki Miyamoto ,  Akira Chinda ,  Koki Hirasawa ,  Kenji Uchida

IPC分类号： H05K1/11 ,  H01R12/04

CPC分类号： H05K1/113 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/32 ,  H01L24/81 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/83385 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H05K3/0023 ,  H05K3/007 ,  H05K3/025 ,  H05K3/064 ,  H05K3/244 ,  H05K3/386 ,  H05K3/421 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2203/0156 ,  H05K2203/0733 ,  H01L2924/00012 ,  H01L2924/00

摘要： An electronic device substrate is formed of a thin-plate reinforcing substrate; an external connection wiring layer stacked on the reinforcing substrate, and comprising an electrical insulation provided on the reinforcing substrate, an opening formed in the electrical insulation, a first conductor pattern and a via-hole conductor provided in the opening and formed integrally with each other; and a second conductor pattern formed on the opposite side of the electrical insulation to the reinforcing substrate, and at least partially electrically connected to the via-hole conductor.

摘要翻译： 电子器件基板由薄板加强基板形成; 叠层在所述加强基板上的外部连接布线层，并且包括设置在所述加强基板上的电绝缘体，形成在所述电绝缘体中的开口，设置在所述开口中的第一导体图案和通孔导体，并且彼此一体地形成 ; 以及第二导体图案，其形成在与所述加强基板的所述电绝缘体的相对侧上，并且至少部分地电连接到所述通孔导体。

公开(公告)号：US20060219428A1

公开(公告)日：2006-10-05

申请号：US11255025

申请日：2005-10-21

申请人： AKira Chinda ,  Nobuaki Miyamoto

发明人： AKira Chinda ,  Nobuaki Miyamoto

IPC分类号： H05K1/09 ,  H05K1/11 ,  H05K3/10

CPC分类号： H05K3/427 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/025 ,  H05K3/421 ,  H05K2201/0352 ,  H05K2201/0394 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A method is provided for fabricating a double-sided wiring board for mounting an electronic component thereon having metal wiring patterns formed both on upper and lower sides of an electrically-insulating board. The metal wiring patterns are electrically connected each other through a through-hole and/or a blind via-hole. The method has the steps of: laminating a metal layer with a support substrate on at least one side of the electrically-insulating board; removing the support substrate from the metal layer so that the metal layer is left on the electrically-insulating board; and forming the through-hole and/or the blind via-hole in the electrically-insulating board.

摘要翻译： 提供了一种制造用于安装其上的电子部件的双面布线板的方法，其上形成有电绝缘板的上侧和下侧上的金属布线图案。 金属布线图案通过通孔和/或盲孔通过电连接。 该方法具有以下步骤：在电绝缘板的至少一侧上层叠具有支撑基板的金属层; 从金属层移除支撑基板，使得金属层留在电绝缘板上; 以及在电绝缘板中形成通孔和/或盲通孔。

公开(公告)号：US08101864B2

公开(公告)日：2012-01-24

申请号：US12432249

申请日：2009-04-29

申请人： Akira Chinda ,  Nobuaki Miyamoto ,  Koki Hirasawa ,  Kenji Uchida ,  Mamoru Mita

发明人： Akira Chinda ,  Nobuaki Miyamoto ,  Koki Hirasawa ,  Kenji Uchida ,  Mamoru Mita

IPC分类号： H05K1/03

CPC分类号： H01L21/486 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3121 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2221/68345 ,  H01L2224/05554 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/85001 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： An electronic device substrate is provided with a thin-plate core substrate; a metal electrode provided on the core substrate and electrically connected to an electrode of an electronic component to be packaged thereon; and an electrical insulation layer on which is mounted the electronic component, and which is provided to surround the metal electrode.

摘要翻译： 电子器件基板设置有薄板芯基板; 金属电极，其设置在所述芯基板上并电连接到要封装在其上的电子部件的电极; 以及电绝缘层，电绝缘层上安装有电子部件，并且设置成围绕金属电极。

公开(公告)号：US07780836B2

公开(公告)日：2010-08-24

申请号：US11544720

申请日：2006-10-10

申请人： Akira Chinda ,  Nobuaki Miyamoto ,  Mamoru Mita

发明人： Akira Chinda ,  Nobuaki Miyamoto ,  Mamoru Mita

IPC分类号： C25D5/02

CPC分类号： H05K3/423 ,  H01L2924/0002 ,  H05K3/0023 ,  H05K3/025 ,  H05K3/108 ,  H05K3/386 ,  H05K3/421 ,  H05K3/427 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2203/0733 ,  H01L2924/00

摘要： On both surfaces of an electric insulating material 1, a surface conductive layer 2A and a back surface conductive layer 2B are formed by transcription. Further, a via hole 5 penetrating through the surface conductive layer 2A and the electric insulating material 1 is provided. After forming a photosensitive plating resist pattern 14, the via hole 5 is filled with a copper plating filler 15, and the surface wiring layer 9A and the back surface wiring layer 9B are formed. Thereafter, the photosensitive plating resist pattern 14 as well as the surface conductive layer 2A and the back surface conductive layer 2B provided under the photosensitive plating resist pattern 14 are removed to fabricate a double-sided wiring board 11.

摘要翻译： 在电绝缘材料1的两面上通过转印形成表面导电层2A和背面导电层2B。 此外，设置穿过表面导电层2A和电绝缘材料1的通孔5。 在形成感光电镀抗蚀剂图案14之后，通孔5填充有镀铜填料15，并且形成表面布线层9A和背面布线层9B。 此后，除去设置在感光电镀抗蚀剂图案14之下的感光电镀抗蚀剂图案14以及表面导电层2A和背面导电层2B，以制造双面布线板11。

公开(公告)号：US20090211796A1

公开(公告)日：2009-08-27

申请号：US12432249

申请日：2009-04-29

申请人： Akira Chinda ,  Nobuaki Miyamoto ,  Koki Hirasawa ,  Kenji Uchida ,  Mamoru Mita

发明人： Akira Chinda ,  Nobuaki Miyamoto ,  Koki Hirasawa ,  Kenji Uchida ,  Mamoru Mita

IPC分类号： H05K1/16

CPC分类号： H01L21/486 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3121 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2221/68345 ,  H01L2224/05554 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/85001 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： An electronic device substrate is provided with a thin-plate core substrate; a metal electrode provided on the core substrate and electrically connected to an electrode of an electronic component to be packaged thereon; and an electrical insulation layer on which is mounted the electronic component, and which is provided to surround the metal electrode.

摘要翻译： 电子器件基板设置有薄板芯基板; 金属电极，其设置在所述芯基板上并电连接到要封装在其上的电子部件的电极; 以及电绝缘层，电绝缘层上安装有电子部件，并且设置成围绕金属电极。

公开(公告)号：US20070269590A1

公开(公告)日：2007-11-22

申请号：US11645948

申请日：2006-12-27

申请人： Nobuaki Miyamoto ,  Akira Chinda ,  Koki Hirasawa ,  Kenji Uchida

发明人： Nobuaki Miyamoto ,  Akira Chinda ,  Koki Hirasawa ,  Kenji Uchida

IPC分类号： B05D5/12

CPC分类号： H01L21/4832 ,  H01L21/568 ,  H01L23/3121 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2221/68345 ,  H01L2224/05553 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48664 ,  H01L2224/49171 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/0023 ,  H05K3/007 ,  H05K3/06 ,  H05K3/243 ,  H05K3/284 ,  H05K2203/0156 ,  H05K2203/0571 ,  H05K2203/1469 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An electronic device substrate having: a base material formed of a thin board; an electrical insulation layer formed on the base material and having plural openings in a thickness direction thereof; and a metal plating layer filled in the plural openings. The base material has a metal layer, a release layer formed contacting the metal layer, and a metal film formed contacting the release layer.

摘要翻译： 一种电子器件基板，具有：由薄板形成的基材; 电绝缘层，形成在基材上，在其厚度方向上具有多个开口; 以及填充在所述多个开口中的金属镀层。 基材具有金属层，与金属层接触形成的剥离层和与剥离层接触形成的金属膜。

公开(公告)号：US08230591B2

公开(公告)日：2012-07-31

申请号：US12081538

申请日：2008-04-17

申请人： Akira Chinda ,  Nobuaki Miyamoto ,  Koki Hirasawa ,  Kenji Uchida ,  Mamoru Mita

发明人： Akira Chinda ,  Nobuaki Miyamoto ,  Koki Hirasawa ,  Kenji Uchida ,  Mamoru Mita

IPC分类号： H05K3/02

CPC分类号： H01L21/486 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3121 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2221/68345 ,  H01L2224/05554 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/85001 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： An electronic device substrate is provided with a thin-plate core substrate; a metal electrode provided on the core substrate and electrically connected to an electrode of an electronic component to be packaged thereon; and an electrical insulation layer on which is mounted the electronic component, and which is provided to surround the metal electrode.

摘要翻译： 电子器件基板设置有薄板芯基板; 金属电极，其设置在所述芯基板上并电连接到要封装在其上的电子部件的电极; 以及电绝缘层，电绝缘层上安装有电子部件，并且设置成围绕金属电极。

公开(公告)号：US08230588B2

公开(公告)日：2012-07-31

申请号：US12553815

申请日：2009-09-03

申请人： Nobuaki Miyamoto ,  Akira Chinda ,  Koki Hirasawa ,  Kenji Uchida

发明人： Nobuaki Miyamoto ,  Akira Chinda ,  Koki Hirasawa ,  Kenji Uchida

IPC分类号： H05K3/30 ,  H05K3/02 ,  H05K3/10

CPC分类号： H01L21/4832 ,  H01L21/568 ,  H01L23/3121 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2221/68345 ,  H01L2224/05553 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48664 ,  H01L2224/49171 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/0023 ,  H05K3/007 ,  H05K3/06 ,  H05K3/243 ,  H05K3/284 ,  H05K2203/0156 ,  H05K2203/0571 ,  H05K2203/1469 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of making an electronic device is disclosed. The method includes the steps of providing an electronic device substrate, mounting an electronic part on the electronic device substrate, removing the tape member and the metal film from the electronic device substrate, and forming a conductive structure at a position corresponding to the metal plating layer. The electronic device substrate includes a base material formed of a thin board and the base material includes a tape member, a metal film, a release layer, a metal layer, an electrical insulation layer and a metal plating layer filled in the plurality of openings.

摘要翻译： 公开了一种制造电子设备的方法。 该方法包括以下步骤：提供电子器件基板，将电子部件安装在电子器件基板上，从电子器件基板去除带状部件和金属膜，以及在对应于金属镀层的位置形成导电结构 。 电子设备基板包括由薄板形成的基材，并且基材包括填充在多个开口中的带部件，金属膜，剥离层，金属层，电绝缘层和金属镀层。