摘要:
Compounds comprising phosphorescent metal complexes comprising cyclometallated imidazo[1,2-f]phenanthridine and diimidazo[1,2-a:1′,2′-c]quinazoline ligands, or isoelectronic or benzannulated analogs thereof, are described. Organic light emitting diode devices comprising these compounds are also described.
摘要:
Disclosed is a process for the extractive recovery of an acid catalyst from an aqueous mixture of glycolic acid with an extraction solvent comprising a tertiary amine or an onium carboxylate compound, a modifier, and a diluent. The acid catalyst, which can comprise strong acids such as sulfuric acid, alkyl sulfonic acids, and fluoroalkyl sulfonic acids, can be recovered by back extraction with aqueous formaldehyde and recycled to a process for the preparation of glycolic acid by the acid-catalyzed carbonylation of formaldehyde.
摘要:
The present invention relates to organic light emitting devices (OLEDs), and more specifically to phosphorescent organic materials used in such devices. More specifically, the present invention relates to emissive phosphorescent material which comprise at least one tridentate ligand bound to a metal center, wherein at least one of the bonds to the tridentate ligand is a carbon-metal bond.
摘要:
The present invention relates to electrical contacts in a semiconductor device, and more particularly to methods and apparatuses for providing point contacts in a polysilicon emitter or HIT type solar cell. According to certain aspects, the invention uses a dielectric layer interposed between the substrate and a conductive layer to provide a limited area over which junction current can flow. The benefit is that the metal grid conductors do not need to align to the contacts, and can be applied freely without registration. Another benefit of the invention is that it provides increased efficiency for poly emitter and HIT cells through use of point contacts to increase current density. A further benefit is that patterning can be accomplished using low cost methods such as inclusion masking, screen printing or laser ablation. A still further benefit is that final contacts do not need alignment to the point contacts, eliminating registration required for conventional point contact designs.
摘要:
Embodiments of the invention contemplate the formation of a high efficiency solar cell using a novel plasma oxidation process to form a passivation film stack on a surface of a solar cell substrate. In one embodiment, the methods include providing a substrate having a first type of doping atom on a back surface of the substrate and a second type of doping atom on a front surface of the substrate, plasma oxidizing the back surface of the substrate to form an oxidation layer thereon, and forming a silicon nitride layer on the oxidation layer.
摘要:
A method of manufacturing a solar cell is provided. One surface of a semiconductor substrate is doped with a n-type dopant. The substrate is then subjected to a thermal oxidation process to form an oxide layer on one or both surfaces of the substrate. The thermal process also diffuses the dopant into the substrate, smoothing the concentration profile. The smoothed concentration gradient enables the oxide layer to act as a passivating layer. Anti-reflective coatings may be applied over the oxide layers, and a reflective layer may be applied on the surface opposite the doped surface to complete the solar cell.
摘要:
A simplified manufacturing process and the resultant bifacial solar cell (BSC) are provided, the simplified manufacturing process reducing manufacturing costs. The BSC includes an active region located on the front surface of the substrate, formed for example by a phosphorous diffusion step. The back surface includes a doped region, the doped region having the same conductivity as the substrate but with a higher doping level. Contact grids are formed, for example by screen printing. Front junction isolation is accomplished using a laser scribe.
摘要:
A simplified manufacturing process and the resultant bifacial solar cell (BSC) are provided, the simplified manufacturing process reducing manufacturing costs. The BSC includes an active region located on the front surface of the substrate, formed for example by a phosphorous diffusion step. After removing the PSG, assuming phosphorous diffusion, and isolating the front junction, dielectric layers are deposited on the front and back surfaces. Contact grids are formed, for example by screen printing. Prior to depositing the back surface dielectric, a metal grid may be applied to the back surface, the back surface contact grid registered to, and alloyed to, the metal grid during contact firing.
摘要:
In general, the present invention relates to forming electrical contacts in a semiconductor device, including contact regions in solar cells. According to certain aspects, the invention provides methods and apparatuses for forming plated contacts in the presence of a thin tunnel oxide. Preferably, the tunnel oxide dielectric layer is thin enough to sustain a tunnel current. Plating over the tunnel dielectric is then performed. The benefits of the invention include that no annealing is required to form the metal-silicide contact. Moreover, there is no requirement for special metals for n- or p-type contacts. Another advantage is that shallow contacts according to the invention avoid punching through a shallow junction, thereby enabling the use of shallower emitters with improved blue response. Still further, there is no need to control the amount of silicide metal plated in order to prevent driving the silicide alloy through the junction.
摘要:
The present invention generally comprises a solar cell and a solar cell fabrication process. Photogenerated electrons and electron-holes may have a short lifetime or low mobility that permits the electrons or electron-holes to recombine before reaching the junction. A percolating solar cell device may shorten the distance that the electrons and electron-holes need to travel to reach the junction. The percolating solar cell may be formed by depositing a silicon containing layer with poragens and then decomposing the poragens to create openings such as pores in the silicon containing layer. In one embodiment, the silicon containing layer is deposited and then etched anodically to create openings in the silicon containing layer. The layer deposited over the silicon containing layer may extend into the openings. By extending into the openings, the distance to the junction for electrons and electron-holes may be reduced and more electrons and electron-holes may reach the junction.