公开(公告)号：US20080317848A2

公开(公告)日：2008-12-25

申请号：US10492270

申请日：2004-04-08

申请人： Thomas Gramatte ,  Peter Gruber ,  Michael Heschel ,  Dirk Pamperin ,  Jan Ploen ,  Steffen Scheithauer ,  Wolfgang Wehner ,  Peter Guldner

发明人： Thomas Gramatte ,  Peter Gruber ,  Michael Heschel ,  Dirk Pamperin ,  Jan Ploen ,  Steffen Scheithauer ,  Wolfgang Wehner ,  Peter Guldner

IPC分类号： A61K31/445 ,  A61K9/20

CPC分类号： A61K9/2009 ,  A61K9/2054 ,  A61K9/2846 ,  A61K9/5026 ,  A61K9/5078 ,  A61K31/445

摘要： By suitable retardation oral pharmaceutical compositions containing propiverine or one or several pharmaceutically acceptable salts thereof in an amount of 4 mg to 60 mg propiverine and having a prolonged release of the active agent are produced. Preferably a blend of active agent and optionally one or more acidic substances having a pKa value of less than 6.65 are provided with a retarding coating or are embedded in a matrix which is then optionally coated with further retarding layers.

摘要翻译： 通过合适的阻滞剂，可以制备含有丙哌嗪或其一种或多种药学上可接受的盐的药物组合物，其量为4mg至60mg propiverine并且具有延长的活性剂释放。 优选地，具有pKa值小于6.65的活性剂和任选的一种或多种酸性物质的混合物具有延迟涂层或嵌入基质中，然后任选地涂覆有进一步的阻滞层。

公开(公告)号：US20070246518A1

公开(公告)日：2007-10-25

申请号：US11409233

申请日：2006-04-21

申请人： Steven Cordes ,  Peter Gruber ,  John Knickerbocker ,  James Speidell

发明人： Steven Cordes ,  Peter Gruber ,  John Knickerbocker ,  James Speidell

IPC分类号： B23K20/08 ,  B23K31/02 ,  B23K1/00

CPC分类号： B23K3/0638 ,  B23K1/20 ,  B23K2101/40 ,  H01L24/11 ,  H01L24/742 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00

摘要： A system, method, and apparatus for injection molding conductive bonding material into a plurality of cavities in a surface are disclosed. The method comprises aligning a fill head with a surface. The mold includes a plurality of cavities. The method further includes placing the fill head in substantial contact with the surface. At least a first gas is channeled about a first region of the fill head. The at least first gas has a temperature above a melting point of conductive bonding material residing in a reservoir thereby maintaining the conductive bonding material in a molten state. The conductive bonding material is forced out of the fill head toward the surface. The conductive bonding material is provided into at least one cavity of the plurality of cavities contemporaneous with the at least one cavity being in proximity to the fill head.

摘要翻译： 公开了一种用于将导电接合材料注射成表面中的多个空腔的系统，方法和装置。 该方法包括将填充头与表面对准。 模具包括多个空腔。 该方法还包括将填充头与表面实质接触。 至少第一气体围绕填充头的第一区域引导。 所述至少第一气体具有高于位于储存器中的导电接合材料的熔点的温度，从而将导电接合材料保持在熔融状态。 导电接合材料从表面压出填料头。 导电接合材料被提供到与填充头附近的至少一个空腔同时的多个空腔的至少一个空腔中。

公开(公告)号：US20070246516A1

公开(公告)日：2007-10-25

申请号：US11409242

申请日：2006-04-21

申请人： Steven Cordes ,  Peter Gruber ,  John Knickerbocker ,  James Speidell

发明人： Steven Cordes ,  Peter Gruber ,  John Knickerbocker ,  James Speidell

IPC分类号： B23K31/02 ,  B23K1/08

CPC分类号： B23K3/0638 ,  B23K1/0016 ,  B23K3/0623 ,  B23K2101/40 ,  H01L24/11 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/3478 ,  H05K3/3484 ,  H05K2201/09945 ,  H05K2203/0113 ,  H05K2203/043 ,  H01L2924/00

摘要： A system, method, and device for applying conductive bonding material to a substrate are disclosed. The method includes providing conductive bonding material in a plurality of cavities of a mold. A total number of cavities in the plurality of cavities being greater than a total number of at least one conductive pad of a circuit supporting substrate corresponding to the mold. The conductive bonding material in the mold is heated to a reflow temperature of the conductive bonding material. At least one wettable surface is placed in substantial contact with the heated conductive bonding material in at least one cavity. The mold and the corresponding circuit supporting substrate are brought in close proximity to each other such that the heated conductive bonding material in at least one cavity comes in contact with at least one conductive pad of the corresponding circuit supporting substrate.

摘要翻译： 公开了一种用于将导电接合材料施加到基底的系统，方法和装置。 该方法包括在模具的多个空腔中提供导电接合材料。 多个空腔中的空腔的总数大于对应于模具的电路支撑衬底的至少一个导电焊盘的总数。 将模具中的导电接合材料加热至导电接合材料的回流温度。 在至少一个空腔中至少一个可润湿表面被放置成与被加热的导电接合材料基本接触。 模具和相应的电路支撑衬底彼此靠近，使得至少一个空腔中的加热的导电接合材料与相应的电路支撑衬底的至少一个导电焊盘接触。

公开(公告)号：US20070029277A1

公开(公告)日：2007-02-08

申请号：US11195147

申请日：2005-08-02

申请人： Lawrence Jacobowitz ,  Stephen Buchwalter ,  Casimer DeCusatis ,  Peter Gruber ,  Da-Yuan Shih

发明人： Lawrence Jacobowitz ,  Stephen Buchwalter ,  Casimer DeCusatis ,  Peter Gruber ,  Da-Yuan Shih

IPC分类号： B29D11/00 ,  B29C35/08 ,  B29C45/00

CPC分类号： H01L27/14685 ,  B29D11/00365 ,  B29D11/00461 ,  B82Y30/00 ,  G02B3/0018 ,  G02B3/0056 ,  G02F1/137 ,  G02F1/29 ,  H01L27/14627 ,  H01L31/02327 ,  H01L33/58

摘要： A wafer-scale apparatus and method is described for the automation of forming, aligning and attaching two-dimensional arrays of microoptic elements on semiconductor and other image display devices, backplanes, optoelectronic boards, and integrated optical systems. In an ordered fabrication sequence, a mold plate comprised of optically designed cavities is formed by reactive ion etching or alternative processes, optionally coated with a release material layer and filled with optically specified materials by an automated fluid-injection and defect-inspection subsystem. Optical alignment fiducials guide the disclosed transfer and attachment processes to achieve specified tolerances between the microoptic elements and corresponding optoelectronic devices and circuits. The present invention applies to spectral filters, waveguides, fiber-optic mode-transformers, diffraction gratings, refractive lenses, diffractive lens/Fresnel zone plates, reflectors, and to combinations of elements and devices, including microelectromechanical systems (MEMS) and liquid crystal device (LCD) matrices for adaptive, tunable elements. Preparation of interfacial layer properties and attachment process embodiments are taught.

摘要翻译： 描述了用于在半导体和其他图像显示装置，背板，光电板和集成光学系统上形成，对准和附着微量元件的二维阵列的自动化的晶片级装置和方法。 在有序的制造顺序中，由光学设计的空腔构成的模具板通过反应离子蚀刻或可选的工艺形成，任选地涂覆有释放材料层，并通过自动化流体注入和缺陷检查子系统填充光学特定的材料。 光学校准基准指导所公开的转移和附着过程以实现微光学元件与对应的光电器件和电路之间的特定公差。 本发明适用于光谱滤波器，波导管，光纤模式变压器，衍射光栅，折射透镜，衍射透镜/菲涅耳带片，反射器以及元件和器件的组合，包括微机电系统（MEMS）和液晶器件 （LCD）矩阵，用于自适应，可调元素。 教导界面层性质和附着工艺实施例的制备。

公开(公告)号：US20060124927A1

公开(公告)日：2006-06-15

申请号：US10905013

申请日：2004-12-09

申请人： Robert Groves ,  Peter Gruber ,  Kevin Petrarca ,  Richard Volant ,  George Walker

发明人： Robert Groves ,  Peter Gruber ,  Kevin Petrarca ,  Richard Volant ,  George Walker

IPC分类号： H01L21/66 ,  H01L23/58

CPC分类号： H05K3/3468 ,  G01R1/07314 ,  G01R3/00 ,  H01L21/4853 ,  H01L21/6835 ,  H01L24/11 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01058 ,  H01L2924/01066 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/19041 ,  H01L2924/19042 ,  H05K3/325 ,  H05K2201/09745 ,  H05K2201/10734 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/128 ,  H05K2203/162 ,  H05K2203/167 ,  H01L2224/0401

摘要： Methods of forming a conductive structure on a substrate prior to packaging, and a test probe structure generated according to the method, are disclosed. The conductive structure includes a high aspect ratio structure formed by injected molded solder. The invention can be applied to form passive elements and interconnects on a conventional semiconductor substrate after the typical BEOL, and prior to packaging. The method may provide better electromigration characteristics, lower resistivity, and higher Q factors for conductive structures. In addition, the method is backwardly compatible and customizable.

摘要翻译： 公开了在封装之前在基板上形成导电结构的方法和根据该方法生成的测试探针结构。 导电结构包括通过注射成型的焊料形成的高纵横比结构。 本发明可以应用于在典型的BEOL之后以及在封装之前在常规半导体衬底上形成无源元件和互连。 该方法可以为导电结构提供更好的电迁移特性，较低的电阻率和更高的Q因子。 此外，该方法可以向后兼容并可定制。

公开(公告)号：US5568133A

公开(公告)日：1996-10-22

申请号：US570814

申请日：1995-12-12

申请人： Bernhard Durrer ,  Hans Botschi ,  Peter Gruber

发明人： Bernhard Durrer ,  Hans Botschi ,  Peter Gruber

IPC分类号： G08B17/113 ,  G08B23/00

CPC分类号： G08B17/113

摘要： Upon insertion of a fire alarm insert into a corresponding fire alarm mounting, the insert covers the mounting. The insert has a movable fastening comprising a ring, for example, for fastening the insert to the mounting. Indicator elements are included for indicating proper positioning of the insert relative to the mounting.

摘要翻译： 在将火警报警插入物插入相应的火灾报警装置后，插入物将覆盖安装件。 插入件具有可移动的紧固件，其包括例如用于将插入件紧固到安装件上的环。 包括指示元件用于指示插入件相对于安装件的正确定位。

公开(公告)号：US5364646A

公开(公告)日：1994-11-15

申请号：US33659

申请日：1993-03-16

申请人： Peter Gruber ,  Willy Roth ,  Gottfried Schepky

发明人： Peter Gruber ,  Willy Roth ,  Gottfried Schepky

IPC分类号： A61K9/20 ,  A61K9/48 ,  A61K31/50

CPC分类号： A61K31/50 ,  A61K9/2013 ,  A61K9/2077 ,  A61K9/4841 ,  A61K9/4858 ,  Y10S514/96 ,  Y10S514/962

摘要： Pharmaceutical forms of pimobendan for oral administration comprising citric acid, whereby a constant, satisfactory resorption is ensured even when there are major pH fluctuations in the gastrointestinal tract.

摘要翻译： 用于口服给药的匹莫苯胺的药物形式包括柠檬酸，由此即使当胃肠道中存在主要的pH波动时也确保恒定的令人满意的吸收。

公开(公告)号：US08956647B2

公开(公告)日：2015-02-17

申请号：US13951951

申请日：2013-07-26

申请人： Norbert Otterbeck ,  Peter Gruber

发明人： Norbert Otterbeck ,  Peter Gruber

IPC分类号： A61K9/52 ,  A61K9/00 ,  A61K9/16 ,  A61K9/50 ,  A61K31/60 ,  A61K9/14 ,  A61K31/606

CPC分类号： A61K9/0053 ,  A61K9/141 ,  A61K9/16 ,  A61K9/1635 ,  A61K9/1652 ,  A61K9/501 ,  A61K9/5026 ,  A61K9/5042 ,  A61K31/60 ,  A61K31/606

摘要： An orally administrable pharmaceutical pellet formulation for the treatment of the intestinal tract is disclosed, which comprises a core and an enteric coating, the core including, as a pharmaceutical active compound, aminosalicylic acid or a pharmaceutically tolerable salt or a derivative thereof.

公开(公告)号：US08889184B2

公开(公告)日：2014-11-18

申请号：US11516573

申请日：2006-09-07

申请人： Peter Gruber ,  Peter Kraahs

发明人： Peter Gruber ,  Peter Kraahs

IPC分类号： A61K9/46 ,  A61K9/50

CPC分类号： A61K9/5042

摘要： The present invention relates to a pharmaceutical composition for direct oral administration which is very easy to swallow especially for young children, comprising at least one pharmaceutically active compound. The pharmaceutical composition is present in the form of one or more particles. The particles comprise a core containing the active ingredient which has been provided with one or more coatings. The pharmaceutical composition is preferably administered in combination with a powder and/or granules which, when applied to the tongue, spontaneously generate additional saliva. With the extra saliva, the coated particles form a soft, smooth, but mechanically stable surface perceived as pleasant in the mouth within seconds so that they may be swallowed easily and practically in the right quantity with the extra saliva formed.

摘要翻译： 本发明涉及用于直接口服给药的药物组合物，其特别是对于包含至少一种药学活性化合物的幼儿尤其容易吞咽。 药物组合物以一种或多种颗粒的形式存在。 颗粒包含含有活性成分的芯，其已经具有一个或多个涂层。 药物组合物优选与粉末和/或颗粒组合施用，当施用于舌头时，其自发产生另外的唾液。 随着额外的唾液，涂覆的颗粒形成柔软，光滑但机械稳定的表面，在几秒钟内被感觉到在口中愉快，使得它们可以容易地并且实际上以形成额外的唾液的数量吞咽。

公开(公告)号：US20070272389A1

公开(公告)日：2007-11-29

申请号：US11396107

申请日：2006-03-31

申请人： Peter Gruber ,  John Knickerbocker

发明人： Peter Gruber ,  John Knickerbocker

IPC分类号： B22D11/124 ,  B05D5/12

CPC分类号： H05K3/3457 ,  H01L21/288 ,  H01L24/11 ,  H01L24/12 ,  H01L2224/11009 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/1319 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H05K2203/0113 ,  H05K2203/0557 ,  H01L2924/00

摘要： A method and apparatus for the formation of coplanar electrical interconnectors. Solder material is deposited onto a wafer, substrate, or other component of an electrical package using a complaint mold such that the terminal ends of the solder material being deposited, i.e., the ends opposite to those forming an attachment to the wafer, substrate, or other component of an electrical package are coplanar with one another. A complaint mold is used having one or more conduits for receiving solder material and having a compliant side and a planar side. The compliant side of the mold is positioned adjacent to the wafer, substrate, or other component of an electrical package allowing solder material to be deposited onto the surface thereof such that the planar side of the compliant mold provides coplanar interconnectors. An Injection Molded Solder (IMS) head can be used as the means for filling the conduits of the compliant mold of the present invention.

摘要翻译： 用于形成共面电连接器的方法和装置。 使用投诉模具将焊料沉积到电气封装的晶片，基板或其他部件上，使得焊料材料的末端被沉积，即与形成与晶片，基板或附件形成连接的端部相对的端部 电气封装的其他部件彼此共面。 使用投诉模具具有一个或多个用于接收焊料材料并具有柔性侧面和平面侧的导管。 模具的柔性侧被定位成与电气封装的晶片，衬底或其它部件相邻，允许将焊料材料沉积到其表面上，使得柔性模具的平面侧提供共面的互连器件。 可以使用注射成型焊料（IMS）头作为填充本​​发明的柔性模具的导管的装置。