摘要:
The present invention relates to a manufacturing method of an integrated circuit (IC) comprising a substrate (10) comprising a pixelated element (12) and a light path (38) to the pixelated element (12). The IC comprises a first dielectric layer (14) covering the substrate (10) but not the pixilated element (12), a first metal layer (16) covering a part of the first dielectric layer (14), a second dielectric layer (18) covering a further part of first dielectric layer (14), a second metal layer (20) covering a part of the second dielectric layer (18) and extending over the pixelated element (12) and a part of the first metal layer (16), the first metal layer (16) and the second metal layer (20) forming an air-filled light path (38) to the pixelated element (12). The air-filled light path (38) is formed by creation of holes in the first dielectric layer (14) and the second dielectric layer (18), filling the holes with sacrificial materials, and removal of the sacrificial materials after deposition and patterning of the second metal layer (20). This yields an IC having a low-loss light path to the pixelated element (12). The light path may act as a color filter, e.g. a Fabry-Perot color filter.
摘要:
An active thermal management device and method, in which a phase change material unit, comprising at least one phase change material arranged in series or parallel, is connectable to a source of thermal energy, such as LEDs at a first operating condition. Thermal energy from the source of thermal energy is stored in the phase change material unit. The phase change material unit is connectable to a sink of thermal energy, such as second LEDs at a second operating condition. The thermal energy stored in the phase change material unit may be re-used. The first operating condition can include a 15V supply voltage, and the second operating condition can include either no supply voltage, or a lower 9V supply voltage of 9V, such that heat from the first LEDs, which may be over-temperature, can pre-heat the second LEDs, improving thermal and optical matching.
摘要:
A method of providing a dielectric material (18) having regions (18′, 18″) with a varying thickness in an IC manufacturing process is disclosed. The method comprises forming a plurality of patterns in respective regions (20′, 20″) of the dielectric material (18), each pattern increasing the susceptibility of the dielectric material (18) to a dielectric material removal step by a predefined amount and exposing the dielectric material (18) to the dielectric material removal step. In an embodiment, the IC comprises a plurality of pixilated elements (12) and a plurality of light interference elements (24), each comprising a first mirror element (16) and a second mirror element (22), a region of the dielectric material (18) separating the first mirror element (16) and the second element (22), and each being arranged over one of said pixilated elements (12), the method further comprising forming the respective first mirror elements (16) in a dielectric layer (14) over a substrate (10) comprising the plurality of pixilated elements; depositing the dielectric material over the dielectric layer; and forming the respective second mirror elements such that each second mirror element is separated from a respective first mirror element by a region of the exposed dielectric material. Hence, an IC having a layer of a dielectric material (18) comprising regions of different thicknesses can be obtained requiring only a few process steps.
摘要:
A method of estimating the junction temperature of a light emitting diode comprises driving a forward bias current through the diode, the current comprising a square wave which toggles between high and low current values (Ihigh, llow), the high current value (lhigh) comprising an LED operation current, and the low current value (IIOW) comprising a non-zero measurement current. The forward bias voltage drop (Vf) is sampled and the forward bias voltage drop (Vflow) is determined at the measurement current (IIOW)—The temperature is derived from the determined forward bias voltage drop.
摘要:
A method of manufacturing a FET gate with a plurality of materials includes depositing a dummy region 8, and then forming a plurality of metallic layers 16, 18, 20 on gate dielectric 6 by conformally depositing a layer of each metallic layer and then anisotropically etching back to leave the metallic layer on the sides 10 of the dummy region. The dummy region is then removed leaving the metallic layers 16,18, 20 as the gate over the gate dielectric 6.
摘要:
A method of making a resonator, preferably a nano-resonator, includes starting with a FINFET structure with a central bar, first and second electrodes connected to the central bar, and third and fourth electrodes on either side of the central bar and separated from the central bar by gate dielectric. The structure is formed on a buried oxide layer. The gate dielectric and buried oxide layer are then selectively etched away to provide a nano-resonator structure with a resonator element 30, a pair of resonator electrodes (32,34), a control electrode (36) and a sensing electrode (38).
摘要:
A static random access memory means is provided. The SRAM memory means comprises a first pass-gate FET (T6) which is coupled between a first node (A) and a bitline-bar (BLB). A second pass-gate FET (T1) is coupled between a second node (B) and a bitline (BL). The second node (B) is coupled to the first pass-gate FET (T6) and the first pass-gate FET (T6) is switched according to the voltage (VB) at the second node (B). The first node (A) is coupled to the second pass-gate FET (T1). The second pass-gate FET (T1) is switched according to the voltage (VA) on the first node (A).
摘要:
Methods of forming semiconductor devices with a layered structure of thin and well defined layer of activated dopants, are disclosed. In a preferred method, a region in a semiconductor substrate is amorphized, after which the region is implanted with a first dopant at a first doping concentration. Then a solid phase epitaxy regrowth step is performed on a thin layer of desired thickness of the amorphized region, in order to activate the first dopant only in this thin layer. Subsequently, a second dopant is implanted in the remaining amorphous region at a second doping concentration. Subsequent annealing of the substrate activates the second dopant only in said remaining region, so a very abrupt transition between dopant characteristics of the thin layer with first dopant and the region with the second dopant is obtained.
摘要:
The present invention provides an MIS type semiconductor device, comprising a semiconductor substrate and a gate electrode formed on the gate insulating film and formed of gate material. The gate electrode comprises: a first layer of activated crystalline gate material having a first side oriented towards a substrate and a second side oriented away from the substrate, the first layer of activated crystalline gate material having a doping level of 1019 ions/cm3 or higher, and a second layer of gate material at the second side of the first layer of activated crystalline gate material. The present invention also provides a method for making such a device.
摘要翻译:本发明提供了一种MIS型半导体器件,包括半导体衬底和形成在栅极绝缘膜上并由栅极材料形成的栅电极。 所述栅电极包括:第一激活晶体栅极材料层,其具有朝向衬底取向的第一侧和远离所述衬底的第二侧,所述第一激活晶体栅极材料层的掺杂水平为10 19, / SUP>离子/ cm 3以上,第二层栅极材料在第一层激活的结晶栅极材料的第二面。 本发明还提供了制造这种装置的方法。
摘要:
Methods of forming semiconductor devices with a layered structure of thin and well defined layer of activated dopants, are disclosed. In a preferred method, a region in a semiconductor substrate is amorphized, after which the region is implanted with a first dopant at a first doping concentration. Then a solid phase epitaxy regrowth step is performed on a thin layer of desired thickness of the amorphized region, in order to activate the first dopant only in this thin layer. Subsequently, a second dopant is implanted in the remaining amorphous region at a second doping concentration. Subsequent annealing of the substrate activates the second dopant only in said remaining region, so a very abrupt transition between dopant characteristics of the thin layer with first dopant and the region with the second dopant is obtained.