Manufacturing method and integrated circuit having a light path to a pixilated element
    1.
    发明授权
    Manufacturing method and integrated circuit having a light path to a pixilated element 有权
    具有到像素化元件的光路的制造方法和集成电路

    公开(公告)号:US08368105B2

    公开(公告)日:2013-02-05

    申请号:US12922072

    申请日:2009-03-09

    IPC分类号: H01L33/00

    摘要: The present invention relates to a manufacturing method of an integrated circuit (IC) comprising a substrate (10) comprising a pixelated element (12) and a light path (38) to the pixelated element (12). The IC comprises a first dielectric layer (14) covering the substrate (10) but not the pixilated element (12), a first metal layer (16) covering a part of the first dielectric layer (14), a second dielectric layer (18) covering a further part of first dielectric layer (14), a second metal layer (20) covering a part of the second dielectric layer (18) and extending over the pixelated element (12) and a part of the first metal layer (16), the first metal layer (16) and the second metal layer (20) forming an air-filled light path (38) to the pixelated element (12). The air-filled light path (38) is formed by creation of holes in the first dielectric layer (14) and the second dielectric layer (18), filling the holes with sacrificial materials, and removal of the sacrificial materials after deposition and patterning of the second metal layer (20). This yields an IC having a low-loss light path to the pixelated element (12). The light path may act as a color filter, e.g. a Fabry-Perot color filter.

    摘要翻译: 本发明涉及一种集成电路(IC)的制造方法,该集成电路(IC)包括基板(10),该基板(10)包括像素化元件(12)和到像素化元件(12)的光路(38)。 所述IC包括覆盖所述衬底(10)而不是所述像素化元件(12)的第一介电层(14),覆盖所述第一介电层(14)的一部分的第一金属层(16),第二介电层(18) )覆盖第一介电层(14)的另一部分,覆盖第二介电层(18)的一部分并在像素化元件(12)上延伸的第二金属层(20)和第一金属层(16)的一部分 ),第一金属层(16)和第二金属层(20)形成到像素化元件(12)的充气光路(38)。 充气光路(38)通过在第一电介质层(14)和第二电介质层(18)中产生孔而形成,用牺牲材料填充孔,并且在沉积和图案化之后去除牺牲材料 第二金属层(20)。 这产生具有到像素化元件(12)的低损耗光路的IC。 光路可以用作滤色器,例如, 法布里 - 珀罗滤镜。

    ACTIVE THERMAL MANAGEMENT DEVICE AND THERMAL MANAGEMENT METHOD
    2.
    发明申请
    ACTIVE THERMAL MANAGEMENT DEVICE AND THERMAL MANAGEMENT METHOD 有权
    主动热管理装置和热管理方法

    公开(公告)号:US20120247707A1

    公开(公告)日:2012-10-04

    申请号:US13424848

    申请日:2012-03-20

    IPC分类号: F28D19/00

    摘要: An active thermal management device and method, in which a phase change material unit, comprising at least one phase change material arranged in series or parallel, is connectable to a source of thermal energy, such as LEDs at a first operating condition. Thermal energy from the source of thermal energy is stored in the phase change material unit. The phase change material unit is connectable to a sink of thermal energy, such as second LEDs at a second operating condition. The thermal energy stored in the phase change material unit may be re-used. The first operating condition can include a 15V supply voltage, and the second operating condition can include either no supply voltage, or a lower 9V supply voltage of 9V, such that heat from the first LEDs, which may be over-temperature, can pre-heat the second LEDs, improving thermal and optical matching.

    摘要翻译: 一种主动热管理装置和方法,其中包括串联或并联布置的至少一个相变材料的相变材料单元可连接到热能源,例如在第一操作条件下的LED。 来自热能源的热能存储在相变材料单元中。 相变材料单元可在第二操作条件下连接到热能汇,例如第二LED。 存储在相变材料单元中的热能可以被重新使用。 第一操作条件可以包括15V电源电压,第二操作条件可以包括不供电电压或9V的较低9V电源电压,使得来自可能是过温的第一LED的热量可以预热, 加热第二个LED,改善热和光学匹配。

    INTEGRATED CIRCUIT MANUFACTURING METHOD
    3.
    发明申请
    INTEGRATED CIRCUIT MANUFACTURING METHOD 有权
    集成电路制造方法

    公开(公告)号:US20110037135A1

    公开(公告)日:2011-02-17

    申请号:US12988110

    申请日:2009-04-14

    IPC分类号: H01L31/0232 H01L31/18

    摘要: A method of providing a dielectric material (18) having regions (18′, 18″) with a varying thickness in an IC manufacturing process is disclosed. The method comprises forming a plurality of patterns in respective regions (20′, 20″) of the dielectric material (18), each pattern increasing the susceptibility of the dielectric material (18) to a dielectric material removal step by a predefined amount and exposing the dielectric material (18) to the dielectric material removal step. In an embodiment, the IC comprises a plurality of pixilated elements (12) and a plurality of light interference elements (24), each comprising a first mirror element (16) and a second mirror element (22), a region of the dielectric material (18) separating the first mirror element (16) and the second element (22), and each being arranged over one of said pixilated elements (12), the method further comprising forming the respective first mirror elements (16) in a dielectric layer (14) over a substrate (10) comprising the plurality of pixilated elements; depositing the dielectric material over the dielectric layer; and forming the respective second mirror elements such that each second mirror element is separated from a respective first mirror element by a region of the exposed dielectric material. Hence, an IC having a layer of a dielectric material (18) comprising regions of different thicknesses can be obtained requiring only a few process steps.

    摘要翻译: 公开了一种在IC制造过程中提供具有变化厚度的区域(18',18“)的介电材料(18)的方法。 该方法包括在介电材料(18)的相应区域(20',20“)中形成多个图案,每个图案将电介质材料(18)的敏感性增加到电介质材料去除步骤预定量并暴露 电介质材料(18)到介电材料去除步骤。 在一个实施例中,IC包括多个像素化元件(12)和多个光干涉元件(24),每个元件包括第一镜元件(16)和第二镜元件(22),介电材料的区域 (18)分离第一镜元件(16)和第二元件(22),并且每个被布置在一个所述像素化元件(12)上,所述方法还包括在电介质层中形成相应的第一镜元件(16) (14)包括多个像素化元件的衬底(10)上; 在电介质层上沉积电介质材料; 以及形成各个第二反射镜元件,使得每个第二反射镜元件通过暴露的电介质材料的区域与相应的第一反射镜元件分离。 因此,可以获得具有包括不同厚度的区域的电介质材料层(18)的IC,只需要几个工艺步骤。

    Method of manufacturing a FET gate
    5.
    发明授权
    Method of manufacturing a FET gate 有权
    制造FET栅极的方法

    公开(公告)号:US07838371B2

    公开(公告)日:2010-11-23

    申请号:US12513548

    申请日:2007-10-25

    IPC分类号: H01L21/336

    摘要: A method of manufacturing a FET gate with a plurality of materials includes depositing a dummy region 8, and then forming a plurality of metallic layers 16, 18, 20 on gate dielectric 6 by conformally depositing a layer of each metallic layer and then anisotropically etching back to leave the metallic layer on the sides 10 of the dummy region. The dummy region is then removed leaving the metallic layers 16,18, 20 as the gate over the gate dielectric 6.

    摘要翻译: 制造具有多种材料的FET栅极的方法包括沉积虚拟区域8,然后通过共形沉积每个金属层的层然后各向异性地回蚀而在栅极电介质6上形成多个金属层16,18,20 以使金属层离开虚拟区域的侧面10。 然后去除虚拟区域,留下金属层16,18,20作为栅极电介质6上的栅极。

    RESONATOR
    6.
    发明申请
    RESONATOR 审中-公开
    谐振器

    公开(公告)号:US20100090302A1

    公开(公告)日:2010-04-15

    申请号:US12444684

    申请日:2007-10-05

    摘要: A method of making a resonator, preferably a nano-resonator, includes starting with a FINFET structure with a central bar, first and second electrodes connected to the central bar, and third and fourth electrodes on either side of the central bar and separated from the central bar by gate dielectric. The structure is formed on a buried oxide layer. The gate dielectric and buried oxide layer are then selectively etched away to provide a nano-resonator structure with a resonator element 30, a pair of resonator electrodes (32,34), a control electrode (36) and a sensing electrode (38).

    摘要翻译: 一种制造谐振器,优选纳米谐振器的方法包括以中心棒,连接到中心棒的第一和第二电极以及中心棒的任一侧上的第三和第四电极的FINFET结构开始并与 中央棒由栅极电介质。 该结构形成在掩埋氧化物层上。 然后选择性地蚀刻栅极电介质和掩埋氧化物层以提供具有谐振元件30,一对谐振器电极(32,34),控制电极(36)和感测电极(38)的纳米谐振器结构。

    STATIC RANDOM ACCESS MEMORY CELL
    7.
    发明申请
    STATIC RANDOM ACCESS MEMORY CELL 审中-公开
    静态随机存取存储单元

    公开(公告)号:US20090073746A1

    公开(公告)日:2009-03-19

    申请号:US12297299

    申请日:2007-04-19

    IPC分类号: G11C11/412 H01L27/11

    CPC分类号: G11C11/412 H01L29/785

    摘要: A static random access memory means is provided. The SRAM memory means comprises a first pass-gate FET (T6) which is coupled between a first node (A) and a bitline-bar (BLB). A second pass-gate FET (T1) is coupled between a second node (B) and a bitline (BL). The second node (B) is coupled to the first pass-gate FET (T6) and the first pass-gate FET (T6) is switched according to the voltage (VB) at the second node (B). The first node (A) is coupled to the second pass-gate FET (T1). The second pass-gate FET (T1) is switched according to the voltage (VA) on the first node (A).

    摘要翻译: 提供静态随机存取存储器装置。 SRAM存储装置包括耦合在第一节点(A)和位线条(BLB)之间的第一通栅FET(T6)。 第二通栅FET(T1)耦合在第二节点(B)和位线(BL)之间。 第二节点(B)耦合到第一栅极FET(T6),并且第一栅极FET(T6)根据第二节点(B)处的电压(VB)被切换。 第一节点(A)耦合到第二通过栅极FET(T1)。 第二栅极FET(T1)根据第一节点(A)上的电压(VA)而被切换。

    METHOD AND APPARATUS FOR FORMING A SEMICONDUCTOR SUBSTRATE WITH A LAYER STRUCTURE OF ACTIVATED DOPANTS
    8.
    发明申请
    METHOD AND APPARATUS FOR FORMING A SEMICONDUCTOR SUBSTRATE WITH A LAYER STRUCTURE OF ACTIVATED DOPANTS 审中-公开
    形成具有活性多糖的层结构的半导体基板的方法和装置

    公开(公告)号:US20070267660A1

    公开(公告)日:2007-11-22

    申请号:US11744574

    申请日:2007-05-04

    申请人: Radu Surdeanu

    发明人: Radu Surdeanu

    IPC分类号: H01L29/78

    摘要: Methods of forming semiconductor devices with a layered structure of thin and well defined layer of activated dopants, are disclosed. In a preferred method, a region in a semiconductor substrate is amorphized, after which the region is implanted with a first dopant at a first doping concentration. Then a solid phase epitaxy regrowth step is performed on a thin layer of desired thickness of the amorphized region, in order to activate the first dopant only in this thin layer. Subsequently, a second dopant is implanted in the remaining amorphous region at a second doping concentration. Subsequent annealing of the substrate activates the second dopant only in said remaining region, so a very abrupt transition between dopant characteristics of the thin layer with first dopant and the region with the second dopant is obtained.

    摘要翻译: 公开了具有薄且明确限定的活化掺杂剂层的层状结构的半导体器件的方法。 在优选的方法中,半导体衬底中的区域是非晶化的,之后在第一掺杂浓度下注入第一掺杂剂区域。 然后在非晶形区域的所需厚度的薄层上进行固相外延再生步骤,以便仅在该薄层中激活第一掺杂剂。 随后,第二掺杂剂以第二掺杂浓度注入剩余的非晶区。 衬底的随后的退火仅在所述剩余区域中激活第二掺杂物,因此获得具有第一掺杂剂的薄层的掺杂剂特性与具有第二掺杂剂的区域之间的非常突然的转变。

    Gate electrode for semiconductor devices
    9.
    发明申请
    Gate electrode for semiconductor devices 审中-公开
    用于半导体器件的栅电极

    公开(公告)号:US20060197120A1

    公开(公告)日:2006-09-07

    申请号:US10550741

    申请日:2004-03-23

    IPC分类号: H01L29/76

    CPC分类号: H01L29/4925

    摘要: The present invention provides an MIS type semiconductor device, comprising a semiconductor substrate and a gate electrode formed on the gate insulating film and formed of gate material. The gate electrode comprises: a first layer of activated crystalline gate material having a first side oriented towards a substrate and a second side oriented away from the substrate, the first layer of activated crystalline gate material having a doping level of 1019 ions/cm3 or higher, and a second layer of gate material at the second side of the first layer of activated crystalline gate material. The present invention also provides a method for making such a device.

    摘要翻译: 本发明提供了一种MIS型半导体器件,包括半导体衬底和形成在栅极绝缘膜上并由栅极材料形成的栅电极。 所述栅电极包括:第一激活晶体栅极材料层,其具有朝向衬底取向的第一侧和远离所述衬底的第二侧,所述第一激活晶体栅极材料层的掺杂水平为10 19, / SUP>离子/ cm 3以上,第二层栅极材料在第一层激活的结晶栅极材料的第二面。 本发明还提供了制造这种装置的方法。

    Method and apparatus for forming a semiconductor substrate with a layer structure of activated dopants
    10.
    发明申请
    Method and apparatus for forming a semiconductor substrate with a layer structure of activated dopants 有权
    用于形成具有活化掺杂剂的层结构的半导体衬底的方法和装置

    公开(公告)号:US20050112831A1

    公开(公告)日:2005-05-26

    申请号:US10966145

    申请日:2004-10-15

    申请人: Radu Surdeanu

    发明人: Radu Surdeanu

    摘要: Methods of forming semiconductor devices with a layered structure of thin and well defined layer of activated dopants, are disclosed. In a preferred method, a region in a semiconductor substrate is amorphized, after which the region is implanted with a first dopant at a first doping concentration. Then a solid phase epitaxy regrowth step is performed on a thin layer of desired thickness of the amorphized region, in order to activate the first dopant only in this thin layer. Subsequently, a second dopant is implanted in the remaining amorphous region at a second doping concentration. Subsequent annealing of the substrate activates the second dopant only in said remaining region, so a very abrupt transition between dopant characteristics of the thin layer with first dopant and the region with the second dopant is obtained.

    摘要翻译: 公开了具有薄且明确限定的活化掺杂剂层的层状结构的半导体器件的方法。 在优选的方法中,半导体衬底中的区域是非晶化的,之后在第一掺杂浓度下注入第一掺杂剂区域。 然后在非晶形区域的所需厚度的薄层上进行固相外延再生步骤,以便仅在该薄层中激活第一掺杂剂。 随后,第二掺杂剂以第二掺杂浓度注入剩余的非晶区。 衬底的随后的退火仅在所述剩余区域中激活第二掺杂物,因此获得具有第一掺杂剂的薄层的掺杂剂特性与具有第二掺杂剂的区域之间的非常突然的转变。