公开(公告)号：US20090118843A1

公开(公告)日：2009-05-07

申请号：US12231012

申请日：2008-08-28

Applicant: Hafeezur Rahman ,  Rajesh Kumar Jain

Inventor： Hafeezur Rahman ,  Rajesh Kumar Jain

IPC: G05B6/00 ,  G06F3/048

CPC classification number: G05B23/0267 ,  G05B2219/31463 ,  G05B2219/35489 ,  G05B2219/37088

Abstract: The invention is a system for monitoring the status of a field device having data including a data acquisition module, a first and a second diagnosis engine, and a client having a user input element for receiving user input status.

Abstract translation: 本发明是用于监视具有包括数据采集模块，第一和第二诊断引擎以及具有用于接收用户输入状态的用户输入元件的客户端的数据的现场设备的状态的系统。

公开(公告)号：US07884024B2

公开(公告)日：2011-02-08

申请号：US11754466

申请日：2007-05-29

Applicant: Erwan Le Roy ,  Chun-Cheng Tsao ,  Theodore R. Lundquist ,  Rajesh Kumar Jain

Inventor： Erwan Le Roy ,  Chun-Cheng Tsao ,  Theodore R. Lundquist ,  Rajesh Kumar Jain

IPC: H01L21/302

CPC classification number: H01L21/3065 ,  H01J37/228 ,  H01J37/3056 ,  H01J2237/2482 ,  H01J2237/30466 ,  H01J2237/31749 ,  H01L22/12 ,  H01L22/26

Abstract: An apparatus and method for processing an integrated circuit employing optical interference fringes. During processing, one or more wavelength lights are directed on the integrated circuit and based upon the detection of interference fringes and characteristics of the same, further processing may be controlled. One implementation involves charged particle beam processing of an integrated circuit as function of detection and/or characteristics of interference fringes. A charged particle beam trench milling operation is performed in or on the substrate of an integrated circuit. Light is directed on the floor of the trench. Interference fringes may be formed from the constructive or destructive interference between the light reflected from the floor and the light from the circuit structures. Resulting fringes will be a function, in part, of the thickness and/or profile of the trench floor. Milling may be controlled as a function of the detected fringe patterns.

Abstract translation: 一种使用光学干涉条纹处理集成电路的装置和方法。 在处理期间，一个或多个波长的光被引导到集成电路上，并且基于干涉条纹和其特性的检测，可以控制进一步的处理。 一种实施方案涉及集成电路的带电粒子束处理，作为干涉条纹的检测和/或特征的函数。 在集成电路的衬底中或其上执行带电粒子束沟槽铣削操作。 光线指向沟槽的地板。 干涉条纹可以由从地板反射的光与来自电路结构的光之间的建构性或破坏性干扰形成。 所产生的条纹将部分地是沟槽地板的厚度和/或轮廓的函数。 作为检测到的条纹图案的函数可以控制铣削。

公开(公告)号：US08352050B2

公开(公告)日：2013-01-08

申请号：US12231012

申请日：2008-08-28

Applicant: Hafeezur Rahman ,  Rajesh Kumar Jain

Inventor： Hafeezur Rahman ,  Rajesh Kumar Jain

IPC: G05B6/00

CPC classification number: G05B23/0267 ,  G05B2219/31463 ,  G05B2219/35489 ,  G05B2219/37088

Abstract: The invention is a system for monitoring the status of a field device having data including a data acquisition module, a first and a second diagnosis engine, and a client having a user input element for receiving user input status.