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    PIPE ENGAGING AND LIFTING APPARATUS
    7.
    发明申请
    PIPE ENGAGING AND LIFTING APPARATUS 有权
    管接头和提升装置

    公开(公告)号：US20070164578A1

    公开(公告)日：2007-07-19

    申请号：US11565725

    申请日：2006-12-01

    申请人： Dean Gilliss ,  Randy Phillips

    发明人： Dean Gilliss ,  Randy Phillips

    IPC分类号： B66C1/62

    CPC分类号： B66C1/442

    摘要： A pipe clamping apparatus comprises a housing defining a pipe aperture with an open bottom. A jaw is pivotally attached inside the housing. When the jaw is in the open position, an upper portion of the jaw extends into the pipe aperture. In operation the top of the pipe contacts the upper portion of the jaw moving the upper portion of the jaw upward and moving a lower portion of the jaw laterally toward the housing to the closed position where the housing and the jaw are in close proximity to the pipe, and the bottom end of the left side portion is located under the pipe. When the jaw is in the closed position, a blocking member can be moved to a locked position to prevent the jaw from moving back toward the open position, and a lock indicator visibly indicates that the jaw is locked closed.

    摘要翻译： 管夹紧装置包括限定具有开口底部的管孔的壳体。 颚部枢转地附接在壳体内。 当钳口处于打开位置时，钳口的上部延伸到管孔中。 在操作中，管的顶部与钳口的上部接触，将钳口的上部向上移动并将钳口的下部侧向朝向壳体移动到关闭位置，在该位置处，壳体和钳口紧邻 管道，左侧部分的底端位于管道下方。 当钳口处于关闭位置时，阻挡构件可以移动到锁定位置，以防止钳口朝向打开位置移动，并且锁定指示器可视地表示钳口被锁定。

    Stress isolated MEMS structures and methods of manufacture
    10.
    发明授权
    Stress isolated MEMS structures and methods of manufacture 有权
    应力隔离的MEMS结构和制造方法

    公开(公告)号：US09010190B2

    公开(公告)日：2015-04-21

    申请号：US13451790

    申请日：2012-04-20

    申请人： David P. Potasek ,  John C. Christenson ,  Bruce H. Satterlund ,  Randy Phillips ,  Dave Holmquist

    发明人： David P. Potasek ,  John C. Christenson ,  Bruce H. Satterlund ,  Randy Phillips ,  Dave Holmquist

    IPC分类号： G01L7/08 ,  B81B7/00

    CPC分类号： B81B7/0048 ,  H01L2224/48147 ,  H01L2224/48472

    摘要： A MEMS pressure sensor may be manufactured to include a backing substrate having a diaphragm backing portion and a pedestal portion. A diaphragm substrate may be manufactured to include a pedestal portion and a diaphragm that is mounted to the diaphragm backing portion of the backing substrate to form a stress isolated MEMS die. The pedestal portions of the backing and diaphragm substrates form a pedestal of the stress isolated MEMS die. The pedestal is configured for isolating the diaphragm from stresses including packaging and mounting stress imparted on the stress isolated MEMS die.

    摘要翻译： 可以制造MEMS压力传感器以包括具有隔膜背衬部分和基座部分的背衬基板。 可以制造隔膜基板以包括基座部分和隔膜，该隔膜部分和隔膜安装到背衬基板的隔膜背衬部分上以形成应力隔离的MEMS管芯。 背衬和隔膜基板的基座部分形成应力隔离的MEMS管芯的基座。 基座被配置为隔离隔离应力，包括施加在应力隔离的MEMS管芯上的封装和安装应力。