公开(公告)号：US06220501B1

公开(公告)日：2001-04-24

申请号：US09169981

申请日：1998-10-13

申请人： Masahiro Tadauchi ,  Izuru Komatsu ,  Kouichi Teshima ,  Rikiya Katoh ,  Jun Sugimoto ,  Takayuki Suzuki ,  Mitsuyoshi Hirayama

发明人： Masahiro Tadauchi ,  Izuru Komatsu ,  Kouichi Teshima ,  Rikiya Katoh ,  Jun Sugimoto ,  Takayuki Suzuki ,  Mitsuyoshi Hirayama

IPC分类号： B23K120

CPC分类号： B23K35/262 ,  B23K35/3613 ,  C22C13/00 ,  H05K3/3463

摘要： Disclosed is a method of joining metallic members together. The metallic members are coated with an undercoat composed of an alloy of tin and zinc and contacted with each other through a mixture containing a solder comprising tin and zinc and a flux, while heating the metallic members to melt the solder. Then the molten solder is solidified to join the metallic members. Here, the ratio of zinc in the undercoat is represented by x (% by weight), the ratio of zinc in the solder is represented by y (% by weight), and the ratio, x, and the ratio, y, are values within an area enclosed by the line A or B in FIG. 1, which satisfies the formulas: 1≦x≦20, 3≦y≦13 and 3≦(x+y)/2≦13, or formulas: 0.1≦x≦25, 2≦y≦15 and 2≦(x+y)/2≦15.

摘要翻译： 公开了将金属构件连接在一起的方法。 金属构件涂覆有由锡和锌的合金构成的底涂层，并通过包含锡和锌的焊料和助熔剂的混合物彼此接触，同时加热金属构件以熔化焊料。 然后将熔融的焊料固化，以将金属构件接合。 这里，底涂层中的锌的比例由x（重量％）表示，焊料中的锌的比例由y（重量％）表示，x的比例和y的比例为y 在由图1中的线A或B包围的区域内。 1，其满足以下公式：1 <= x <= 20,3 <= y <= 13和3 <=（x + y）/ 2 <= 13或式：0.1 <= x <= 25,2 = y <= 15和2 <=（x + y）/ 2 <= 15。

公开(公告)号：US06503338B1

公开(公告)日：2003-01-07

申请号：US09559062

申请日：2000-04-28

申请人： Toshihiko Taguchi ,  Rikiya Katoh ,  Yoshitaka Toyoda

发明人： Toshihiko Taguchi ,  Rikiya Katoh ,  Yoshitaka Toyoda

IPC分类号： B23K35363

CPC分类号： B23K35/262

摘要： A lead-free solder alloy which has a relatively low melting temperature and which is suitable for soldering electronic devices consists essentially of from 5 to 9 mass % of Zn, from 2 to 15 mass % of Bi, optionally from 0.001 to 1 mass % of P or from 0.001 to 0.1 mass % of Ge, and a balance of Sn. The solder alloy has a liquidus temperature of at most 220° C.

摘要翻译： 具有相对低的熔融温度且适用于焊接电子器件的无铅焊料合金基本上由5〜9质量％的Zn，2〜15质量％的Bi，任选0.001〜1质量％ 或0.001〜0.1质量％的Ge，余量为Sn。 焊料合金的液相线温度至多为220℃

公开(公告)号：US6050480A

公开(公告)日：2000-04-18

申请号：US970203

申请日：1997-11-14

申请人： Toshihiko Taguchi ,  Rikiya Katoh ,  Osamu Munekata ,  Yoshitaka Toyoda

发明人： Toshihiko Taguchi ,  Rikiya Katoh ,  Osamu Munekata ,  Yoshitaka Toyoda

IPC分类号： B23K35/22 ,  B23K35/02 ,  B23K35/26 ,  B23K35/36 ,  B23K35/363 ,  C22C13/00 ,  H05K3/34 ,  B23K31/00 ,  B23K31/02

CPC分类号： C22C13/00 ,  B23K35/025 ,  B23K35/262 ,  B23K35/3613

摘要： A solder paste suitable for use in reflow soldering of chip components having good soldering properties without causing tombstoning comprises a solder powder admixed with a viscous flux. The solder powder is comprised of a twin peak solder alloy consisting essentially, on a weight basis, of: 60-65% Sn, 0.1-0.6% Ag, 0.1-2% Sb, and a balance of Pb, and having a liquidus temperature below 200.degree. C.

摘要翻译： 适合用于回流焊接具有良好焊接性能而不引起墓碑的焊膏包括与粘性助熔剂混合的焊料粉末。 焊料粉末由双峰焊料合金组成，其基本上以重量计包含：60-65％Sn，0.1-0.6％Ag，0.1-2％Sb和余量的Pb，并具有液相线温度 低于200℃

公开(公告)号：US06554180B1

公开(公告)日：2003-04-29

申请号：US09637922

申请日：2000-08-14

申请人： Rikiya Katoh ,  Osamu Munekata ,  Yoshitaka Toyoda

发明人： Rikiya Katoh ,  Osamu Munekata ,  Yoshitaka Toyoda

IPC分类号： B23K35363

CPC分类号： B23K35/262 ,  B23K35/025 ,  B23K2101/42 ,  H05K3/3442 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/10636 ,  Y02P70/611

摘要： A lead-free solder paste suitable for soldering chip parts includes a powder of a twin-peak Sn-based solder alloy containing 0.2-1.0 mass % of Ag and a flux. The solder alloy has a first peak of heat absorption in a differential scanning calorimeter curve at the start of melting and a second peak when the major portion of the alloy subsequently melts.

摘要翻译： 适用于焊接芯片部件的无铅焊膏包括含有0.2-1.0质量％的Ag和焊剂的双峰Sn基焊料合金的粉末。 焊料合金在熔化开始时在差示扫描量热仪曲线中具有第一吸热峰值，而当合金的主要部分随后熔化时，第二峰值。