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公开(公告)号:US4160893A
公开(公告)日:1979-07-10
申请号:US865768
申请日:1977-12-29
CPC分类号: H01L24/81 , B23K1/0053 , H01L24/75 , H01L24/80 , H01L2224/75 , H01L2224/75283 , H01L2224/75301 , H01L2224/75302 , H01L2224/75745 , H01L2224/75981 , H01L2224/8123 , H01L2224/81801 , H01L2924/01023 , H01L2924/01033 , H01L2924/01039 , H01L2924/01077 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/3025
摘要: An individual chip joining machine is designed primarily to bond a single chip to a multi-chip substrate. The machine includes an X-Y table for moving a substrate to locate a chip site beneath a probe. The probe serves to pick up a chip and either place it on the substrate or remove it therefrom and further serves to heat the chip to join it to the substrate by solder reflow or to melt the solder and allow the chip to be removed. The probe is mounted on a Z direction placement mechanism that also includes means to allow the probe to be backed off a fixed distance from a chip, once the chip has been placed on the substrate preparatory to joining thereto. A second heater heats the substrate to a bias temperature, this heating being controlled through use of a surrogate substrate having a thermocouple attached thereto.
摘要翻译: {PG,1单个芯片接合机主要设计为将单个芯片连接到多芯片基板。 该机器包括用于移动衬底以在探针下方定位芯片位置的X-Y工作台。 探头用于拾取芯片并将其放置在基板上或将其从中移除,并进一步用于加热芯片以通过焊料回流将其连接到基板,或熔化焊料并允许芯片被去除。 探针安装在Z方向放置机构上,一旦芯片已经放置在准备连接到其上的基板上,该Z方向放置机构还包括允许探针从芯片背离固定距离的装置。 第二加热器将基板加热至偏压温度,该加热通过使用附接有热电偶的替代基板进行控制。