摘要:
Devices, methods, and systems for wafer bonding are described herein. One or more embodiments include forming a bond between a first wafer and a second wafer using a first material adjacent the first wafer and a second material adjacent the second wafer. The first material includes a layer of gold (Au) and a layer of indium (In), and the second material includes a layer of Au. Forming the bond between the first wafer and the second wafer includes combining the layer of Au in the first material, the layer of In in the first material, and a portion of the layer of Au in the second material, wherein an additional portion of the layer of Au in the second material is not combined with the layer of Au in the first material and the layer of In in the first material.
摘要:
The present disclosure includes sensing device embodiments. One sensing device includes a heater layer, a resistance detector layer, constructed and arranged to indicate a temperature value based upon a correlation to a detected resistance value, an electrode layer, and a sensing layer.
摘要:
An apparatus includes an antenna having multiple conductive portions. The apparatus also includes a transducer electrically coupling the conductive portions of the antenna. The transducer includes a first conductive path electrically coupled to one of the conductive portions and a second conductive path electrically coupled to the first conductive path and to another of the conductive portions. The first and second conductive paths at least partially overlap along at least a substantial portion of their lengths, where the overlap occurs in a direction perpendicular to a plane of the antenna portions.
摘要:
A thermal pump for moving a sample fluid to and through an analyzer. The pump may have a lack of moving mechanical parts when pumping except for check valves. The thermal pump may have in lieu of each mechanical check valve a thermal or fluid mechanism that effectively operates as a valve without mechanical parts. The present thermal pump may be fabricated with MEMS technology. The pump may be integrated into a concentrator and/or separator of a fluid analyzer chip.
摘要:
A three-wafer channel or column structure for a fluid analyzer. The structure may have a support member, membrane, or support wafer containing heaters and interactive elements. The membrane may have a channel of one wafer facing the interactive element side and a space of another wafer facing the other side. The membrane may have perforations to equalize the pressures on both sides of the membrane. A detector in the membrane may have exposure to both the channel and space for good sensitivity, as the sample may be on both sides of the membrane. The wafers may be bonded with a thin film of non-flowing viscous material. Capillaries may be attached to an inlet and outlet of the channel and be parallel to an elongated dimension of the channel.
摘要:
A chemical impedance detector having several electrodes situated on or across a dielectric layer of a substrate. The electrodes may be across or covered with a thin film polymer. Each electrode may have a set of finger-like electrodes. Each set of finger-like electrodes may be intermeshed, but not in contact, with another set of finger-like electrodes. The thin-film polymer may have a low dielectric constant and a high porous surface area. The chemical impedance detector may be incorporated in a micro fluid analyzer system.
摘要:
A flow sensor is provided having a substrate with a sensing element and flow channel over the sensing element. The sensing element senses at least one property of a fluid. The flow channel is configured such that tilting the flow sensor does not have a significant effect on the measured signal. A device for measuring tilt in a system having a fluid flow path is also provided.
摘要:
A thermal sensor structure having one level for an infrared detecting pixel including the sensor associated electronics. The electronics displace a small area thereby having little effect on the fill area of the pixel relative to a level having no pixel electronics. That level has thermally isolation for the substrate through the limited structural attachment to the substrate because of the access vias to the silicon. It has additional isolation because of a pit of removed silicon from the substrate below that one level. The thermal sensor may have an array with a large number of pixels having the one level for the pixels and electronics structure.
摘要:
Devices, methods, and systems relating to infrared imager devices, methods for providing infrared imagers, methods of operating infrared imagers, and infrared imager systems are disclosed. An infrared imager system includes a number of lenses, a beam splitter, an imager array, and a thermo-optical array, wherein the beam splitter directs light to the imaging array and to the thermo-optical array.
摘要:
Devices, methods, and systems for wafer bonding are described herein. One or more embodiments include forming a bond between a first wafer and a second wafer using a first material adjacent the first wafer and a second material adjacent the second wafer. The first material includes a layer of gold (Au) and a layer of indium (In), and the second material includes a layer of Au. Forming the bond between the first wafer and the second wafer includes combining the layer of Au in the first material, the layer of In in the first material, and a portion of the layer of Au in the second material, wherein an additional portion of the layer of Au in the second material is not combined with the layer of Au in the first material and the layer of In in the first material.