摘要:
According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.
摘要:
Disclosed is a storage system. A network interface device (NIC) receives network storage commands from a host. The NIC may cache the data to/from the storage commands in a solid-state disk. The NIC may respond to future network storage command by supplying the data from the solid-state disk rather than initiating a network transaction.
摘要:
There is provided a system and method for a copper stud bump wafer level package. There is provided a semiconductor package comprising a semiconductor die having a plurality of bond pads on an top surface thereof, a plurality of metallic stud bumps mechanically and electrically coupled to said plurality of bond pads, and a plurality of solder balls mechanically and electrically coupled to said plurality of metallic stud bumps. Advantageously, the metallic stud bumps may be provided using standard wirebonding equipment, avoiding the conventional wafer level package requirement for photolithography and deposition steps to provide a multi-layer metallic routing structure. As a result, reduced cycle times, lower cost, and reduced complexity may be provided. Alternative fabrication processes utilizing metallic stud bumps may also support multi-die packages with dies from different wafers and packages with die perimeter pads wirebonded to substrates.
摘要:
There is provided a system and method for a spot plated leadframe and an IC bond pad via array design for copper wire. There is provided a semiconductor package comprising a leadframe having a pre-plated finish and a spot plating on said pre-plated finish, a semiconductor die including a bond pad on a top surface thereof, and a copper wire bonded to said spot plating and to said bond pad. Optionally, a novel corner via array design may be provided under the bond pad for improved package performance while maintaining the integrity of the copper wire bond. The semiconductor package may provide several advantages including high MSL ratings, simplified assembly cycles, avoidance of tin whisker issues, and low cost compared to conventional packages using gold wire bonds.
摘要:
A power management circuit is provided for a data storage device that is adapted for communicating with a host via an interface circuit. The power management circuit is responsive to a utilization of a control circuit of the data storage device, determined independently of the communication between the data storage device and the host, in providing a supply power to the data storage device. A method is provided comprising connecting a data storage device with a host via an interface circuit; sending data transfer commands from the host to the interface circuit; and monitoring the utilization of a control circuit of the data storage device in terms of the rate at which commands are processed by the control circuit for use in selectively providing a supply power to the data storage device.
摘要:
Various embodiments of the present invention provide systems, methods and circuits for memory utilization. As one example, a memory system is disclosed that includes a memory bank and a memory access controller circuit. The memory bank includes a number of default memory cells and a number of redundant memory cells. The memory access controller circuit is operable to access a usable memory space including both the combined default memory cells and the redundant memory cells.
摘要:
Various embodiments of the present invention provide systems and methods for managing solid state drives. As an example, a storage system is described that include at least a first flash memory block and a second flash memory block, and a control circuit. The first flash memory block and the second flash memory block are addressable in the storage system. The control circuit is operable to identify the first flash memory block as partially failed, receive a write request directed to the first flash memory block; and direct the write request to the second flash memory block.
摘要:
Various embodiments of the present invention provide systems and methods for managing solid state drives. As an example, a storage system is described that include at least a first flash memory block and a second flash memory block, and a control circuit. The first flash memory block and the second flash memory block are addressable in the storage system. The control circuit is operable to identify the first flash memory block as partially failed, receive a write request directed to the first flash memory block; and direct the write request to the second flash memory block.
摘要:
Disclosed is a method and apparatus for testing devices that will be connected to a computer storage media device by generating a complex test waveform that emulates operation of the computer storage media device using at least one Graphics Processing Unit (GPU) and applying the generated complex test waveform to the device(s) being tested. The complex test waveform may be generated by calculating a plurality of discrete individual portions of the complex test waveform in parallel, in real-time, and continuously using the parallel processing features of the GPU(s). The discrete individual portions of the complex test waveform may be representative of various characteristics of the emulated computer storage media device operation such as operational characteristics of the computer storage media device, environmental effects on the computer storage media device, application of filters to the computer storage media device signal, etc. Various embodiments may generate the base data signal waveform from the emulated computer storage device such that the entire complex test waveform is calculated. Other embodiments may use a pre-existing base data signal waveform provided from another source and modify/alter the pre-existing base data signal waveform to generate the complex test waveform. When available, one or more Central Processing Units (CPUs) and/or CPU cores may also perform calculations in parallel with the calculations performed by the GPU(s).
摘要:
Various embodiments of the present invention provide systems, methods and circuits for memories and utilization thereof. As one example, a memory system is disclosed that includes a non-volatile memory, a flash memory, and a read/write controller circuit. The read/write controller circuit is coupled to both the flash memory and the non-volatile memory, and is operable to receive a data set directed to the flash memory and to direct the data set to the random access memory.