公开(公告)号：US20130147020A1

公开(公告)日：2013-06-13

申请号：US13701277

申请日：2011-04-13

申请人： Julian Gonska ,  Jens Frey ,  Heribert Weber ,  Eckhard Graf ,  Roman Schlosser

发明人： Julian Gonska ,  Jens Frey ,  Heribert Weber ,  Eckhard Graf ,  Roman Schlosser

IPC分类号： H01L23/48 ,  H01L21/768

CPC分类号： H01L23/481 ,  B81B2203/033 ,  B81B2207/095 ,  B81C1/00095 ,  H01L21/76837 ,  H01L23/04 ,  H01L2224/48463 ,  H01L2924/1461 ,  H01L2924/00

摘要： An advantageous method and system for realizing electrically very reliable and mechanically extremely stable vias for components whose functionality is realized in a layer construction on a conductive substrate. The via (Vertical Interconnect Access), which is led to the back side of the component and which is used for the electrical contacting of functional elements realized in the layer construction, includes a connection area in the substrate that extends over the entire thickness of the substrate and is electrically insulated from the adjoining substrate by a trench-like insulating frame likewise extending over the entire substrate thickness. According to the present system, the trench-like insulating frame is filled up with an electrically insulating polymer.

摘要翻译： 一种有利的方法和系统，用于实现电气非常可靠和机械上非常稳定的通孔，用于在导电基底上的层结构中实现其功能的部件。 被引导到部件的背面并用于在层结构中实现的功能元件的电接触的通孔（垂直互连访问）包括在基板中的连接区域，该连接区域在整个厚度 并且通过类似于整个基板厚度延伸的沟槽状绝缘框架与邻接的基板电绝缘。 根据本系统，沟槽状绝缘框架填充有电绝缘聚合物。

公开(公告)号：US08975118B2

公开(公告)日：2015-03-10

申请号：US13701277

申请日：2011-04-13

申请人： Julian Gonska ,  Jens Frey ,  Heribert Weber ,  Eckhard Graf ,  Roman Schlosser

发明人： Julian Gonska ,  Jens Frey ,  Heribert Weber ,  Eckhard Graf ,  Roman Schlosser

IPC分类号： H01L27/088 ,  H01L23/48 ,  B81C1/00 ,  H01L21/768

CPC分类号： H01L23/481 ,  B81B2203/033 ,  B81B2207/095 ,  B81C1/00095 ,  H01L21/76837 ,  H01L23/04 ,  H01L2224/48463 ,  H01L2924/1461 ,  H01L2924/00

摘要： An advantageous method and system for realizing electrically very reliable and mechanically extremely stable vias for components whose functionality is realized in a layer construction on a conductive substrate. The via (Vertical Interconnect Access), which is led to the back side of the component and which is used for the electrical contacting of functional elements realized in the layer construction, includes a connection area in the substrate that extends over the entire thickness of the substrate and is electrically insulated from the adjoining substrate by a trench-like insulating frame likewise extending over the entire substrate thickness. According to the present system, the trench-like insulating frame is filled up with an electrically insulating polymer.

摘要翻译： 一种有利的方法和系统，用于实现电气非常可靠和机械上非常稳定的通孔，用于在导电基底上的层结构中实现其功能的部件。 被引导到部件的背面并用于在层结构中实现的功能元件的电接触的通孔（垂直互连访问）包括在基板中的连接区域，该连接区域在整个厚度 并且通过类似于整个基板厚度延伸的沟槽状绝缘框架与邻接的基板电绝缘。 根据本系统，沟槽状绝缘框架填充有电绝缘聚合物。

公开(公告)号：US07902615B2

公开(公告)日：2011-03-08

申请号：US12084477

申请日：2006-11-14

申请人： Roman Schlosser ,  Stefan Weiss ,  Frank Fischer ,  Christoph Schelling

发明人： Roman Schlosser ,  Stefan Weiss ,  Frank Fischer ,  Christoph Schelling

IPC分类号： H01L29/84 ,  H04R19/00

CPC分类号： H04R19/005

摘要： A micromechanical structure and a method for producing a micromechanical structure are provided, the micromechanical structure being configured for receiving and/or generating acoustic signals in a medium at least partially surrounding the structure. The structure includes a first counterelement that has first openings and essentially forms a first side of the structure, a second counterelement that has second openings and essentially forms a second side of the structure, and an essentially closed diaphragm disposed between the first counterelement and the second counterelement.

摘要翻译： 提供微机械结构和用于产生微机械结构的方法，所述微机械结构被配置为在至少部分地围绕所述结构的介质中接收和/或产生声信号。 该结构包括具有第一开口并且基本上形成该结构的第一侧面的第一反应体，具有第二开口并且基本上形成该结构的第二侧的第二反应体，以及设置在该第一反应体和该第二反应器之间的基本封闭的隔膜 反数

公开(公告)号：US20100002543A1

公开(公告)日：2010-01-07

申请号：US12084477

申请日：2006-11-14

申请人： Roman Schlosser ,  Stefan Weiss ,  Frank Fischer ,  Christoph Schelling

发明人： Roman Schlosser ,  Stefan Weiss ,  Frank Fischer ,  Christoph Schelling

IPC分类号： H04R19/00

CPC分类号： H04R19/005

摘要： A micromechanical structure and a method for producing a micromechanical structure are provided, the micromechanical structure being configured for receiving and/or generating acoustic signals in a medium at least partially surrounding the structure. The structure includes a first counterelement that has first openings and essentially forms a first side of the structure, a second counterelement that has second openings and essentially forms a second side of the structure, and an essentially closed diaphragm disposed between the first counterelement and the second counterelement.

摘要翻译： 提供微机械结构和用于产生微机械结构的方法，所述微机械结构被配置为在至少部分地围绕所述结构的介质中接收和/或产生声信号。 该结构包括具有第一开口并且基本上形成该结构的第一侧面的第一反应体，具有第二开口并且基本上形成该结构的第二侧的第二反应体，以及设置在该第一反应体和该第二反应器之间的基本封闭的隔膜 反数

公开(公告)号：US20120038030A1

公开(公告)日：2012-02-16

申请号：US13198651

申请日：2011-08-04

申请人： Jens Frey ,  Heribert Weber ,  Eckhard Graf ,  Roman Schlosser

发明人： Jens Frey ,  Heribert Weber ,  Eckhard Graf ,  Roman Schlosser

IPC分类号： H01L29/41 ,  H01L21/762 ,  H01L29/06

CPC分类号： H01L21/76898 ,  H01L21/02118 ,  H01L21/02318 ,  H01L21/486 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method is described for filling cavities in wafers, the cavities being open to a predetermined surface of the wafer, including the following steps: applying a lacquer-like filling material to the predetermined surface of the wafer; heating the wafer at a first temperature; driving out gas bubbles enclosed in the filling material by heating the wafer under vacuum at a second temperature which is equal to or higher than the first temperature; and curing the filling material by heating the wafer at a third temperature which is higher than the second temperature. Furthermore, also described is a blind hole filled using such a method and general 3D cavities as well as a wafer having insulation trenches of a silicon via filled using such a method.

摘要翻译： 描述了一种用于在晶片中填充空腔的方法，空腔朝向晶片的预定表面开放，包括以下步骤：将漆状填充材料施加到晶片的预定表面; 在第一温度下加热晶片; 通过在等于或高于第一温度的第二温度下在真空下加热晶片来驱除封闭在填充材料中的气泡; 以及通过在高于第二温度的第三温度下加热晶片来固化填充材料。 此外，还描述了使用这种方法和一般3D空腔填充的盲孔以及具有使用这种方法填充的硅通孔的绝缘沟槽的晶片。

公开(公告)号：US08647961B2

公开(公告)日：2014-02-11

申请号：US13198651

申请日：2011-08-04

申请人： Jens Frey ,  Heribert Weber ,  Eckhard Graf ,  Roman Schlosser

发明人： Jens Frey ,  Heribert Weber ,  Eckhard Graf ,  Roman Schlosser

IPC分类号： H01L21/76

CPC分类号： H01L21/76898 ,  H01L21/02118 ,  H01L21/02318 ,  H01L21/486 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method is described for filling cavities in wafers, the cavities being open to a predetermined surface of the wafer, including the following steps: applying a lacquer-like filling material to the predetermined surface of the wafer; heating the wafer at a first temperature; driving out gas bubbles enclosed in the filling material by heating the wafer under vacuum at a second temperature which is equal to or higher than the first temperature; and curing the filling material by heating the wafer at a third temperature which is higher than the second temperature. Furthermore, also described is a blind hole filled using such a method and general 3D cavities as well as a wafer having insulation trenches of a silicon via filled using such a method.

摘要翻译： 描述了一种用于在晶片中填充空腔的方法，空腔朝向晶片的预定表面开放，包括以下步骤：将漆状填充材料施加到晶片的预定表面; 在第一温度下加热晶片; 通过在等于或高于第一温度的第二温度下在真空下加热晶片来驱除封闭在填充材料中的气泡; 以及通过在高于第二温度的第三温度下加热晶片来固化填充材料。 此外，还描述了使用这种方法和一般3D空腔填充的盲孔以及具有使用这种方法填充的硅通孔的绝缘沟槽的晶片。

公开(公告)号：US08207585B2

公开(公告)日：2012-06-26

申请号：US12300544

申请日：2007-04-03

申请人： Roman Schlosser ,  Heribert Weber ,  Christoph Schelling

发明人： Roman Schlosser ,  Heribert Weber ,  Christoph Schelling

IPC分类号： H01L29/84

CPC分类号： B81C1/00158 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2203/0127 ,  H04R19/04 ,  Y10T428/24802

摘要： A method is provided for producing a micromechanical component and a micromechanical component is provided, particularly a microphone, a micro-loudspeaker or a pressure sensor (an absolute pressure sensor or a relative pressure sensor) having a substrate and having a diaphragm pattern, for the production of the diaphragm pattern, process steps being provided that are compatible only with a circuit that is monolithically integrated into or on the substrate, a sacrificial pattern applied onto the substrate being removed for the production of the diaphragm pattern.

摘要翻译： 提供了一种用于制造微机械部件并提供微机械部件的方法，特别是麦克风，具有基板并具有光阑图案的微型扬声器或压力传感器（绝对压力传感器或相对压力传感器），用于 膜片图案的生产，仅提供与单片集成到基板中或基板上的电路相兼容的工艺步骤，施加到基板上的牺牲图案被去除以用于生产隔膜图案。

公开(公告)号：US20090162619A1

公开(公告)日：2009-06-25

申请号：US12300544

申请日：2007-04-03

申请人： Roman Schlosser ,  Heribert Weber ,  Christoph Schelling

发明人： Roman Schlosser ,  Heribert Weber ,  Christoph Schelling

IPC分类号： B32B5/02 ,  B44C1/22

CPC分类号： B81C1/00158 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2203/0127 ,  H04R19/04 ,  Y10T428/24802

摘要： A method is provided for producing a micromechanical component and a micromechanical component is provided, particularly a microphone, a micro-loudspeaker or a pressure sensor (an absolute pressure sensor or a relative pressure sensor) having a substrate and having a diaphragm pattern, for the production of the diaphragm pattern, process steps being provided that are compatible only with a circuit that is monolithically integrated into or on the substrate, a sacrificial pattern applied onto the substrate being removed for the production of the diaphragm pattern.

摘要翻译： 提供了一种用于制造微机械部件并提供微机械部件的方法，特别是麦克风，具有基板并具有光阑图案的微型扬声器或压力传感器（绝对压力传感器或相对压力传感器），用于 膜片图案的生产，仅提供与单片集成到基板中或基板上的电路相兼容的工艺步骤，施加到基板上的牺牲图案被去除以用于生产隔膜图案。