Thermal conditioning plate with gas gap leak
    1.
    发明申请
    Thermal conditioning plate with gas gap leak 审中-公开
    带有气隙泄漏的热调节板

    公开(公告)号:US20070077354A1

    公开(公告)日:2007-04-05

    申请号:US11241795

    申请日:2005-09-30

    IPC分类号: C23C16/00 C23C14/00 B05C11/00

    CPC分类号: H01L21/67109 H01L21/67248

    摘要: Methods and apparatus enable thermal conditioning of a substrate in a vacuum chamber that is evacuated to a high vacuum pressure. The substrate rests on a thermally controlled support that defines a cavity area between an underside of the substrate and a recessed section of the support. A fence of the support bounds the recessed section and limits flow of a gas injected into the cavity area into an interior region of the vacuum chamber where the support and substrate are disposed. Accordingly, a pressure differential exists between the cavity area and the interior region of the vacuum chamber. This relatively higher pressure in the cavity area enables heat transfer between the support and substrate via the gas in the cavity area in order to adjust the temperature of the substrate.

    摘要翻译: 方法和装置能够将真空室中的衬底进行热调节,真空室被抽真空至高真空压力。 基板搁置在热控支撑件上,该支撑件限定了基板的下侧和支撑件的凹陷部分之间的空腔区域。 支撑体的围栏限定了凹陷部分,并且将注入到空腔区域中的气体的流动限制在设置有支撑件和基板的真空室的内部区域中。 因此,在空腔区域和真空室的内部区域之间存在压差。 空腔区域中相对较高的压力使得能够通过空腔区域中的气体在载体和基板之间传热,以便调节基板的温度。

    SUBSTRATE SUPPORT ASSEMBLY WITH THERMAL ISOLATING PLATE
    2.
    发明申请
    SUBSTRATE SUPPORT ASSEMBLY WITH THERMAL ISOLATING PLATE 失效
    基板支撑组件与热隔离板

    公开(公告)号:US20070157886A1

    公开(公告)日:2007-07-12

    申请号:US11537163

    申请日:2006-09-29

    IPC分类号: C23C16/00 C23F1/00

    CPC分类号: G03F7/70875 G03F7/70716

    摘要: Embodiments of the invention generally provide a substrate support assembly. In one embodiment, a substrate support assembly includes a substrate support plate, a thermal regulating plate coupled in a spaced-apart relation to the substrate support plate and a main actuator coupled in a spaced-apart relation to the thermal regulating plate. The main actuator is adapted to move the substrate support plate laterally. The substrate support assembly is configured to limit the thermal influence of the main actuator on a substrate positioned on the substrate support plate.

    摘要翻译: 本发明的实施例通常提供一种基板支撑组件。 在一个实施例中,衬底支撑组件包括衬底支撑板,与衬底支撑板以间隔开的关系联接的热调节板和与热调节板以间隔开的关系联接的主致动器。 主致动器适于横向地移动基板支撑板。 衬底支撑组件被配置为限制主致动器对位于衬底支撑板上的衬底的热影响。

    Substrate support assembly with thermal isolating plate
    3.
    发明授权
    Substrate support assembly with thermal isolating plate 失效
    带隔热板的基板支撑组件

    公开(公告)号:US07470919B2

    公开(公告)日:2008-12-30

    申请号:US11537163

    申请日:2006-09-29

    IPC分类号: C23C16/00 C23F1/00 H01L21/00

    CPC分类号: G03F7/70875 G03F7/70716

    摘要: Embodiments of the invention generally provide a substrate support assembly. In one embodiment, a substrate support assembly includes a substrate support plate, a thermal regulating plate coupled in a spaced-apart relation to the substrate support plate and a main actuator coupled in a spaced-apart relation to the thermal regulating plate. The main actuator is adapted to move the substrate support plate laterally. The substrate support assembly is configured to limit the thermal influence of the main actuator on a substrate positioned on the substrate support plate.

    摘要翻译: 本发明的实施例通常提供一种基板支撑组件。 在一个实施例中,衬底支撑组件包括衬底支撑板,与衬底支撑板以间隔开的关系联接的热调节板和与热调节板以间隔开的关系联接的主致动器。 主致动器适于横向地移动基板支撑板。 衬底支撑组件被配置为限制主致动器对位于衬底支撑板上的衬底的热影响。