Light emitting device including lead having terminal part and exposed part, and method for manufacturing the same
    1.
    发明授权
    Light emitting device including lead having terminal part and exposed part, and method for manufacturing the same 有权
    包括具有端子部分和暴露部分的引线的发光器件及其制造方法

    公开(公告)号:US09159893B2

    公开(公告)日:2015-10-13

    申请号:US13820372

    申请日:2011-09-01

    申请人: Ryohei Yamashita

    发明人: Ryohei Yamashita

    IPC分类号: H01L33/48 H01L33/62 H01S5/022

    摘要: A light emitting device includes a substantially cuboid package made up of a molded article and a lead that is embedded in the molded article, and a light emitting element that is installed in the package. The lead has a connector where the light emitting element is installed, and a terminal part and an exposed part that are linked to the connector. The package has a bottom face, a front face that is a light emission face contiguous with the bottom face, and a rear face that is contiguous with the bottom face and is opposite the front face. The first terminal part and the exposed part are linked to the rear face side of the connector are exposed from the molded article and contiguous with the bottom face and the rear face, and are isolated at the bottom face.

    摘要翻译: 发光装置包括由模制品和嵌入在模制品中的引线构成的基本上为长方体的封装,以及安装在封装中的发光元件。 引线具有安装发光元件的连接器,以及连接到连接器的端子部分和暴露部分。 该封装具有底面,与该底面相邻的发光面的前面以及与该底面相邻且与该前表面相对的后表面。 连接到连接器的后表面的第一端子部分和暴露部分从模制品暴露并与底面和后表面相邻,并且在底面处被隔离。

    LIGHT EMITTING DEVICE, AND PACKAGE ARRAY FOR LIGHT EMITTING DEVICE
    2.
    发明申请
    LIGHT EMITTING DEVICE, AND PACKAGE ARRAY FOR LIGHT EMITTING DEVICE 有权
    发光装置和用于发光装置的包装阵列

    公开(公告)号:US20130153952A1

    公开(公告)日:2013-06-20

    申请号:US13820350

    申请日:2011-09-01

    IPC分类号: H01L33/38 H05K1/03

    摘要: A light emitting device includes a substantially cuboid package and a light emitting element. The package is made up of a molded article, and first and second leads each embedded in the molded article. The first lead has a first terminal component exposed at the boundary between a first side face, a bottom face, and a rear face contiguous with the bottom face and opposite a light emission face. The second lead has a second terminal component exposed at the boundary between a second side face opposite the first side face, the bottom face, and the rear face. The first terminal component has a first terminal concavity whose opening is contiguous with the first side face, the bottom face, and the rear face. The second terminal component has a second terminal concavity whose opening is contiguous with the second side face, the bottom face, and the rear face.

    摘要翻译: 发光器件包括基本上为长方体的封装和发光元件。 包装由模制品和每个嵌入模制品中的第一和第二引线组成。 第一引线具有暴露在第一侧面,底面和与底面相邻并与发光面相对的后表面之间的边界处的第一端子部件。 第二引线具有在与第一侧面,底面和后面相对的第二侧面之间的边界处露出的第二端子部件。 第一端子部件具有第一端子凹部,其第一端子凹部的开口与第一侧面,底面和后表面相邻。 第二端子部件具有开口与第二侧面,底面和后面邻接的第二端子凹部。

    LIGHT EMITTING DEVICE, CIRCUIT BOARD, PACKAGING ARRAY FOR LIGHT EMITTING DEVICE, AND METHOD FOR MANUFACTURING PACKAGING ARRAY FOR LIGHT EMITTING DEVICE
    3.
    发明申请
    LIGHT EMITTING DEVICE, CIRCUIT BOARD, PACKAGING ARRAY FOR LIGHT EMITTING DEVICE, AND METHOD FOR MANUFACTURING PACKAGING ARRAY FOR LIGHT EMITTING DEVICE 有权
    发光装置,电路板,用于发光装置的包装阵列,以及用于制造用于发光装置的包装阵列的方法

    公开(公告)号:US20130153942A1

    公开(公告)日:2013-06-20

    申请号:US13820322

    申请日:2011-09-01

    申请人: Ryohei Yamashita

    发明人: Ryohei Yamashita

    IPC分类号: H01L33/62

    摘要: A light emitting device includes a light emitting element and a package. The package is made up of a molded article and a lead that is embedded in the molded article. The lead includes a mounting part on which the light emitting element is mounted, a terminal part that is linked to the mounting part, and an exposed part. The package has a front face that is a light emitting face, a rear face opposite the front face, and a bottom face contiguous with the front face and the rear face. The light emitting element is mounted on the front face side of the mounting part. The exposed part is linked to the rear face side of the mounting part, and is exposed from the molded article at the bottom face and the rear face. The terminal part is exposed from the molded article at the bottom face.

    摘要翻译: 发光器件包括发光元件和封装。 包装由模制品和嵌入模制品中的铅组成。 引线包括安装有发光元件的安装部,连接到安装部的端子部和露出部。 该封装具有作为发光面的前表面,与前表面相对的后表面和与前表面和后表面相邻的底面。 发光元件安装在安装部的正面侧。 露出部分与安装部分的背面侧相连,并在底面和背面从模制品露出。 端子部分在底面处被模制品暴露。

    LIGHT EMITTING DEVICE PROVIDED WITH LENS FOR CONTROLLING LIGHT DISTRIBUTION CHARACTERISTIC
    4.
    发明申请
    LIGHT EMITTING DEVICE PROVIDED WITH LENS FOR CONTROLLING LIGHT DISTRIBUTION CHARACTERISTIC 有权
    用于控制光分配特性的光源提供的发光装置

    公开(公告)号:US20090231833A1

    公开(公告)日:2009-09-17

    申请号:US12473121

    申请日:2009-05-27

    IPC分类号: F21V9/16

    摘要: The light emitting device comprises a substrate (2), a positive electrode (6) and a negative electrode (4) formed on the substrate (2), a light emitting diode (8) connected to the positive electrode (6) and the negative electrode (4), the transparent resin (12 and 14) that covers the light emitting diode (8), a fluorescent material (16) that absorbs at least part of light emitted by the light emitting diode (8) and converts it to light of longer wavelength, and the lens that changes the direction of light emission from the light emitting diode (8) and/or the fluorescent material (16). The resin (12 and 14) includes the fluorescent material (16) and is formed so as to constitute the lens of substantially semi-cylindrical shape, and the fluorescent material (16) included in the resin (12 and 14) is distributed with a higher concentration in a region near the surface of the light emitting diode (8) than in a region near the surface of the portion that constitutes the lens.

    摘要翻译: 发光装置包括:基板(2),形成在基板(2)上的正极(6)和负极(4);与正极(6)连接的发光二极管(8) 电极(4),覆盖发光二极管(8)的透明树脂(12和14),吸收由发光二极管(8)发射的光的至少一部分并将其转换为光的荧光材料(16) 以及改变来自发光二极管(8)和/或荧光材料(16)的发光方向的透镜。 树脂(12和14)包括荧光材料(16)并且形成为构成大致半圆柱形状的透镜,并且包含在树脂(12和14)中的荧光材料(16)分布在 在发光二极管(8)的表面附近的区域中比在构成透镜的部分的表面附近的区域更高的浓度。

    Light emitting device, and package array for light emitting device
    5.
    发明授权
    Light emitting device, and package array for light emitting device 有权
    发光器件和发光器件的封装阵列

    公开(公告)号:US09461207B2

    公开(公告)日:2016-10-04

    申请号:US13820350

    申请日:2011-09-01

    摘要: A light emitting device includes a substantially cuboid package and a light emitting element. The package is made up of a molded article, and first and second leads each embedded in the molded article. The first lead has a first terminal component exposed at the boundary between a first side face, a bottom face, and a rear face contiguous with the bottom face and opposite a light emission face. The second lead has a second terminal component exposed at the boundary between a second side face opposite the first side face, the bottom face, and the rear face. The first terminal component has a first terminal concavity whose opening is contiguous with the first side face, the bottom face, and the rear face. The second terminal component has a second terminal concavity whose opening is contiguous with the second side face, the bottom face, and the rear face.

    摘要翻译: 发光器件包括基本上为长方体的封装和发光元件。 包装由模制品和每个嵌入模制品中的第一和第二引线组成。 第一引线具有暴露在第一侧面,底面和与底面相邻并与发光面相对的后表面之间的边界处的第一端子部件。 第二引线具有在与第一侧面,底面和后面相对的第二侧面之间的边界处露出的第二端子部件。 第一端子部件具有第一端子凹部,其第一端子凹部的开口与第一侧面,底面和后表面相邻。 第二端子部件具有开口与第二侧面,底面和后面邻接的第二端子凹部。

    Light emitting device, circuit board, packaging array for light emitting device, and method for manufacturing packaging array for light emitting device
    7.
    发明授权
    Light emitting device, circuit board, packaging array for light emitting device, and method for manufacturing packaging array for light emitting device 有权
    发光器件,电路板,发光器件封装阵列,以及用于制造用于发光器件的封装阵列的方法

    公开(公告)号:US09018653B2

    公开(公告)日:2015-04-28

    申请号:US13820322

    申请日:2011-09-01

    申请人: Ryohei Yamashita

    发明人: Ryohei Yamashita

    IPC分类号: H01L33/62 H01L33/48

    摘要: A light emitting device includes a light emitting element and a package. The package is made up of a molded article and a lead that is embedded in the molded article. The lead includes a mounting part on which the light emitting element is mounted, a terminal part that is linked to the mounting part, and an exposed part. The package has a front face that is a light emitting face, a rear face opposite the front face, and a bottom face contiguous with the front face and the rear face. The light emitting element is mounted on the front face side of the mounting part. The exposed part is linked to the rear face side of the mounting part, and is exposed from the molded article at the bottom face and the rear face. The terminal part is exposed from the molded article at the bottom face.

    摘要翻译: 发光器件包括发光元件和封装。 包装由模制品和嵌入模制品中的铅组成。 引线包括安装有发光元件的安装部,连接到安装部的端子部和露出部。 该封装具有作为发光面的前表面,与前表面相对的后表面和与前表面和后表面相邻的底面。 发光元件安装在安装部的正面侧。 露出部分与安装部分的背面侧相连,并在底面和背面从模制品露出。 端子部分在底面处被模制品暴露。

    Side-view type light emitting device
    10.
    发明授权
    Side-view type light emitting device 有权
    侧视型发光装置

    公开(公告)号:US07479665B2

    公开(公告)日:2009-01-20

    申请号:US11356039

    申请日:2006-02-17

    IPC分类号: H01L33/00

    摘要: A side-view type light emitting device capable of effectively releasing heat generated on the surface of the substrate is provided. The side-view type light emitting device 1 comprising a substrate 1-1, a positive surface electrode 1-2, a negative surface electrode 1-3, a light emitting element 1-4, a sealing member 1-5 sealing the light emitting element 1-4, a positive rear surface electrode 1-6, a negative rear surface electrode 1-7, and a short-cut preventing member 1-8. The positive surface electrode 1-2 and the positive rear surface electrode 1-6 are electrically connected via a first through hole 1-9 and the negative surface electrode 1-3 and the negative rear surface electrode 1-7 are electrically connected via a second through hole 1-10.

    摘要翻译: 提供能够有效地释放在基板表面产生的热的侧视型发光装置。 侧视型发光器件1包括衬底1-1,正表面电极1-2,负表面电极1-3,发光元件1-4,密封元件1-5,其密封发光 元件1-4,正的后表面电极1-6,负的背面电极1-7和防切割部件1-8。 正表面电极1-2和正背面电极1-6经由第一通孔1-9和负表面电极1-3电连接,负表面电极1-7经由第二通孔 通孔1-10。