SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

    公开(公告)号:US20250062116A1

    公开(公告)日:2025-02-20

    申请号:US18722502

    申请日:2022-11-16

    Abstract: A substrate processing apparatus with a support part that has a substrate-facing surface and supports the substrate in a state of being spaced from the substrate-facing surface. The support part is accommodated into a processing space of a processing chamber. A processing fluid flows in a certain direction in the processing space. In a path for a laminar flow of the processing fluid between the substrate and the support part, a downstream path positioned on a downstream side in the certain direction is wider than an upstream path positioned on an upstream side in the certain direction to reduce the pressure loss of the processing fluid flowing from the upstream path to the downstream path to prevent re-adhesion of the liquid to the substrate.

    HEAT TREATMENT METHOD FOR HEATING SUBSTRATE BY LIGHT IRRADIATION

    公开(公告)号:US20250054772A1

    公开(公告)日:2025-02-13

    申请号:US18677613

    申请日:2024-05-29

    Inventor: Hideaki TANIMURA

    Abstract: A semiconductor wafer is preheated to a predetermined preheating temperature. Thereafter, flash heating for heating a front surface of the semiconductor wafer is performed by irradiating the front surface with flashes of light. The flash heating includes a first flash heating process in which the temperature of the front surface of the semiconductor wafer is increased at a first temperature increase rate, and a second flash heating process in which the temperature of the front surface of the semiconductor wafer is increased at a second temperature increase rate higher than the first temperature increase rate. The preheating temperature is made lower than a reaction temperature, and a shortage of the preheating is compensated for by the first flash heating process. Finally, the second flash heating process increases the temperature of the front surface of the semiconductor wafer to a target treatment temperature.

    SUBSTRATE PROCESSING APPARATUS AND MONITORING METHOD

    公开(公告)号:US20250054133A1

    公开(公告)日:2025-02-13

    申请号:US18720523

    申请日:2023-01-25

    Inventor: Shinji SHIMIZU

    Abstract: A substrate processing apparatus includes a chamber, a substrate holder, a camera, and a controller. The substrate holder holds a substrate in the chamber. The camera captures an image of an imaging region including the monitoring target in the chamber, and generates captured image data. The controller specifies an environmental state in an imaging region, monitors the state of the monitoring target based on the captured image data in a first determination procedure corresponding to a first environmental state when the environmental state is in the first environmental state, and monitors the state of the monitoring target based on the captured image data in a second determination procedure corresponding to a second environmental state and different from the first determination procedure when the environmental state is the second environmental state different from the first environmental state.

    Light-irradiation heat treatment apparatus

    公开(公告)号:US12219670B2

    公开(公告)日:2025-02-04

    申请号:US17325906

    申请日:2021-05-20

    Abstract: A semiconductor wafer held by a holding part in a chamber is irradiated and heated with halogen light emitted from a plurality of halogen lamps. A cylindrical louver and an annular light-shielding member, both made of opaque quartz, are provided between the halogen lamps and the semiconductor wafer. The outer diameter of the light-shielding member is smaller than the inner diameter of the louver. Light emitted from the halogen lamps and passing through a clearance between the inner wall surface of the louver and the outer circumference of the light-shielding member is applied to a peripheral portion of the semiconductor wafer where a temperature drop is likely to occur. On the other hand, light travelling toward an overheat region that has a higher temperature than the other region and appears in the surface of the semiconductor wafer when only a louver is installed is blocked off by the light-shielding member.

    Image display method and recording medium

    公开(公告)号:US12216954B2

    公开(公告)日:2025-02-04

    申请号:US18088992

    申请日:2022-12-27

    Abstract: An image display method according to this invention includes obtaining an image set including a plurality of stained images, the plurality of stained images being obtained by imaging a multiple immunostained tissue specimen, a registration processing being performed for mutual registration for the plurality of stained images, and switching and displaying the stained images included in the image set on a screen in accordance with a predetermined switch rule with a result of the registration processing reflected. An image includes at least one of the stained images and a graphical user interface for receiving an operation input from a user for editing the switch rule being displayed on the screen. The switch rule is changed and set according to the operation input. The image is displayed on the screen in accordance with the changed and set switch rule.

    CHANNEL CHIP
    7.
    发明申请

    公开(公告)号:US20250033053A1

    公开(公告)日:2025-01-30

    申请号:US18781251

    申请日:2024-07-23

    Inventor: Katsuaki KAWARA

    Abstract: A channel chip includes a main channel and a plurality of auxiliary channels. A liquid containing particles flows through the main channel. The plurality of auxiliary channels branch from the main channel. A channel width in each of the plurality of auxiliary channels is fixed. Lengths of the plurality of auxiliary channels become shorter toward the downstream side in a flow direction of the liquid flowing through the main channel.

    SUBSTRATE TREATMENT SYSTEM
    9.
    发明申请

    公开(公告)号:US20250029861A1

    公开(公告)日:2025-01-23

    申请号:US18755641

    申请日:2024-06-26

    Abstract: In a substrate treatment system, a stocker device, a single-wafer treatment device, an interface device, and a batch treatment device are disposed in a line and linearly in this order. A first transport robot of the stocker device transports a carrier placed on a load port to a stocker device side position. A carrier transport mechanism transports the carrier from the stocker device side position to an interface device side position. A second transport robot of the interface device transports the carrier from the interface device side position to a shelf. The batch treatment device takes out a plurality of substrates from the carrier transported to the shelf, and performs predetermined batch treatment on the plurality of taken-out substrates. The single-wafer treatment device performs treatment on a plurality of substrates one by one.

    Printing device and printing system

    公开(公告)号:US12204802B2

    公开(公告)日:2025-01-21

    申请号:US18477048

    申请日:2023-09-28

    Abstract: When a printing interruption cause occurs during printing of an image on a printing medium, printing of a page being printed is completed, and further only a position mark is printed on a printing resumption page. Then, a printing unit is stopped, and a conveyance speed is decelerated to stop conveyance of the printing medium. Next, the printing medium is rewound so that printing is resumed from the printing resumption page. Thereafter, the conveyance speed is accelerated to a predetermined speed, and printing is resumed from the printing resumption page on which the position mark is printed.

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