公开(公告)号：US20110045234A1

公开(公告)日：2011-02-24

申请号：US12834450

申请日：2010-07-12

申请人： Saburo Miyamoto ,  Yukitoshi Hase ,  Masayuki Yamamoto

发明人： Saburo Miyamoto ,  Yukitoshi Hase ,  Masayuki Yamamoto

IPC分类号： B32B7/12 ,  B32B38/10

CPC分类号： B62D25/105 ,  Y10T156/1077 ,  Y10T428/24174

摘要： A joining roller rolls while pressing on a separator on a surface of a double-faced adhesive tape with through holes in rectangular shapes regularly formed therein in a longitudinal tape direction, and the double-faced adhesive tape is joined to a building panel. Thereafter, the separator is separated and the reinforcing member is joined to an adhesive layer of the double-faced adhesive tape while being pressed with the reinforcing member being kept parallel to the double-faced adhesive tape.

摘要翻译： 接合辊在将双面胶带的表面上的隔膜压在辊纵向上规则地形成有矩形形状的通孔的同时滚压，双面胶带与建筑面板接合。 此后，分离器被分离，并且加强构件在与加强构件保持平行于双面胶带的同时被按压而与双面胶带的粘合剂层接合。

公开(公告)号：US20060219359A1

公开(公告)日：2006-10-05

申请号：US11358140

申请日：2006-02-22

申请人： Saburo Miyamoto ,  Yasuji Kaneshima ,  Masayuki Yamamoto

发明人： Saburo Miyamoto ,  Yasuji Kaneshima ,  Masayuki Yamamoto

IPC分类号： B32B37/00 ,  B29C63/00 ,  B32B38/00

CPC分类号： B29C63/0013 ,  H01L21/67132 ,  H01L2221/6839 ,  Y10T156/1105 ,  Y10T156/1168 ,  Y10T156/1179 ,  Y10T156/19 ,  Y10T156/1906 ,  Y10T156/1978

摘要： During relative and horizontal movement of a mount frame, in which a semiconductor wafer with a protective tape is supported on a ring frame through a supporting adhesive tape, and a joining member, a position of an end edge of the protective tape is detected in a non-contact manner. Based on the detection result, a joining member is stopped in the position of the end edge of the protective tape and is moved close to the semiconductor wafer to press and bring a separation tape against and into contact with an end of the protective tape. In this state, the mount frame and the joining member are relatively and horizontally moved to join the separation tape onto the protective tape. Then, the mount frame and the joining member are relatively and horizontally moved to separate the separation tape together with the protective tape from a surface of the semiconductor wafer.

摘要翻译： 在具有保护带的半导体晶片通过支撑胶带被支撑在环形框架上的安装框架的相对和水平移动以及接合构件中，在保护带的端部边缘的位置被检测到 非接触式 基于检测结果，接合构件停止在保护带的端缘的位置，并且移动靠近半导体晶片，以将分离带抵靠并与保护带的端部接触。 在这种状态下，安装框架和接合构件被相对且水平地移动以将分离带连接到保护带上。 然后，安装框架和接合构件被相对且水平地移动，以将分离带与保护带一起从半导体晶片的表面分离。

公开(公告)号：US20050014345A1

公开(公告)日：2005-01-20

申请号：US10875165

申请日：2004-06-25

申请人： Saburo Miyamoto ,  Yukitoshi Hase ,  Masaru Irie

发明人： Saburo Miyamoto ,  Yukitoshi Hase ,  Masaru Irie

IPC分类号： H01L21/683 ,  H01L21/00 ,  H01L21/02 ,  H01L21/301 ,  H01L21/304 ,  H01L21/52 ,  H01L21/30 ,  H01L21/3205

CPC分类号： H01L21/67132 ,  H01L21/67092

摘要： A joining roller rolls on the surface of a reinforcing substrate held by a center and side latch claws so as to be close and opposite to an wafer placed and held on a holding table in the condition that an adhesive sheet is adhered on the surface, whereby joining proceeds. As the joining roller rolls, both of the latch claws oscillate downward and the latch claws themselves move down while keeping the bend of the reinforcing substrate nearly constant, and retract when the joining roller approaches the latch claws.

摘要翻译： 接合辊在由粘合在表面上的粘合片的条件下，在由中央和侧面的锁定爪保持的加强基板的表面上滚动以与放置并保持在保持台上的晶片紧密相对，由此 加入收益 当接合辊滚动时，两个闩锁爪向下摆动，并且闩爪自身向下运动，同时保持加强基板的弯曲几乎恒定，并且当接合辊接近闩锁爪时缩回。

公开(公告)号：US6099675A

公开(公告)日：2000-08-08

申请号：US203497

申请日：1998-12-01

申请人： Masayuki Yamamoto ,  Makoto Namikawa ,  Eiji Toyoda ,  Shigeji Kuroda ,  Saburo Miyamoto ,  Takao Matsushita

发明人： Masayuki Yamamoto ,  Makoto Namikawa ,  Eiji Toyoda ,  Shigeji Kuroda ,  Saburo Miyamoto ,  Takao Matsushita

IPC分类号： H01L21/027 ,  B29C63/00 ,  B32B31/16 ,  C09J5/06 ,  G05G15/00 ,  H01J21/30

CPC分类号： B29C63/0013 ,  Y10S156/922 ,  Y10T156/11

摘要： An adhesive tape is applied to an article covered with a resist pattern. The article with the adhesive tape applied thereto is rapidly cooled to form cracks in the resist pattern on the surface of the article to weaken the cohesion between the resist pattern and the surface of the article. After the cooling, the adhesive tape is separated from the article, whereby the resist pattern is removed with the adhesive tape from the surface of the article.

摘要翻译： 将粘合带施加到被抗蚀图案覆盖的物品上。 施加有胶粘带的制品被快速冷却以在制品的表面上的抗蚀剂图案中形成裂纹，以削弱抗蚀剂图案和制品的表面之间的内聚力。 冷却后，粘合带与制品分离，由此用胶带从制品的表面除去抗蚀剂图案。

公开(公告)号：US5688090A

公开(公告)日：1997-11-18

申请号：US698737

申请日：1996-08-16

申请人： Saburo Miyamoto

发明人： Saburo Miyamoto

IPC分类号： F16B25/00 ,  F16B13/12 ,  F16B37/04 ,  F16B13/06

CPC分类号： F16B13/124

摘要： A screw assembly is made up of a screw and a screw fixing member. The screw fixing member is inserted into a starting hole formed in a concrete wall and then the screw is driven into the fixing member in a continuous manner. The screw fixing member has a body having a cylindrical section formed with an eccentric bore having an opening at one end thereof. The screw has its tip inserted in the opening of the bore. The screw has a threaded shank and a cylindrical portion provided at one end of the shank. The screw and the screw fixing member are coupled together by inserting the cylindrical portion of the screw into the opening of the bore.

摘要翻译： 螺钉组件由螺钉和螺钉固定构件构成。 将螺钉固定部件插入到形成在混凝土壁中的起始孔中，然后以连续的方式将螺钉驱动到固定部件中。 螺钉固定构件具有主体，该主体具有形成有在其一端具有开口的偏心孔的圆柱形部分。 螺钉的尖端插入孔的开口中。 螺钉具有螺纹柄和设置在柄的一端的圆柱形部分。 螺钉和螺钉固定构件通过将螺杆的圆柱形部分插入孔的开口中而联接在一起。

公开(公告)号：US4204905A

公开(公告)日：1980-05-27

申请号：US931281

申请日：1978-08-04

申请人： Saburo Miyamoto

发明人： Saburo Miyamoto

IPC分类号： H01R4/22 ,  B65H81/00 ,  C09J5/00 ,  H01B13/012 ,  H01B13/08 ,  H01B13/26 ,  H01R43/00 ,  H02G1/14 ,  H02G1/16 ,  B31F1/00

CPC分类号： H01B13/01263 ,  H01B13/08 ,  H01B13/26 ,  H02G1/14 ,  H02G1/16

摘要： A taping machine used to wind an adhesive tape around e.g. a joined cable disclosed. It comprises a rotor rotatably mounted on a frame, drive means for the rotor, tape feed means, and tape cutting means. The rotor has a radial opening, on the opposite inner walls of the radial opening are mounted brushes. The article to be taped is pushed into the radial opening and between the brushes, subsequently the rotor starts to turn. As it turns, the tape is tightly wound around the article by frictional action of the brushes.

摘要翻译： 用于缠绕例如胶带的胶带机。 公开了一种连接电缆。 它包括可旋转地安装在框架上的转子，用于转子的驱动装置，送带装置和带切割装置。 转子具有径向开口，在径向开口的相对的内壁上安装有刷子。 要被接合的物品被推入径向开口和刷子之间，随后转子开始转动。 转动时，通过刷子的摩擦力将胶带紧紧地缠绕在物品周围。

公开(公告)号：US08395595B2

公开(公告)日：2013-03-12

申请号：US13222327

申请日：2011-08-31

申请人： Saburo Miyamoto ,  Toshihisa Nakano

发明人： Saburo Miyamoto ,  Toshihisa Nakano

IPC分类号： G06F3/041

CPC分类号： G06F3/044 ,  G02F1/13338 ,  G06F3/0412 ,  G06F3/045 ,  G06F2203/04113

摘要： A display device with a touch sensor according to the present invention includes an active matrix substrate and a transparent counter electrode. On a first surface of the active matrix substrate, multiple pixel electrodes are arranged in matrix. The transparent counter electrode is opposed to the first surface of the active matrix substrate. The display device further includes a first circuit, a second circuit and a switching circuit. The first circuit supplies a voltage or a current to the transparent counter electrode for display purposes. The second circuit detects currents flowing from a number of points on the transparent counter electrode. And the switching circuit selectively connects electrically one of the first and second circuits to the transparent counter electrode.

摘要翻译： 具有根据本发明的触摸传感器的显示装置包括有源矩阵基板和透明对电极。 在有源矩阵基板的第一表面上，将多个像素电极排成矩阵状。 透明对电极与有源矩阵基板的第一表面相对。 显示装置还包括第一电路，第二电路和开关电路。 第一电路将电压或电流提供给透明对电极用于显示目的。 第二电路检测从透明对电极上的多个点流出的电流。 并且开关电路选择性地将第一和第二电路之一电连接到透明对电极。

公开(公告)号：US08349106B2

公开(公告)日：2013-01-08

申请号：US12848290

申请日：2010-08-02

申请人： Saburo Miyamoto ,  Yukitoshi Hase ,  Masayuki Yamamoto

发明人： Saburo Miyamoto ,  Yukitoshi Hase ,  Masayuki Yamamoto

IPC分类号： B32B41/00

CPC分类号： B65H35/0013 ,  B65H37/002 ,  B65H2301/460186 ,  Y10T156/108 ,  Y10T156/1084 ,  Y10T156/1085 ,  Y10T156/1195

摘要： A joint detector detects a joint in an adhesive tape supplied from a tape supply section, and a computing unit determines a suitable cutting position of the adhesive tape for removing the joint in accordance with the detected results. A controller controls each mechanism to operate so as to satisfy the determined results by the computing unit. Thereafter, the adhesive tape including the joint is cut and removed.

摘要翻译： 联合检测器检测从带供应部分提供的粘合带中的接头，并且计算单元根据检测结果确定用于移除接头的胶带的适当切割位置。 控制器控制每个机构进行操作以满足计算单元确定的结果。 此后，将包括接头的胶带切割并除去。

公开(公告)号：US08097121B2

公开(公告)日：2012-01-17

申请号：US12207139

申请日：2008-09-09

申请人： Masayuki Yamamoto ,  Saburo Miyamoto

发明人： Masayuki Yamamoto ,  Saburo Miyamoto

IPC分类号： B32B38/10

CPC分类号： B29C63/0013 ,  H01L21/67132 ,  Y10T156/1105 ,  Y10T156/1189 ,  Y10T156/1972 ,  Y10T156/1983

摘要： A surface height of a protective tape joined to a wafer mounted and held on a separation table is detected, an operation amount of approaching a joining member to the protective tape until a separation tape wound around the joining member contacts the protective tape based on detected information, the joining member is operation controlled to approach the protective tape based on the calculated operation amount, the joining member and the separation table are relatively moved along a direction of a surface of the protective tape in a state of maintaining the height of the joining member to join the separation tape to the protective tape, and the separation tape is separated from the surface of the wafer integrally with the protective tape.

摘要翻译： 检测接合到安装并保持在分离台上的晶片的保护带的表面高度，接合到保护带的接合构件的操作量，直到缠绕在接合构件上的分离带基于检测到的信息接触保护带 根据计算出的操作量，接合构件被操作控制到接近保护带，接合构件和分离台在保持接合构件的高度的状态下沿着保护带的表面的方向相对移动 将分离带连接到保护带上，并且分离带与保护带一体地与晶片的表面分离。

公开(公告)号：US08062474B2

公开(公告)日：2011-11-22

申请号：US12234292

申请日：2008-09-19

申请人： Masayuki Yamamoto ,  Saburo Miyamoto

发明人： Masayuki Yamamoto ,  Saburo Miyamoto

IPC分类号： B32B38/10

CPC分类号： H01L21/67132 ,  Y10T156/1105 ,  Y10T156/1906

摘要： A surface height of a protective tape joined to a wafer mounted and held on a separation table is detected, a lowering operation distance of a needle is calculated based on such detected information, and a lowering operation amount for approaching a joining member to the protective tape until the separation tape winded around the joining member contacts the protective tape is calculated. A separating site is formed in the protective tape and the protective tape is separated while controlling a height of each member based on the calculated lowering operation amount.

摘要翻译： 检测接合到安装并保持在分离台上的晶片的保护带的表面高度，基于这种检测信息计算针的下降操作距离，以及用于接近保护带的接合构件的下降操作量 直到分离带卷绕在接合构件周围接触保护带。 分离部位形成在保护带中，并且基于计算出的降低操作量来控制每个部件的高度来分离保护带。