公开(公告)号：US07230328B2

公开(公告)日：2007-06-12

申请号：US10528160

申请日：2003-11-19

申请人： Ichiro Hazeyama ,  Yoshimichi Sogawa ,  Takao Yamazaki ,  Sakae Kitajo

发明人： Ichiro Hazeyama ,  Yoshimichi Sogawa ,  Takao Yamazaki ,  Sakae Kitajo

IPC分类号： H01L23/02

CPC分类号： H01L23/3114 ,  H01L23/5387 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2224/97 ,  H01L2225/06517 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/00

摘要： A semiconductor package has a semiconductor device chip and a flexible substrate having a thermoplastic insulating resin layer. An electrode provided on the flexible substrate is connected to a predetermined electrode of the semiconductor device chip and sealed by the thermoplastic insulating resin layer. The flexible substrate is bent and provided with electrodes on the electrode-bearing and other surfaces. The flexible substrate has multi-layered wirings. Grooves or thin layer portions having a different number of wiring layers are formed at bends of the flexible substrate or regions including the bends, thereby creating a cavity at a portion in which a semiconductor device is packaged. Then, the flexible substrate is bent at predetermined positions to form a semiconductor package which does not depend on the outer dimensions of the semiconductor device chip.

摘要翻译： 半导体封装具有半导体器件芯片和具有热塑性绝缘树脂层的柔性基板。 设置在柔性基板上的电极连接到半导体器件芯片的预定电极并被热塑性绝缘树脂层密封。 柔性基板弯曲并在电极轴承和其它表面上设置电极。 柔性基板具有多层布线。 在柔性基板或弯曲部的区域的弯曲处形成具有不同数量的布线层的沟槽或薄层部分，从而在半导体器件被封装的部分形成空腔。 然后，柔性基板在预定位置弯曲以形成不依赖于半导体器件芯片的外部尺寸的半导体封装。

公开(公告)号：US06889886B2

公开(公告)日：2005-05-10

申请号：US10105580

申请日：2002-03-25

申请人： Ichiro Hazeyama ,  Sakae Kitajo ,  Yuzo Shimada ,  Akeo Katahira ,  Jun Ishida ,  Masaru Terashima ,  Kazuhiko Futakami

发明人： Ichiro Hazeyama ,  Sakae Kitajo ,  Yuzo Shimada ,  Akeo Katahira ,  Jun Ishida ,  Masaru Terashima ,  Kazuhiko Futakami

IPC分类号： H01L21/48 ,  H01L21/60 ,  H01L21/683 ,  H05K3/34 ,  B23K37/06 ,  B23K20/14 ,  B23K35/12

CPC分类号： H01L24/11 ,  H01L21/4853 ,  H01L21/6838 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12044 ,  H05K3/3478 ,  H01L2924/00 ,  H01L2224/05599

摘要： Conductive balls are transferred from a pallet onto an array of conductive pads on a semiconductor chip by means of a transfer apparatus; the transfer apparatus includes a pallet formed with an array of recesses same in pattern as the array of conductive pads, a movable head formed with an array of vacuum holes and a driving mechanism for moving the head from an idle position onto the pallet and from the pallet to the semiconductor chip; when the head is moved to the pallet, the vacuum holes are connected to the recesses so as to confine the conductive balls in the narrow spaces; the vacuum is developed; then the conductive balls are traveled through the closed spaces to the vacuum holes; even if the conductive balls have been charged, the conductive balls are never attracted to the adjacent balls, and are surely captured by the vacuum holes.

摘要翻译： 导电球通过传送装置从托盘传送到半导体芯片上的导电焊盘阵列上; 传送装置包括形成有与导电垫阵列相同的凹槽阵列的托盘，形成有真空孔阵列的可移动头和用于将头从空闲位置移动到托盘上的驱动机构 托盘到半导体芯片; 当头部移动到托盘上时，真空孔连接到凹部，以将导电球限制在狭窄的空间中; 真空开发; 然后导电球通过封闭空间行进到真空孔; 即使导电球已经被充电，导电球也不会被吸引到相邻的球，并且被真空孔确实地捕获。

公开(公告)号：US06670699B2

公开(公告)日：2003-12-30

申请号：US10090459

申请日：2002-03-04

申请人： Kazuyuki Mikubo ,  Sakae Kitajo ,  Yuzo Shimada

发明人： Kazuyuki Mikubo ,  Sakae Kitajo ,  Yuzo Shimada

IPC分类号： H01L2302

CPC分类号： H05K1/0272 ,  H01L23/433 ,  H01L23/473 ,  H01L23/49822 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H05K1/0207 ,  H05K1/112 ,  H05K3/4602 ,  H05K2201/064 ,  H05K2201/09536 ,  H05K2201/10416 ,  H05K2201/10977 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package comprising an LSI chip, a chip bump, an interposer, and a BGA bump is mounted at a predetermined position of a printed wiring board having a core layer. A heat sink for dissipating heat generated from the LSI chip is installed within the core layer. Further, heat radiating vias for conveying heat generated from the LSI chip to the heat sink are provided within the printed wiring board so that the BGA bump in the LSI chip is thermally liked with the heat sink. The heat generated from the LSI chip is mainly dissipated through a route of chip bump→interposer→BGA bump→heat radiating via→heat sink. By virtue of the above construction, the semiconductor device packaging structure can reduce the packaging volume of the heat sink while providing satisfactory cooling capacity and, at the same time, can minimize the length of signal wiring between LSI chips.

公开(公告)号：US5838066A

公开(公告)日：1998-11-17

申请号：US766990

申请日：1996-12-16

申请人： Sakae Kitajo

发明人： Sakae Kitajo

IPC分类号： H01L23/36 ,  H01L23/467 ,  H05K7/20 ,  H01L23/46

CPC分类号： H01L23/467 ,  H01L2924/0002

摘要： To provide a semiconductor device heatsink that is mounted to a semiconductor device and that improves the cooling efficiency, a semiconductor device heatsink has a configuration in that the heatsink has a group of fins 1 and an air-blowing fan, the fins being formed by a large number of plates or pins on top of a base and the air-blowing fan comprising a fan rotating mechanism and a centrifugal fan 2, covers 3 and 4 being provided on the group of fins and the centrifugal fan and further an air intake aperture being provided on the centrifugal fan cover, in the direction of rotation. A centrifugal fan, rather than an axial fan as used in the past, is used, covers are provided on the heatsink and on the fan, so that air does not leak to the outside, and an air intake aperture is provided on the side of the fan cover. By doing this, heat radiating performance is improved, while making it possible to achieve a compact heatsink, which contributes to the compactness of the electronic equipment in which it is used.

摘要翻译： 为了提供安装在半导体器件上并提高冷却效率的半导体器件散热器，半导体器件散热器具有以下结构：散热片具有一组散热片1和一个送风风扇，散热片由 基座顶部有大量的板或销，风扇包括风扇转动机构和离心式风扇2，在散热片和离心式风机组上设置盖3和4，进一步的进气口为 设置在离心式风扇罩上，沿旋转方向。 使用离心风扇，而不是过去使用的轴流式风扇，盖子设置在散热器和风扇上，使得空气不会泄漏到外部，并且进气孔设置在 风扇盖。 通过这样做，提高了散热性能，同时可以实现紧凑的散热器，这有助于其使用的电子设备的紧凑性。

公开(公告)号：US08308453B2

公开(公告)日：2012-11-13

申请号：US12448694

申请日：2008-01-15

申请人： Mitsuru Yamamoto ,  Kazuhito Murata ,  Sakae Kitajo

发明人： Mitsuru Yamamoto ,  Kazuhito Murata ,  Sakae Kitajo

IPC分类号： F04B17/00 ,  F04B53/10

CPC分类号： F04B43/046 ,  F04B43/028 ,  F04B43/04

摘要： A pump chamber (15) is formed between a piezoelectric vibrator (7) and a valve main plate (10). The valve main plate (10) includes an inlet port (13) at its central portion, and an outlet port (14) in its peripheral portion, and the inlet port (13) is made in a smaller diameter than the outlet port (14). On the valve main plate (10) an inflow check valve (11) and an outflow check valve (12) are provided, so that when the inflow check valve (11) and the outflow check valve (12) open and close in response to the vibration of the piezoelectric vibrator (7), a fluid is introduced into and discharged from the pump chamber (15).

摘要翻译： 在压电振子（7）和阀主板（10）之间形成泵室（15）。 阀主板（10）在其中心部分包​​括入口（13）和其周边部分的出口（14），并且入口（13）制成的直径小于出口（14）的直径 ）。 在阀主板（10）上设置有流入止回阀（11）和流出止回阀（12），当流入止回阀（11）和流出止回阀（12）响应于 压电振动器（7）的振动，将流体引入泵室（15）并从泵室（15）排出。

公开(公告)号：US07826225B2

公开(公告)日：2010-11-02

申请号：US10578782

申请日：2004-11-11

申请人： Yoshinori Katada ,  Kazuo Taga ,  Tomotaka Ishida ,  Sakae Kitajo

发明人： Yoshinori Katada ,  Kazuo Taga ,  Tomotaka Ishida ,  Sakae Kitajo

IPC分类号： H05K7/20 ,  G06F1/20

CPC分类号： H05K7/20272 ,  F28F3/12 ,  F28F9/0231 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/473 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

摘要： An expansion tank device 14 comprises a tank installation base 16 having a cooling liquid channel 17 and an expansion tank 18 provided on the upper surface of the installation base 16. The base 16 has a communication hole 19 for holding space above the upper surface thereof in communication with the cooling liquid channel 17. The expansion tank 18 has a tank main body 21 including an upwardly bulging portion 22 having an opening at its lower end, and a bottom plate 23 joined to the lower end of the tank main body 21 for closing the lower-end opening of the bulging portion 22 and joined to the upper surface of the tank installation base 16. The bottom plate 23 is provided at a portion thereof corresponding to the communication hole 19 with a through hole 25 communicating with the communication hole 19. The bottom plate 23 is provided with a baffle plate 26 formed along the entire circumference of the inner peripheral edge thereof defining the through hole 25 and slanting upwardly toward the center of the through hole 25. The expansion tank device 14 removes the air in the cooling liquid from the circulating system, precludes the system from breaking and prevents the decrease in the amount of cooling liquid within the circulating system.

摘要翻译： 膨胀箱装置14包括具有冷却液通道17的罐安装基座16和设置在安装基座16的上表面上的膨胀箱18.底座16具有用于在其上表面上方保持空间的连通孔19 与冷却液通道17连通。膨胀箱18具有容器主体21，其包括在其下端具有开口的向上凸出部分22和与罐主体21的下端接合的底板23，用于关闭 凸出部分22的下端开口并连接到罐安装基座16的上表面。底板23设置在与连通孔19相对应的部分处，通孔25与连通孔19连通 底板23设置有挡板26，挡板26沿其内周边缘的整个圆周形成，其限定通孔25并向上倾斜 通孔25的中心。膨胀箱装置14从循环系统中除去冷却液中的空气，排除系统破裂，防止循环系统内的冷却液量的减少。

公开(公告)号：US20100155035A1

公开(公告)日：2010-06-24

申请号：US12087879

申请日：2007-01-23

申请人： Tomotaka Ishida ,  Mitsuru Yamamoto ,  Sakae Kitajo ,  Kazuhiro Kumakura

发明人： Tomotaka Ishida ,  Mitsuru Yamamoto ,  Sakae Kitajo ,  Kazuhiro Kumakura

IPC分类号： F28D15/00 ,  F28D1/00

CPC分类号： H01L23/473 ,  G06F1/20 ,  G06F2200/201 ,  H01L2924/0002 ,  H05K7/20272 ,  H01L2924/00

摘要： A liquid-cooled heat radiator 1 includes a heat radiation base 2 having a cooling-liquid channel 5, and an expansion tank 7 provided on the heat radiation base 2. The expansion tank 7 has a tank body 26 having an expanded portion 27, which expands upward and opens downward, and a bottom plate 28 joined to the lower end of the tank body 26 to thereby close a bottom opening of the expanded portion 27. A through-hole 29 is formed in the top wall of the expanded portion 27 of the tank body 26 and serves as a communication section for establishing communication between the interior and the exterior of the cooling-liquid channel 5. A hydrogen-permeable member 31 is fixedly fitted into the through-hole 29 so as to stop the through-hole 29. The hydrogen-permeable member 31 satisfies the relation B≧50 A, where A and B are water-vapor permeability and hydrogen permeability, respectively, of the hydrogen-permeable member 31. The hydrogen-permeable member 31 is formed from a single material selected from the group consisting of ethylene-propylene rubber, butyl rubber, fluorine-containing rubber, nitrile-butadiene rubber, and silicone rubber. The liquid-cooled heat radiator 1 can be free from an increase in pressure in the cooling-liquid channel 5.

摘要翻译： 液冷散热器1包括具有冷却液通道5的散热基座2和设置在散热基座2上的膨胀箱7.膨胀箱7具有一个具有膨胀部分27的罐体26， 向下方膨胀，向下方开口的底板28与罐体26的下端接合，从而封闭膨胀部27的底部开口。在扩孔部27的顶壁形成有通孔29， 罐本体26构成用于建立冷却液通道5的内部和外部之间的连通的连通部。通气部件31固定地配合在通孔29中以停止通孔 氢渗透性构件31满足B≥A≥AA的关系，A和B分别为透水性构件31的水蒸气透过率和透氢性。透氢性构件31由单一的 材料sele 由乙烯 - 丙烯橡胶，丁基橡胶，含氟橡胶，丁腈橡胶和硅橡胶组成的组中。 液冷散热器1可以没有冷却液通道5中的压力增加。

公开(公告)号：US07564164B2

公开(公告)日：2009-07-21

申请号：US10590081

申请日：2005-02-01

申请人： Mitsuru Yamamoto ,  Sunao Hamamura ,  Yasuhiro Sasaki ,  Sakae Kitajo

发明人： Mitsuru Yamamoto ,  Sunao Hamamura ,  Yasuhiro Sasaki ,  Sakae Kitajo

IPC分类号： H01L41/09

CPC分类号： F04B45/047 ,  F04B17/003 ,  F04B43/046 ,  G06F1/206 ,  H01L23/473 ,  H01L41/042 ,  H01L2924/0002 ,  Y02D10/16 ,  H01L2924/00

摘要： A piezoelectric element of the piezoelectric pump is driven by the output signal of an amplifier that takes as input a signal that is generated by a sine wave oscillator of the same frequency that drives the piezoelectric element. The amplifier is driven by a high voltage obtained by conversion from a low-voltage power supply by a voltage-boosting converter, whereby the piezoelectric element is driven by a low-frequency sine wave of high voltage. The frequency of the sine wave oscillation is further adjusted by a signal from a first control circuit at the time of activation. In addition, the amplitude of the sine wave oscillation is adjusted by the output signal of a second control circuit that takes as input a signal from temperature sensor for sensing the temperature of the heat-generating body.

摘要翻译： 压电泵的压电元件由放大器的输出信号驱动，该放大器将驱动压电元件的相同频率的正弦波振荡器产生的信号作为输入。 放大器由通过由升压转换器从低压电源转换而获得的高电压驱动，由此压电元件由高电压的低频正弦波驱动。 在激活时，来自第一控制电路的信号进一步调整正弦波振荡的频率。 此外，正弦波振荡的振幅通过第二控制电路的输出信号进行调节，该第二控制电路将用于感测发热体温度的温度传感器的信号作为输入。

公开(公告)号：US20080110600A1

公开(公告)日：2008-05-15

申请号：US11946561

申请日：2007-11-28

申请人： Kazuyuki MIKUBO ,  Sakae KITAJO ,  Yasuhiro SASAKI ,  Atsushi OCHI ,  Mitsuru YAMAMOTO

发明人： Kazuyuki MIKUBO ,  Sakae KITAJO ,  Yasuhiro SASAKI ,  Atsushi OCHI ,  Mitsuru YAMAMOTO

IPC分类号： F28D15/00

CPC分类号： H01L23/473 ,  G06F1/20 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention provides a cooling apparatus which is easy to build and to fix it to electronic devices, superior in thermal conduction and heat dissipation, and possible to make thin the total configuration of the apparatus. The liquid cooling unit 9 and the air cooling unit 12 are formed in a unit. A heat absorption surface 19 of the liquid cooling unit 9 is contacted or bonded to the heat generation component such as the CPU and the heat generator, which have the largest power consumption and also locally generate heat within a small area in the box 2. In the liquid cooling unit 9, a liquid cooling pump 14 composed of an electromagnetic pump is arranged for circulating the coolant in the flow path 10. The heat generated by the heat generation components such as CPU 6, heat generator 7, and the like is thermally diffused with heat conduction into the whole liquid cooling unit 9 by circulating the coolant with the liquid cooling pump 14.

摘要翻译： 本发明提供了一种易于构建并将其固定在电子设备上的散热装置，其热传导和散热优良，并且可以使装置的总体构型变薄。 液体冷却单元9和空气冷却单元12形成为一个单元。 液体冷却单元9的吸热表面19接触或结合到具有最大功率消耗的CPU和热发生器等发热组件，并且还在箱体2的小区域内局部地产生热量。 在液体冷却单元9中，布置有由电磁泵构成的液体冷却泵14，用于使冷却剂在流路10中循环。 由CPU 6，发热体7等发热部件产生的热量，通过使冷却液与液体冷却泵14循环，热传导到整个液体冷却单元9。

公开(公告)号：US07106426B2

公开(公告)日：2006-09-12

申请号：US10322484

申请日：2002-12-19

申请人： Hideo Kikuchi ,  Mikio Oda ,  Hikaru Kouta ,  Sakae Kitajo ,  Yuzo Shimada ,  Yoshio Matsumoto ,  Shinichi Tamabayashi

发明人： Hideo Kikuchi ,  Mikio Oda ,  Hikaru Kouta ,  Sakae Kitajo ,  Yuzo Shimada ,  Yoshio Matsumoto ,  Shinichi Tamabayashi

IPC分类号： G01N21/00

CPC分类号： G01M11/35

摘要： There is disclosed a method of inspecting an optical waveguide substrate for optical conduction at an increased inspecting rate and also inspecting an optical waveguide substrate for cross-talk. According to the disclosed method, a laser beam is applied from a laser beam scanning optical system to one end face of an optical waveguide of an optical waveguide substrate which is an object to be inspected, and the laser beam emitted from the other end of the optical waveguide is detected by a CCD camera, which output detected result data. A light spot position confirming device compares the detected result data with stored data.

摘要翻译： 公开了以更高的检查速度检查用于光导的光波导基板的方法，并且还检查用于串扰的光波导基板。 根据所公开的方法，将激光束从激光束扫描光学系统施加到作为被检查对象的光波导基板的光波导的一个端面，从另一端发射的激光束 光波导由CCD摄像机检测，其输出检测结果数据。 光点位置确认装置将检测到的结果数据与存储的数据进行比较。