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    Backlight assembly and method of assembling a backlight assembly
    1.
    发明授权
    Backlight assembly and method of assembling a backlight assembly 有权
    背光组件和组装背光组件的方法

    公开(公告)号：US08740445B2

    公开(公告)日：2014-06-03

    申请号：US13461494

    申请日：2012-05-01

    申请人： Sang-Hwan Lee

    发明人： Sang-Hwan Lee

    IPC分类号： F21V7/04

    CPC分类号： G02F1/133608 ,  G02F2202/28

    摘要： A backlight assembly includes a first light-emitting module, a light guide plate, a receiving container and a main adhesion member. The first light-emitting module includes a first circuit board including a first mounting surface, and a first light source on the first mounting surface. The light guide plate is on the first mounting surface and guides light from the first light source. The receiving container includes a bottom portion and receives the first light-emitting module and the light guide plate. The main adhesion member is between the first mounting surface and the light guide plate and is attached to the first circuit board and the light guide plate, and is between the light guide plate and the bottom portion and movable with respect to the light guide plate.

    摘要翻译： 背光组件包括第一发光模块，导光板，接收容器和主粘合构件。 第一发光模块包括在第一安装表面上包括第一安装表面和第一光源的第一电路板。 导光板位于第一安装面上并引导来自第一光源的光。 接收容器包括底部并接收第一发光模块和导光板。 主粘合部件位于第一安装面和导光板之间，并且安装在第一电路板和导光板上，并且在导光板和底部之间，并相对于导光板可移动。

    BACKLIGHT ASSEMBLY AND METHOD OF ASSEMBLING A BACKLIGHT ASSEMBLY
    2.
    发明申请
    BACKLIGHT ASSEMBLY AND METHOD OF ASSEMBLING A BACKLIGHT ASSEMBLY 有权
    背光组件和组装背光组件的方法

    公开(公告)号：US20120287672A1

    公开(公告)日：2012-11-15

    申请号：US13461494

    申请日：2012-05-01

    申请人： Sang-Hwan LEE

    发明人： Sang-Hwan LEE

    IPC分类号： G09F13/18 ,  B32B37/14 ,  F21V13/02

    CPC分类号： G02F1/133608 ,  G02F2202/28

    摘要： A backlight assembly includes a first light-emitting module, a light guide plate, a receiving container and a main adhesion member. The first light-emitting module includes a first circuit board including a first mounting surface, and a first light source on the first mounting surface. The light guide plate is on the first mounting surface and guides light from the first light source. The receiving container includes a bottom portion and receives the first light-emitting module and the light guide plate. The main adhesion member is between the first mounting surface and the light guide plate and is attached to the first circuit board and the light guide plate, and is between the light guide plate and the bottom portion and movable with respect to the light guide plate.

    摘要翻译： 背光组件包括第一发光模块，导光板，接收容器和主粘合构件。 第一发光模块包括在第一安装表面上包括第一安装表面和第一光源的第一电路板。 导光板位于第一安装面上并引导来自第一光源的光。 接收容器包括底部并接收第一发光模块和导光板。 主粘合部件位于第一安装面和导光板之间，并且安装在第一电路板和导光板上，并且在导光板和底部之间，并相对于导光板可移动。

    Biodegradable resin composition
    3.
    发明申请
    Biodegradable resin composition 审中-公开
    生物降解树脂组合物

    公开(公告)号：US20070043148A1

    公开(公告)日：2007-02-22

    申请号：US11489841

    申请日：2006-07-20

    申请人： Young-kwan Yi ,  Sang-hwan Lee

    发明人： Young-kwan Yi ,  Sang-hwan Lee

    IPC分类号： D21H19/54

    CPC分类号： C08L1/12 ,  C08K5/053 ,  C08K5/103 ,  C08K5/11 ,  C08L97/02 ,  C08L101/16 ,  C08L2201/06 ,  C08L2666/26

    摘要： This invention provides a biodegradable resin composition and a biodegradable molding using the same and in particular, it not only have satisfactory biodegradability, processability and properties required for biodegradable resins by comprising cellulose diacetate as a main component but also can lower manufacturing costs and prevent environmental contamination by preparing the biodegradable resins by reusing a cause factor of environmental contamination.

    摘要翻译： 本发明提供一种可生物降解的树脂组合物和使用其的可生物降解的成型体，特别是不仅具有令生物降解性的树脂具有令人满意的生物降解性，加工性和性能，而且还可以降低制造成本并防止环境污染 通过重新利用环境污染的因素来制备可生物降解的树脂。

    Method for fabricating a hybrid optical integrated circuit employing SOI optical waveguide
    4.
    发明授权
    Method for fabricating a hybrid optical integrated circuit employing SOI optical waveguide 有权
    使用SOI光波导制造混合光集成电路的方法

    公开(公告)号：US06316281B1

    公开(公告)日：2001-11-13

    申请号：US09393279

    申请日：1999-09-10

    申请人： Sang Hwan Lee ,  Gwan Chong Joo ,  Nam Hwang ,  Min Kyu Song

    发明人： Sang Hwan Lee ,  Gwan Chong Joo ,  Nam Hwang ,  Min Kyu Song

    IPC分类号： H01L2100

    CPC分类号： G02B6/423 ,  G02B6/136 ,  G02B6/30 ,  G02B6/42 ,  G02B6/4201 ,  G02B6/4214 ,  G02B6/4224 ,  G02B6/4232 ,  G02B6/4243 ,  H01L31/02325

    摘要： The present invention relates to an optical integrated circuit; and, more particularly, to a method for preparing an improved hybrid optical integrated circuit which is capable of accommodating optical waveguides, optical devices, such as light emitting devices and light receiving devices, and optical fibers in an effective manner. The present invention has the advantages of minimizing horizontal misalignment error between the SOI waveguide rib area, the V-groove etch window and the alignment marks, decreasing the manufacturing cost by passively aligning the waveguides, the optical devices and the optical fibers on a single substrate. Also, the present invention has an effect of reducing fresnel reflection loss by providing the LPCVD silicon nitride layer capable of being used as an anti-reflection coating layer at both ends of the waveguide.

    摘要翻译： 本发明涉及一种光集成电路; 更具体地，涉及一种能够以有效的方式容纳光波导，光学器件，例如发光器件和光接收器件以及光纤的改进的混合光学集成电路的制备方法。 本发明的优点在于使SOI波导肋区域，V槽蚀刻窗口和对准标记之间的水平偏移误差最小化，通过在单个衬底上被动地对准波导，光学器件和光纤来降低制造成本 。 此外，本发明通过提供能够用作波导两端的防反射涂层的LPCVD氮化硅层，具有减少菲涅尔反射损失的效果。

    Liquid crystal display modules and holding assemblies applied to the same
    7.
    发明授权
    Liquid crystal display modules and holding assemblies applied to the same 有权
    液晶显示模块和保持组件应用于此

    公开(公告)号：US06504586B1

    公开(公告)日：2003-01-07

    申请号：US09300483

    申请日：1999-04-28

    申请人： Sang-hwan Lee

    发明人： Sang-hwan Lee

    IPC分类号： G02F11333

    CPC分类号： G02F1/13452 ,  G02F2001/133334

    摘要： A liquid crystal display (LCD) module and a holding assembly applied to the LCD module is disclosed. In the present invention, a holder is electrically connected to an earth terminal of a printed circuit board (PCB) and a top chassis so that an electromagnetic wave exhaust passage can be formed. Thereby, the electromagnetic wave emitted from the PCB is exhausted through the top chassis. In addition, when the sheets are settled in a mold frame, the holder is inserted into a holding opening of the mold frame so that the sheets can be stably held and the sheets can be prevented from moving in advance. In this case, the holder can serve the typical electromagnetic wave exhausting function and sheet fixing function. Accordingly, there is no need to use a fixing tape for fixing the sheets. Therefore, wrinkling phenomena occurring on the surfaces of the sheets can be prevented in advance.

    摘要翻译： 公开了一种液晶显示器（LCD）模块和应用于LCD模块的保持组件。 在本发明中，保持器电连接到印刷电路板（PCB）和顶部底盘的接地端子，从而可以形成电磁波排出通道。 因此，从PCB发出的电磁波通过顶部底盘排出。 此外，当片材沉积在模架中时，保持器插入到模架的保持开口中，使得片材能够被稳定地保持，并且可以预防片材的移动。 在这种情况下，保持器可以用于典型的电磁波排出功能和片材固定功能。 因此，不需要使用用于固定片材的固定带。 因此，可以预先防止在纸张表面上发生的起皱现象。

    Method for manufacturing self-aligned optic fiber-optic element coupling device
    9.
    发明授权
    Method for manufacturing self-aligned optic fiber-optic element coupling device 失效
    制造自对准光纤元件耦合器件的方法

    公开(公告)号：US5641612A

    公开(公告)日：1997-06-24

    申请号：US556544

    申请日：1995-11-28

    申请人： Sang-Hwan Lee ,  Gwan-Chong Joo ,  Hong-Man Kim ,  Dong-Goo Kim

    发明人： Sang-Hwan Lee ,  Gwan-Chong Joo ,  Hong-Man Kim ,  Dong-Goo Kim

    IPC分类号： G02B6/42 ,  H01L33/36 ,  H01L33/44 ,  H01L33/62 ,  H01S5/00

    CPC分类号： G02B6/4232

    摘要： A method for manufacturing self-aligned optic fiber-optic element coupling devices is described. The method comprises the steps of forming a first insulating film on a silicon substrate, forming metal pads on the first insulating film to have a predetermined separation distance, forming a second insulating film on the first insulating film and the metal pads, forming a photosensitive film to have first openings and a second opening, the first openings positioned on the metal pads with the metal pads partially covered with the second insulating films and the second opening positioned between the first openings on the first and second insulating films and extended to a side of the silicon substrate, removing the first and second insulating films exposed by the first and second openings using the photosensitive film as mask to exposure the silicon substrate and the metal pads, removing the photosensitive film, forming a V-shape groove in the exposed portion of the silicon substrate using the first and second insulating films as etching mask, and forming solder bumps on the metal pads.

    摘要翻译： 描述了一种制造自对准光纤元件耦合器件的方法。 该方法包括以下步骤：在硅衬底上形成第一绝缘膜，在第一绝缘膜上形成预定分隔距离的金属焊盘，在第一绝缘膜和金属焊盘上形成第二绝缘膜，形成感光膜 具有第一开口和第二开口，第一开口位于金属垫上，金属垫部分地被第二绝缘膜覆盖，第二开口位于第一绝缘膜和第二绝缘膜上的第一开口之间并延伸到 使用感光膜作为掩模去除由第一和第二开口暴露的第一和第二绝缘膜，以暴露硅衬底和金属衬垫，去除感光膜，在曝光部分中形成V形槽 使用第一和第二绝缘膜作为蚀刻掩模的硅衬底，以及在金属焊盘上形成焊料凸块 。