Planar circuit optimization
    1.
    发明授权
    Planar circuit optimization 有权
    平面电路优化

    公开(公告)号:US07261982B2

    公开(公告)日:2007-08-28

    申请号:US10736295

    申请日:2003-12-15

    IPC分类号: G03F1/00 G03C5/00

    CPC分类号: G03F7/70466 G03F1/50 G03F1/70

    摘要: The present application relates to a method of fabricating planar circuits using a photo lithographic mask set, to the photo lithographic mask set, and to a planar circuit fabricated with the photo lithographic mask set. The instant invention involves separating a photo lithographic mask into two parts, namely, a master mask and one or more slave masks. The master mask and the one or more slave masks form a photo lithographic mask set that is used iteratively to fabricate the planar circuits. In particular, the master mask is used as a template to provide the general layout for the planar circuit, while each slave mask is varied to tune and/or tailor the planar circuit. Since only a small portion of the planar circuit is redesigned and/or rewritten as a new mask (i.e., the slave mask), the instant invention provides a simple and cost effective method for optimizing planar circuits. Furthermore, since most mask errors will originate from the master mask, the instant invention provides an efficient method of correcting errors on planar circuits using the one or more slave masks.

    摘要翻译: 本申请涉及使用光刻掩模组,光刻掩模组以及用光刻掩模组制造的平面电路制造平面电路的方法。 本发明涉及将光刻掩模分为两部分,即主掩模和一个或多个从属掩模。 主掩模和一个或多个从属掩模形成用于迭代地制造平面电路的光刻掩模组。 特别地,主掩模用作模板以提供用于平面电路的总体布局,而每个从屏蔽被改变以调谐和/或定制平面电路。 由于只有一小部分平面电路被重新设计和/或重写为新的掩模(即,从属掩模),本发明提供了一种用于优化平面电路的简单且成本有效的方法。 此外,由于大多数掩模错误将源自主掩模,本发明提供了使用一个或多个从属掩码来校正平面电路上的误差的有效方法。

    Method of releasing devices from a substrate
    3.
    发明授权
    Method of releasing devices from a substrate 失效
    从基板释放装置的方法

    公开(公告)号:US06905616B2

    公开(公告)日:2005-06-14

    申请号:US10382562

    申请日:2003-03-05

    CPC分类号: B81C1/00952

    摘要: Micro devices are formed in situ in a high density in a substrate comprising a masked silicon layer over a stop layer of a silicon compound, by anisotropically etching the desired feature in the silicon layer, overetching to form a notch at the silicon-stop layer interface, depositing a protective fluorocarbon polymer layer on the sidewalls and bottom of the etched silicon layer, and isotropically etching to separate the etched feature from the stop layer. This method avoids the problems of stiction common in other methods of forming micro devices.

    摘要翻译: 通过各向异性地蚀刻硅层中的所需特征,在基底上形成微孔器件,在衬底上形成掩模硅层,通过各向异性蚀刻硅层中的所需特征,过蚀刻以在硅 - 停止层界面处形成缺口 ,在蚀刻硅层的侧壁和底部上沉积保护性碳氟聚合物层,并进行各向同性蚀刻以将蚀刻的特征与停止层分离。 这种方法避免了在其他形成微器件的方法中常见的静电问题。

    Planar lightwave circuit variable optical attenuator
    5.
    发明授权
    Planar lightwave circuit variable optical attenuator 有权
    平面光波电路可变光衰减器

    公开(公告)号:US07162108B2

    公开(公告)日:2007-01-09

    申请号:US11015223

    申请日:2004-12-17

    摘要: The invention relates to a variable optical attenuator constructed as a Mach Zehnder planar lightwave circuit, particularly including a channel waveguide support structure for heat isolation and stress relief to reduce polarization dependent loss (PDL) and power consumption in the device. Power reduction trenches comprise longitudinal segments having small stress relief pillars of cladding material left in between them in the etching process. The waveguides of the MZI are supported by a main pillar structure and integral stress relief pillars which remain after removal of the trenches. The waveguide is surrounded by air on three sides for improved heat isolation. The performance of the present invention shows substantial improvement in PDL and extinction ratio over the prior art continuous trench design, and also, to a smaller degree, over the case where power reduction trenches are not used at all. Segmented trenches appear to allow for the lowest stress on the two waveguide arms of all the cases including no trench and trenched devices.

    摘要翻译: 本发明涉及一种构成马赫曾德平面光波回路的可变光衰减器,特别是包括用于隔热和应力释放的通道波导支撑结构,以减少器件中的偏振相关损耗(PDL)和功耗。 功率减小沟槽包括在蚀刻工艺中在它们之间具有小的应力消除柱的包层材料的纵向段。 MZI的波导由主柱结构和消除沟槽后保留的积分应力消除柱支撑。 波导三面被空气包围,以改善热隔离。 与现有技术的连续沟槽设计相比,本发明的性能显示出PDL和消光比的显着改善,并且在更少的程度上,在完全不使用功率降低沟槽的情况下。 分段沟槽似乎允许在所有情况下的两个波导臂上的最小应力,包括没有沟槽和沟槽的器件。