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    Lid attachment mechanism
    4.
    发明授权
    Lid attachment mechanism 有权
    盖附件机构

    公开(公告)号：US07860599B2

    公开(公告)日：2010-12-28

    申请号：US11693156

    申请日：2007-03-29

    申请人： Seah Sun Too

    发明人： Seah Sun Too

    IPC分类号： G06F19/00

    CPC分类号： H01L21/50 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/16152

    摘要： Apparatus and methods for assembling semiconductor chips packages are provided. In one aspect, a method of manufacturing is provided that includes placing a first set of semiconductor chip package substrates in a first group of receptacles of a first processing station. Each of the first set of semiconductor chip package substrates has a first footprint. The receptacles of the first group being dimensioned to accommodate the first footprint. A second set of semiconductor chip package substrates is placed in a second group of receptacles of the first processing station. Each of the second set of semiconductor chip package substrates has a second footprint larger than the first footprint. The receptacles of the second group being dimensioned to accommodate the second footprint. A first set of lids is placed on the first set of semiconductor chip package substrates and a second group of lids is placed on the second set of semiconductor chip package substrates.

    摘要翻译： 提供了用于组装半导体芯片封装的装置和方法。 一方面，提供一种制造方法，其包括将第一组半导体芯片封装衬底放置在第一处理站的第一组插座中。 第一组半导体芯片封装衬底中的每一个具有第一覆盖区。 第一组的容器的尺寸被设计成适应第一印迹。 第二组半导体芯片封装基板被放置在第一处理站的第二组插座中。 第二组半导体芯片封装衬底中的每一个具有大于第一覆盖区的第二覆盖区。 第二组的容器的尺寸被设计成适应第二印迹。 将第一组盖放置在第一组半导体芯片封装基板上，将第二组盖放置在第二组半导体芯片封装基板上。

    Fixture suitable for use in coupling a lid to a substrate and method
    6.
    发明授权
    Fixture suitable for use in coupling a lid to a substrate and method 失效
    适用于将盖子连接到基板上的夹具和方法

    公开(公告)号：US06870258B1

    公开(公告)日：2005-03-22

    申请号：US10458802

    申请日：2003-06-16

    申请人： Seah Sun Too

    发明人： Seah Sun Too

    IPC分类号： H01L21/50 ,  H01L23/12

    CPC分类号： H01L21/50 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/00

    摘要： A fixture suitable for coupling a lid to a substrate having a semiconductor chip coupled thereto and a method for coupling the lid to the substrate. A support structure has a cavity having a floor and a pedestal protruding from the floor. A guide extends from the support structure. A compression mechanism is coupled to the guide wherein the compression mechanism includes an actuator plate coupled to a compression plate by a compressible means. An actuator is coupled to the compression mechanism. A packaging substrate having a semiconductor chip is mounted to the packaging substrate and a lid is mounted over the semiconductor chip to form a semiconductor component. The semiconductor component is placed on a support structure and the actuator is activated to urge the compression plate to apply a uniform force against the lid.

    摘要翻译： 一种适于将盖子耦合到具有耦合到其上的半导体芯片的基板的固定器以及用于将盖子耦合到基板的方法。 支撑结构具有具有从地板突出的地板和基座的空腔。 指南从支撑结构延伸。 压缩机构联接到引导件，其中压缩机构包括通过可压缩装置联接到压缩板的致动器板。 致动器联接到压缩机构。 具有半导体芯片的封装基板安装在封装基板上，盖子安装在半导体芯片上以形成半导体部件。 半导体部件被放置在支撑结构上，致动器被致动以促使压缩板对盖子施加均匀的力。

    Integrated circuit socket
    8.
    发明授权
    Integrated circuit socket 有权
    集成电路插座

    公开(公告)号：US08297986B2

    公开(公告)日：2012-10-30

    申请号：US11687529

    申请日：2007-03-16

    申请人： Seah Sun Too ,  Raj N. Master ,  Jacquana Diep ,  Mohammad Khan

    发明人： Seah Sun Too ,  Raj N. Master ,  Jacquana Diep ,  Mohammad Khan

    IPC分类号： H01R12/00

    CPC分类号： H01L23/433 ,  H01L23/467 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/16152 ,  H01L2924/3511 ,  H01R12/7076 ,  H05K7/1061 ,  H01L2224/0401

    摘要： Various sockets for packaged integrated circuits and methods of making the same are provided. In one aspect, a method of mounting a semiconductor chip is provided that includes providing a package that has a base substrate with a first side and a second side opposite the first side. The second side has a central region. The package includes a semiconductor chip and a lid coupled to the first side. A socket is provided for receiving the base substrate. The socket includes a mound that projects toward the second side of the base substrate when the base substrate is seated in the socket to provide support for the central region of the base substrate. The package is mounted in the socket. The mound provides support for the central region of the base substrate.

    摘要翻译： 提供了用于封装集成电路的各种插座及其制造方法。 一方面，提供了一种安装半导体芯片的方法，其包括提供具有第一侧和与第一侧相对的第二侧的基底的封装。 第二边有一个中部地区。 该封装包括半导体芯片和连接到第一侧的盖子。 提供了用于接收基底的插座。 插座包括当基底座位于插座中时朝向基底基板的第二侧突出的墩，以为基底基板的中心区域提供支撑。 包装安装在插座中。 土丘为基底的中心区域提供支撑。