公开(公告)号：US06979165B2

公开(公告)日：2005-12-27

申请号：US10292147

申请日：2002-11-12

申请人： Robert E. Larson ,  Sean D. Simondet ,  David C. Zimmerman ,  Todd K. Maciej ,  Quirin W. Matthys

发明人： Robert E. Larson ,  Sean D. Simondet ,  David C. Zimmerman ,  Todd K. Maciej ,  Quirin W. Matthys

IPC分类号： B65G49/07 ,  H01L21/00 ,  H01L21/02 ,  H01L21/304 ,  H01L21/677 ,  B65H1/00

CPC分类号： H01L21/67161 ,  H01L21/67167 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67196 ,  H01L21/67769 ,  H01L21/67781 ,  Y10S414/138 ,  Y10S414/139 ,  Y10S414/141

摘要： The present invention provides tools and methods of processing microelectronic substrates in which the tools maintain high throughput yet have dramatically lower footprint than conventional tools. In preferred aspects, the present invention provides novel tool designs in which multiple tool functions are overlapped in the x, y, and/or z axes of the tool in novel ways.

摘要翻译： 本发明提供了处理微电子基板的工具和方法，其中工具保持高通量，但具有比传统工具显着更低的占地面积。 在优选方面，本发明提供了新颖的工具设计，其中多种工具功能以新颖的方式在工具的x，y和/或z轴上重叠。

公开(公告)号：US07134827B2

公开(公告)日：2006-11-14

申请号：US10952506

申请日：2004-09-28

申请人： Robert E. Larson ,  Sean D. Simondet ,  David C. Zimmerman ,  Todd K. Maciej ,  Quirin W. Matthys

发明人： Robert E. Larson ,  Sean D. Simondet ,  David C. Zimmerman ,  Todd K. Maciej ,  Quirin W. Matthys

IPC分类号： B65G65/34

CPC分类号： H01L21/67161 ,  H01L21/67167 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67196 ,  H01L21/67769 ,  H01L21/67781 ,  Y10S414/138 ,  Y10S414/139 ,  Y10S414/141

摘要： The present invention provides tools and methods of processing microelectronic substrates in which the tools maintain high throughput yet have dramatically lower footprint than conventional tools. In preferred aspects, the present invention provides novel tool designs in which multiple tool functions are overlapped in the x, y, and/or z axes of the tool in novel ways.

公开(公告)号：US06822413B2

公开(公告)日：2004-11-23

申请号：US10391306

申请日：2003-03-18

申请人： Sean D. Simondet

发明人： Sean D. Simondet

IPC分类号： B25J1502

CPC分类号： H01L21/67766 ,  B25J9/1692 ,  B25J19/025 ,  H01L21/67265 ,  H01L21/67769 ,  H01L21/67778

摘要： Robot system incorporates a versatile end effector that can be used to transport wafers, map wafers, and autocalibrate the movements of the robotic system. Typically, the end effector of the invention is rotatably and/or pivotably coupled to a robotic arm and includes an optical sensor system whose light path preferably includes a directional component that extends along a lengthwise axis of the end effector. Preferably the end effector is independently movable about at least two axes. These characteristics, singly or in combination, allow the end effector to carry out transport, mapping, and autocalibration functions within a relatively small volume either horizontally, vertically, or at other desired orientations.

摘要翻译： 机器人系统结合了多功能的末端执行器，可用于运输晶片，映射晶片，并自动校准机器人系统的运动。 通常，本发明的末端执行器可旋转地和/或可枢转地耦合到机器臂并且包括光学传感器系统，其光路优选地包括沿着端部执行器的纵向轴线延伸的方向分量。 优选地，末端执行器可以围绕至少两个轴线独立地移动。 这些特征，单独或组合地允许末端执行器在水平，垂直或其他期望取向的相对较小的体积内进行运输，映射和自动校准功能。