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    CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
    3.
    发明申请
    CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF 有权
    陶瓷电子元件及其制造方法

    公开(公告)号：US20130107420A1

    公开(公告)日：2013-05-02

    申请号：US13287253

    申请日：2011-11-02

    申请人： Kiyoyasu SAKURADA ,  Kota ZENZAI ,  Hisayoshi OMORI ,  Takashi KANAYAMA ,  Shinji OTANI ,  Naoki SHIMIZU ,  Seiji KATSUTA

    发明人： Kiyoyasu SAKURADA ,  Kota ZENZAI ,  Hisayoshi OMORI ,  Takashi KANAYAMA ,  Shinji OTANI ,  Naoki SHIMIZU ,  Seiji KATSUTA

    IPC分类号： H01G4/12 ,  H01G4/00

    CPC分类号： H01G4/2325 ,  H01G4/12 ,  H01G4/30

    摘要： A ceramic electronic component includes a ceramic body and an outer electrode. The outer electrode is disposed on the ceramic body. The outer electrode includes a first conductive layer and a second conductive layer. The first conductive layer includes a resin, a first metal component, and a second metal component having a higher melting point than the first metal component. The second conductive layer is disposed on the first conductive layer. The second conductive layer is includes a plating film. An alloy particle containing the first metal component and the second metal component protrudes to the second conductive layer side from a surface of the first conductive layer.

    摘要翻译： 陶瓷电子部件包括陶瓷体和外部电极。 外部电极设置在陶瓷体上。 外电极包括第一导电层和第二导电层。 第一导电层包括树脂，第一金属组分和具有比第一金属组分更高的熔点的第二金属组分。 第二导电层设置在第一导电层上。 第二导电层包括镀膜。 含有第一金属成分和第二金属成分的合金粒子从第一导电层的表面突出到第二导电层侧。

    CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
    5.
    发明申请
    CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF 有权
    陶瓷电子元件及其制造方法

    公开(公告)号：US20130107421A1

    公开(公告)日：2013-05-02

    申请号：US13287276

    申请日：2011-11-02

    申请人： Kota ZENZAI ,  Hisayoshi OMORI ,  Takashi KANAYAMA ,  Kiyoyasu SAKURADA ,  Naoki SHIMIZU ,  Seiji KATSUTA ,  Shinji OTANI

    发明人： Kota ZENZAI ,  Hisayoshi OMORI ,  Takashi KANAYAMA ,  Kiyoyasu SAKURADA ,  Naoki SHIMIZU ,  Seiji KATSUTA ,  Shinji OTANI

    IPC分类号： H01G4/12 ,  H01G4/00

    CPC分类号： H01G4/30 ,  H01G4/005 ,  H01G4/012 ,  H01G4/12 ,  H01G4/248 ,  H01G4/252 ,  H01G13/006 ,  H05K3/1283 ,  H05K3/4664

    摘要： A ceramic body includes an inner electrode disposed inside the ceramic body and in which an end portion of the inner electrode extends to a surface of the ceramic body. An electrode layer is formed on the surface of the ceramic body so as to cover the end portion of the inner electrode, the electrode layer including a resin, a first metal filler that contains a first metal component, and a second metal filler that contains a second metal component having a higher melting point than the first metal component. A step of heating the electrode layer is performed to form an electrode including a metal layer that is located on the surface of the ceramic body and that includes the first and second metal components and a metal contained in the inner electrode.

    摘要翻译： 陶瓷体包括设置在陶瓷体内部的内部电极，内部电极的端部延伸到陶瓷体的表面。 在陶瓷体的表面上形成电极层，以覆盖内部电极的端部，包括树脂的电极层，含有第一金属成分的第一金属填料和含有第一金属成分的第二金属填料 具有比第一金属成分高的熔点的第二金属成分。 进行加热电极层的步骤，以形成包括位于陶瓷体表面上并且包括第一和第二金属成分的金属层的电极和内部电极中所含的金属。