DISPLAY DEVICE
    2.
    发明申请
    DISPLAY DEVICE 有权
    显示设备

    公开(公告)号:US20080316382A1

    公开(公告)日:2008-12-25

    申请号:US12099202

    申请日:2008-04-08

    申请人: Setsuko Sato

    发明人: Setsuko Sato

    IPC分类号: G06F3/038 G02F1/133 G09G5/00

    摘要: Disclosed is a display device including: a display panel on which a plurality of driver chips are mounted by using a COG configuration; a signal substrate on which a timing controller for generating a differential signal inputted into each of the driver chips is formed; and a connecting substrate which connects the plurality of driver chips with the timing controller, wherein the connecting substrate includes a first connecting substrate on which a first line for inputting the differential signal into a driver chip excluding a driver chip located at a terminating area is formed and a second connecting substrate on which a second line for inputting the differential signal into the driver chip located at the terminating area, and wherein a termination resistor connects the second line for transmitting the differential signal which is formed on the second connecting substrate.

    摘要翻译: 公开了一种显示装置,包括:显示面板,通过使用COG配置在其上安装多个驱动器芯片; 信号基板,其上形成有用于产生输入到每个驱动器芯片的差分信号的定时控制器; 以及将所述多个驱动器芯片与所述定时控制器连接的连接基板,其中,所述连接基板包括第一连接基板,在所述第一连接基板上形成用于将所述差分信号输入到除了位于终端区域的驱动器芯片之外的驱动器芯片的第一线路 以及第二连接基板,在其上具有用于将差分信号输入到位于终端区域的驱动器芯片的第二线路,并且其中终端电阻器连接用于传输形成在第二连接基板上的差分信号的第二线路。

    RESIN- METAL BONDED BODY AND METHOD FOR PRODUCING THE SAME
    3.
    发明申请
    RESIN- METAL BONDED BODY AND METHOD FOR PRODUCING THE SAME 审中-公开
    金属粘结体及其制造方法

    公开(公告)号:US20100279108A1

    公开(公告)日:2010-11-04

    申请号:US12733243

    申请日:2008-12-15

    IPC分类号: B32B15/08 B32B37/24

    摘要: Disclosed is a resin-metal bonded body of an aluminum metal member and a thermoplastic resin member, which has improved bonding strength and good durability. Also disclosed is a method for producing such a resin-metal bonded body. Specifically disclosed is a resin-metal bonded body which is obtained by bonding an aluminum metal member with a thermoplastic resin member. In this resin-metal bonded body, the aluminum metal member and the thermoplastic resin member are bonded together by an anodic oxide coating having a film thickness of 70-1500 nm or an anodic oxide coating having a triazine thiol in the inner and upper portions. The anodic oxide coating has an infrared absorption spectrum peak intensity ascribed to OH group at 0.0001-0.16.

    摘要翻译: 公开了一种铝金属构件和热塑性树脂构件的树脂金属接合体,其具有改善的接合强度和良好的耐久性。 还公开了一种用于制造这种树脂 - 金属粘结体的方法。 具体公开了通过将铝金属构件与热塑性树脂构件接合而获得的树脂金属接合体。 在该树脂金属接合体中,铝膜和热塑性树脂构件通过膜厚为70〜1500nm的阳极氧化物涂层或在内部和上部具有三嗪硫醇的阳极氧化物涂层粘接在一起。 阳极氧化物涂层具有归属于OH基团的红外吸收光谱峰强度,为0.0001-0.16。

    Display device wherein a termination resistor is formed on a second connecting substrate
    5.
    发明授权
    Display device wherein a termination resistor is formed on a second connecting substrate 有权
    在第二连接基板上形成终端电阻的显示装置

    公开(公告)号:US07705953B2

    公开(公告)日:2010-04-27

    申请号:US12099202

    申请日:2008-04-08

    申请人: Setsuko Sato

    发明人: Setsuko Sato

    IPC分类号: G02F1/1345

    摘要: Disclosed is a display device including: a display panel on which a plurality of driver chips are mounted by using a COG configuration; a signal substrate on which a timing controller for generating a differential signal inputted into each of the driver chips is formed; and a connecting substrate which connects the plurality of driver chips with the timing controller, wherein the connecting substrate includes a first connecting substrate on which a first line for inputting the differential signal into a driver chip excluding a driver chip located at a terminating area is formed and a second connecting substrate on which a second line for inputting the differential signal into the driver chip located at the terminating area, and wherein a termination resistor connects the second line for transmitting the differential signal which is formed on the second connecting substrate.

    摘要翻译: 公开了一种显示装置,包括:显示面板,通过使用COG配置在其上安装多个驱动器芯片; 信号基板,其上形成有用于产生输入到每个驱动器芯片的差分信号的定时控制器; 以及将所述多个驱动器芯片与所述定时控制器连接的连接基板,其中,所述连接基板包括第一连接基板,在所述第一连接基板上形成用于将所述差分信号输入到除了位于终端区域的驱动器芯片之外的驱动器芯片的第一线路 以及第二连接基板,在其上具有用于将差分信号输入到位于终端区域的驱动器芯片的第二线路,并且其中终端电阻器连接用于传输形成在第二连接基板上的差分信号的第二线路。